JPS6247143A - Wafer supplying apparatus - Google Patents

Abstract

PURPOSE:To preferably manage wafers at every lot by reading out information during feeding, sorting and feeding the wafers to corresponding wafer processors on the basis of the information. CONSTITUTION:A wafer W is removed by an arm 10 from a carrier 24, threads 20 are rotatably driven by a driver 22 to move in a direction of an arrow A. The wafer is emitted by an LED 46 during feeding, and the reflected light is focused through a lens 48 on an image sensor 50. Its output is input to a controller 52 to obtain the outer diameter, OF position and managing code of the wafer. When the arm 10 is rotatably driven by a driver 12 to shift to a tray 26, the tray 26 is rotatably driven by a driver 28 to match the OF position with the prescribed position. The controller 52 completes to select the outer diameter, and probe inspecting trays f30, 32 from the code until the matching is finished, and the arm 10 is fed from the tray 26 to suitable tray.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a wafer supply method for supplying semiconductor wafers to a wafer processing apparatus that performs necessary operations and processing such as inspection and processing of semiconductor wafers. It is related to the device.

[Background of the invention]

For example, there are multiple Ueno-Blowbar devices that perform all inspections by bringing a probe into contact with a semiconductor chip formed on a semiconductor wafer, and each prober device inspects a different type of semiconductor query. There are cases. In such a case, it is necessary to select and supply a blower device corresponding to each type of semiconductor wafer.

Therefore, when semiconductor wafers of different types are randomly sent to the blower device, it is necessary to accurately read the type of semiconductor wafer in order to accurately supply all the semiconductor wafers to the specified blower device.

[Purpose of the invention]

The present invention has been made in view of the above, and an object of the present invention is to provide a wafer supply device that can efficiently supply and manage the distribution of wafers to a wafer processing device for a wide variety of semiconductor wafers. That is.

[Summary of the invention]

The present invention provides a means for reading the wafer fj[of a wafer by a wafer information reading means while the wafer is being transferred by the wafer transfer means, when the wafers are supplied to a wafer processing apparatus provided for each type of wafer in a large number of wafers. The technical point is that the wafers are distributed and transferred to the corresponding wafer processing apparatus based on the wafer information.

〔Example〕

Embodiments of the present invention will be described below with reference to the accompanying drawings. An embodiment of the present invention is shown in FIG.
FIG. 2 shows a side view of the main parts.

1 and 2, there is a wafer moving means in the center, a wafer storage means on the left, a rotary pre-alignment means on the right, and a prober means in front and behind. t+, a reading optical system is arranged above the wafer moving means.

First, to explain the wafer moving means, the wafer supply arm 10 is provided with an arm rotation motor 12.
Fixed. That is, the wafer supply arm 10 is rotatable with respect to the moving stage 14 by the arm rotation motor 12.

The moving stage 14 is supported by a guide 18 supported by a frame 16 and a feed screw 20, and the feed screw 20 is connected to a slide motor 2 provided outside the frame 16.
2, the moving stage 14 slides in the direction of arrow A in the figure.

Next, the wafer storage means will be described. A wafer carrier 24 stores a plurality of wafers W of different types, for example, different sizes. This wafer carrier 24 is arranged in the direction of the arrow, which is the moving direction of the wafer supply arm 10.

Next, the rotational prealignment means will be explained.
7'l + alignment stage 26uθ rotation motor 2
8, it is rotatably attached.

Second, regarding the blower means, blower stages 30, 32 are provided on 1-)F stages 34 and 36, respectively. The X7 stages 34, 36 are configured to move in one direction by drive motors 38 and 40, respectively, and in the y direction by drive motors 42 and 44, respectively.

Next, the reading optical system will be explained. The solid-state light emitting device 46ij and the wafer supply arm 10 are the wafer carrier 24
It is placed above the part where the wafer W is taken out and transferred in the direction of the arrow, and the wafer W is being transferred by light.
The structure is such that the reflected light is incident on the one-dimensional image sensor 50 via the lens 48. The output of the image sensor 50 is manually controlled by a control device 52 which is formed by a computer or the like. A controller 52 processes the input signals and controls the blower stages 30 .
32 to which the wafer should be transferred.

Next, the overall operation of the above embodiment will be explained. First, the wafer W is taken out from the wafer carrier 24 by suction by the wafer supply arm 10, and is transferred to the 7-1 Mabria alignment stage 26 which maintains a planar shape tl. That is, when the slide motor 22 is driven,
The feed screw 20 rotates 1-5 and the moving stage 14 moves in the direction indicated by the arrow in FIG. As the moving stage 14 moves, the wafer supply arm 10 also moves.

During this movement, the 0 wafer W is illuminated by the solid state light emitting device 46. Although the solid-state light emitting device 46 is in a -dimensional form, since the wafer W moves, the wafer W is illuminated in a two-dimensional form. The light reflected by the wafer W forms an incident image on the image sensor 50 via the lens 48, and the output of the image sensor 50, where the artist on the wafer W is read, is input to the control device 52, and this input information causes the wafer W to be imaged. The outer diameter of the material, the position of the orientation flat, the management code, etc. are required.

On the other hand, in order to align the orientation flat of the wafer W to a predetermined position, the wafer W is placed on the pre-alignment stage 26.
put on. That is, the arm rotation motor 12 is driven to rotate the wafer 11 (feed r-arm 10, and the wafer W is transferred onto the rear alignment stage 26.Next, the θ rotation motor 28 is driven to transfer the wafer W onto the stage 26. rotates, and the orientation flat position of the wafer W is aligned at a predetermined position WtK.

By the time the alignment of this orientation flat position is completed r, σ,
The control device 52 obtains essential information such as the outer diameter of the wafer W, and in particular determines the position of the prober that should inspect the wafer W from the management code. In other words, the prober is
Different types of blowers are prepared for each blower stage 30, 32, and it is possible to control which blower the wafer ''-W taken out from the wafer carrier 24 is suitable for.
52 〇 Then, based on this judgment VC, the ueno supply arm 10
The 0 wafer W is applied from the pre-alignment stage 26 to the blow bus stage 3F1.32 (D) 4
sent. Furthermore, the dominant side;
, fc Ueno 1N is subjected to statistical processing 4 by a means not shown in the figure, and is used to fill in Uni...W'4.

According to the above theory 1i L/fr, VC, and this embodiment V, when a horizontal assembly of 24 types of semiconductor chips is carried out using two Zorova devices, no matter what order the wafers flow, it is possible to Prone compatible with Aiko VC: 6 @ VC
Note that the X invention is not limited to the above embodiments such as 11, and for example, more probes (using stages, waxing, etc.) can be used. Types of sea urchins... It may be possible to automatically sort them into the desired blowfish.Also,
In the above embodiment, an example is shown in which a prober device is used as the al waeno 1 processing apparatus, but the example may be a waeno 1 processing apparatus or the like.

〔Effect of the invention〕

As explained above, according to the present invention, even if many types of wafers are supplied at random, all the wafers can be transferred to the corresponding necessary A/2 wafer burying means, and
This has the effect that Ueno 1 can be well managed in lots at each store.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing one embodiment of the present invention, and FIG. 2 is a perspective view showing one embodiment of the present invention.
Formal parts of the device in the figure t Hoses and elevations 11 Shown in the figure O [Explanation of symbols of main parts] 10... Ueno) supply arm, 12... Arm rotation motor, 14... 1 Hyper-movement stage , 20... send r
) Screw, 22... Slide motor, 30.52...
・Prone stage, 46...Solid light emitting device, 50
...Image sensor, 52...Yu 11#--placement,
W-... Ueno S.

Claims (2)

[Claims] (1) A wafer supply device that supplies many types of wafers to a plurality of wafer processing devices provided corresponding to the types, the device including a wafer information reading means and a wafer transfer means, and the wafer information The reading means reads wafer information of the wafer during the wafer transfer by the wafer transfer means, and the wafer transfer means distributes and transfers the wafer to a selected wafer processing apparatus based on the wafer information by the wafer information reading means. A wafer supply device characterized by: (2) The wafer supply apparatus according to claim 1, wherein the wafer information reading means is a line sensor.