JPS6247146A - Chip separating device - Google Patents

Abstract

PURPOSE:To readily separate a prescribed chip without influence to other chips by emitting light only to the area of an adhesive tape corresponding to the chip to be lifted before lifting, thereby weakening a bonding force. CONSTITUTION:A cylinder 12 is intermittently moved and stopped directly under a chip 2 for 1-3sec. An ultraviolet ray 17 is projected to emit only the area 9a of a tape 9 corresponding to the bottom of the chip 2 to be lifted through a window 15a of a mask 15 through a quartz piston 14 during this period, thereby reducing a bonding force. The piston 14 moves up and down once during the stopping period to lift only the chip 2 above the area 9a through the area 9a. The other chip 2 is secured to the tape 9, attracted in vacuum onto a cylinder 10, and only one chip is picked up by a nozzle 7 without influence to the other.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a device for separating chips into chips, which is one of integrated circuit manufacturing devices.

(Prior art and its problems) When cutting and separating a wafer into chips, a diamond blade or the like is used to cut an area called a dicing line 3, which is provided between the depths 2 and 2, as shown in Fig. 4. This is done by doing this. that time,
If the cut chips are scattered, it will be difficult to position them for the next mounting.
As shown in FIG. 5, an adhesive tape 4 is pasted on the back side of the wafer 1 in advance, and dicing is performed with a blade 5. After that, the depths 2 are pushed up one by one from the back side of the adhesive tape 4 with a push-up pin 6. The adhesive tape 4 is then separated, and the separated chips 2 are vacuum-adsorbed using a big nozzle 7 and fixed to a predetermined position on the lead frame.

By the way, when pushing up the chip 2, the depth 2 cannot be separated from the adhesive tape unless the adhesive force of the adhesive tape 4 is weakened. ing.

One method is to weaken the adhesive force by opening the tape holder 8 that supports the adhesive tape 4 on the outside of the wafer 1 as shown by arrow A and stretching the adhesive tape 4, as shown in FIG. It's something to do. however,
When stretching is performed, the elongation rate of the adhesive tape 4 varies depending on the location, so the arrangement of the chips 2 becomes meandering and becomes irregular, making it impossible to feed the thrust pins 6 at a constant pitch. cause problems. Furthermore, as the chip size increases, the bonding area increases, so even slight stretching reduces the bonding strength to a considerable extent, and this method is ineffective.

Therefore, a method using an adhesive tape called UV tape, which hardens and loses its adhesive strength when exposed to light, usually ultraviolet light, has become widely used.
-)"C. This method is shown in Figure 7,
UV tape 9 affixed to the back side of T-Ha 1 is irradiated with ultraviolet rays 10 on almost the entire surface (black painted part) to maintain its adhesive strength and then pierced. It is. However, since the chips 1 and 2 are connected to each other at the χI remaining part 11 of dicing,
Almost all of the adhesion of the UV tape 9 has decreased, and both the raised depths 2 and 5 are lifted up by the adjacent depths 2 and 5, making it impossible to completely separate them. There are problems such as the structure collapsing.

[Purpose of the invention]

The present invention has been made in view of the above, and proposes a chip 11111 device that can easily separate only a certain chip when pushing up a certain chip from a diced wafer without affecting other chips at all. "I" (to aim to do something)

(Summary of the Invention) In order to achieve the objects stated in (-), the present invention provides a method for protruding chips from a diced wafer with an adhesive tape attached to the surface of the wafer, which has a reduced surface resistance when irradiated with light. increase! ! At position i, light is irradiated only to the region of the adhesive tape corresponding to the chip to be pushed up immediately before pushing up.

〔Example〕

The present invention will be explained below with reference to the embodiments shown in FIGS. 1 to 3.

FIG. 1 is a side view, partially in cross section, showing an embodiment of a chip separation device according to the present invention.

As shown in the figure, a UV tape 9 is placed on the back side of the wafer 1.
is attached, and this UV tape 9 is horizontally supported by a tape holder 8 outside the wafer 1. wafer 1
has already been diced, and the chips 2 are interconnected with only the thin remaining portions 11.

A big nozzle 7 is provided outside the wafer 1 to pick up the chips 2 pushed up by vacuum suction.
A cylinder 12 for pushing up the chip 2 is arranged below with its upper end in contact with the lower surface of the UV tape 9. A link mechanism 13 is provided inside the cylinder 12.
C-1 - There is a screw 14 made of quartz that is moved downward, and a projecting pin 6 with its tip facing upward is fixed to the upper part of the screw 1 to screw 14. The cylinder 12 is intermittently moved in the horizontal direction by a drive device (not shown) at a pitch corresponding to the dimensions of the depths 2, and is stopped directly below each depth 2 for a predetermined period of time. During this stop, the piston 14 moves downward once in the cylinder 12, causing the protruding pin 6 to protrude from the upper end of the pin cylinder 12 and pushing up the tip 2 through the UV tape 9.

A mask 15 is attached to one end of the cylinder 12. FIG. 2 is a plan view of the mask 15, and as shown in the figure, the mask 15 has an opening 15 at a portion fRI'jA corresponding to the bottom surface of the chip 2 to be pushed up, which is indicated by a broken line.
The projecting pin 6 enters and exits through this opening 15a. A plurality of tape holding holes 15b are provided around the opening 15a for adsorbing the UV tape 9 by vacuum suction during pushing up. The vacuum suction is applied through a suction hole 16 formed in the side wall of the cylinder 12 while the cylinder 12 is at rest.

A lamp room 18 housing an ultraviolet lamp 17 is connected to the end of the cylinder 12 . The ultraviolet lamp 17 in this lamp room 18 is connected to the power supply only during each stop period of the cylinder 12, and the ultraviolet rays are emitted from the rear of the projecting pin 6.
J, which shoots 0, looks like a sea urchin.

Next, the operation of the above embodiment will be explained.

The cylinder 12 moves horizontally intermittently! 2 chips each
It usually stops for about 1/3 seconds, which is the time required for uplifting directly below. During the period when the cylinder 12 is stopped, the ultraviolet lamp 17 emits ultraviolet rays 10, which pass through the quartz screw 1/I, pass through the opening 15a of the mask 15, and project into the bevel depth 2. Only the region 9a of the UV tape 9 corresponding to the bottom surface is irradiated. Therefore, the adhesive only in this portion 9a hardens, and the adhesive strength decreases. FIG. 3 is a diagram showing the low adhesive strength of a general UV tape 9 when exposed to ultraviolet rays. Curve a in the figure shows an 80W ultraviolet lamp at a distance of 100 mm from the IJ V tape.
The figure below shows that the adhesion is reduced to about 10% of the value before irradiation with an irradiation time of 0.5 seconds.3 In the above example, the UV tape was The culm with 9 is 50-60mm.
α, so the 80W ultraviolet lamp 17
When using 0.2=0.3 after starting light 0/1
The adhesive force is sufficiently reduced in about seconds 1, and while the cylinder 12 is stopped, the screws 1 to 17'I are screwed down once, and the protruding pin 6 reduces the contact force of LJV7-B9. V4 the part 9a that you left and hit only the depth 2 of that -L, and get J=. At this time, the other depths 2 were firmly adhered to the UV tape 9, and this tJV tape 9 was adsorbed to the upper end of the cylinder 10, so it was pushed up without affecting the other depths 2 at all. Only the depth 2 is separated from the LJV tape 9 and picked up by the pick nozzle 7. When this pickup is completed, the cylinder 12 is moved directly below the adjacent chip 2 and the same operation is repeated.

This J: is separated into two depths.

In the above embodiment, the ultraviolet lamp 17 is placed behind the ejection pin 6, but it is placed on the side of the ejection pin 6 and immediately before the cylinder 12 moves directly below the chip 2. The bottom surface of the depth 2 may be irradiated with ultraviolet rays. Alternatively, ultraviolet rays may be focused onto the bottom surface of one chip using a mask or an anti-rJ4 mirror.

(Effects of the Invention) As explained above, according to the present invention, light is irradiated only to the region of the adhesive tape corresponding to the chip to be pushed up immediately before the chip is pushed up, thereby weakening the adhesive force only in the said region. Therefore, it is possible to easily separate only the pushed-up chip without affecting other chips.

[Brief explanation of drawings]

Fig. 1 is a partially sectional side view showing the configuration of an embodiment of the depth separation device according to the present invention, and Fig. 2-2 shows the shape of the mask attached to the upper end of the cylinder of the same embodiment. Figure 3 is a diagram showing the decline in adhesive strength of a general <K LJ V tape when exposed to ultraviolet light Q, I and J:
Fig. 4 is a plan view showing the surface of the chip orientation device, Fig. 5 is a side view showing the basic configuration of the chip sorting device 1, and Fig. 6 and Fig. 7 are a side view showing the basic structure of the chip sorting device. Shows how to make a chip
It is a side view showing a part in cross section. 1...T-c, 2...chip, 6...uplifting pin, 9...UV tape, 9a...area of LJ V tape 9 corresponding to the bottom surface of chip 2 to be pushed up part, 10
...Ultraviolet light, 12...Cylinder, 13...Link mechanism, 14...Piston, 15...Mask, 15a
...Width of mask 15, 17...Ultraviolet lamp, 1
8... Lamp room. Applicant's Representative Sato - Male Shit Sora Yuihiki No. 1 Figure 2 Male Figure 3 Figure 5

Claims (1)

[Scope of Claims] 1. Light irradiation means for irradiating light onto the adhesive tape of a wafer to which an adhesive tape whose adhesive strength decreases when exposed to light irradiation has been pasted and diced; and a back surface of the adhesive tape. In the apparatus, the light irradiation means irradiates light only to a region of the adhesive tape corresponding to the chip to be pushed up just before the chip is pushed up. A chip separation device characterized by: 2. The light irradiation means corresponds to a light emitting device disposed behind the ejection pin, and a chip disposed between the light emitting device and the wafer and to be ejected by the ejection pin. The chip separation apparatus according to claim 1, further comprising a mask having an opening only in the region.