JPS6246295Y2 - - Google Patents
Info
- Publication number
- JPS6246295Y2 JPS6246295Y2 JP1982091191U JP9119182U JPS6246295Y2 JP S6246295 Y2 JPS6246295 Y2 JP S6246295Y2 JP 1982091191 U JP1982091191 U JP 1982091191U JP 9119182 U JP9119182 U JP 9119182U JP S6246295 Y2 JPS6246295 Y2 JP S6246295Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- printed wiring
- wiring board
- bonding
- thermocompression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 28
- 239000011889 copper foil Substances 0.000 claims description 28
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000004904 shortening Methods 0.000 description 1
Description
【考案の詳細な説明】
本考案は熱圧着工法によつて接合される印刷配
線板に関するもので、特に接続の不良発生を減少
させることを目的とする。[Detailed Description of the Invention] The present invention relates to a printed wiring board that is bonded by a thermocompression bonding method, and particularly aims to reduce the occurrence of connection failures.
従来、印刷配線板と印刷配線板を熱圧着工法に
よつて接合を行なう際、第１図にａに斜視図、ｂ
にそのＡ−A′断面図を示すように、印刷配線板
１，２の回路を形成している銅箔３，４上にあら
かじめ半田付けを行ない、銅箔３，４が向かい合
うように重ね合わせ、その上からヒータチツプ７
を押しつけて前記銅箔上の半田を溶融し、半田が
銅箔３，４間を接続した後ヒータチツプ７を除去
して銅箔３，４の電気的導通を図るものである。
その際、印刷配線板１，２の熱圧着を確実に行な
うために、ヒータチツプ７で押さえつける側の印
刷配線板１の平面度が必要であり、ベース剤が直
接、ヒータチツプに当たつて劣化しないように銅
箔４と同形状なる補強銅箔５を印刷配線板１のヒ
ータチツプ側に設けている。ただしこの銅箔５は
回路形成上、全く独立したものである。しかし、
第１図ｂに示すように、熱圧着機によつて印刷配
線板に圧力をかけた場合溶けた半田６はＦなる横
方向への力を受け、広がろうとし、隣の熱圧着部
と導通がおこり、銅箔間にシヨートが発生しやす
いという重大な欠点があつた。 Conventionally, when bonding printed wiring boards to printed wiring boards by thermocompression bonding method, Fig. 1 shows a perspective view and b.
As shown in the A-A' cross-sectional view, the copper foils 3 and 4 forming the circuits of the printed wiring boards 1 and 2 are soldered in advance, and the copper foils 3 and 4 are stacked so as to face each other. , Heater tip 7 from above
is pressed to melt the solder on the copper foil, and after the solder connects the copper foils 3 and 4, the heater chip 7 is removed to establish electrical continuity between the copper foils 3 and 4.
At that time, in order to ensure thermocompression bonding of the printed wiring boards 1 and 2, the printed wiring board 1 on the side pressed by the heater chip 7 must be flat, and the base material should not directly contact the heater chip and deteriorate. A reinforcing copper foil 5 having the same shape as the copper foil 4 is provided on the heater chip side of the printed wiring board 1. However, this copper foil 5 is completely independent in terms of circuit formation. but,
As shown in Fig. 1b, when pressure is applied to the printed wiring board by a thermocompression bonding machine, the melted solder 6 receives a force F in the lateral direction, tries to spread, and connects with the adjacent thermocompression bonding part. This method had a serious drawback in that conduction occurred and shorts were likely to occur between the copper foils.
そこで本考案はこれらの欠点を解消するもので
あり、第２図ａ，ｂにその一実施例を示して説明
する。 The present invention is intended to eliminate these drawbacks, and will be described with reference to an embodiment shown in FIGS. 2a and 2b.
本実施例では、ヒータチツプ７側の印刷配線板
８のヒータチツプ７に当たる補強銅箔９（裏側の
接続用の銅箔１０と同形状）に、印刷配線板８の
先端縁に略平行なスリツト１１をそれぞれ設けて
いる。このスリツト１１はまたヒータチツプ７と
も略平行であり、ヒータチツプ７の押圧位置と印
刷配線板８の先端縁との間に形成される。上記ス
リツト１１により分離された補強銅箔の先端部を
９ａとする。 In this embodiment, a slit 11 approximately parallel to the leading edge of the printed wiring board 8 is formed in the reinforcing copper foil 9 (same shape as the connection copper foil 10 on the back side) that corresponds to the heater chip 7 of the printed wiring board 8 on the heater chip 7 side. Each is provided. This slit 11 is also substantially parallel to the heater chip 7 and is formed between the pressed position of the heater chip 7 and the leading edge of the printed wiring board 8. The tip of the reinforcing copper foil separated by the slit 11 is designated 9a.
上記のように構成すれば、ヒータチツプ７によ
る熱圧着時に、半田６が銅箔３，４に沿つて広が
つて均等に圧力が加わるが、第２図ｂに示すよう
にスリツト１１によつて、このスリツト１１より
先端縁に近い補強銅箔の先端部９ａのある部分で
は、ヒータチツプ直下の補強銅箔９よりも下から
の力に弱く、半田６が印刷配線板８の先端部を下
から持ち上げるように働き、シヨートの発生に起
因する余分な半田を先端縁の方へ逃がしてやるこ
とが可能であり、その結果、シヨートの発生とい
う不良をなくすことができる。 With the above configuration, during thermocompression bonding by the heater chip 7, the solder 6 spreads along the copper foils 3 and 4 and pressure is applied evenly, but as shown in FIG. 2b, the slit 11 The tip 9a of the reinforcing copper foil, which is closer to the tip edge than the slit 11, is weaker against force from below than the reinforcing copper foil 9 directly below the heater chip, and the solder 6 lifts the tip of the printed wiring board 8 from below. As a result, the excess solder caused by the formation of shoots can be released toward the leading edge, and as a result, the defects caused by the formation of shoots can be eliminated.
上記実施例からも明らかなように本考案は、熱
圧着によつて接合される印刷配線板の一方の、熱
圧着部に接する補強銅箔に、その当接部と、印刷
配線板端部との間にスリツトを設けたことによ
り、熱圧着時に半田による圧力でスリツトを境に
印刷配線板が折れ曲がり溶融半田を逃がすことに
よつて接続用の銅箔間の半田によるシヨートを防
止でき、不良の発生を少なくすることができる実
用上効果の大きい印刷配線板を実現するものであ
る。 As is clear from the above embodiments, the present invention provides a reinforcing copper foil that is in contact with the thermocompression bonding portion of one of the printed wiring boards to be bonded by thermocompression bonding, and the contact portion and the end portion of the printed wiring board. By providing a slit between them, the printed wiring board bends across the slit due to the pressure of the solder during thermocompression bonding, allowing the molten solder to escape, thereby preventing solder shortening between the copper foils for connection, and reducing defects. The present invention is to realize a printed wiring board which is highly effective in practical use and can reduce generation.
第１図は従来の印刷配線板でａは斜視図、ｂは
Ａ−A′線断面図、第２図は本考案の一実施例を
示すものでａは斜視図、ｂは側面図である。
２……印刷配線板、３……銅箔、６……半田、
７……ヒータチツプ、８……印刷配線板、９……
補強銅箔、９ａ……先端部、１０……銅箔、１１
……スリツト。
Fig. 1 shows a conventional printed wiring board, in which a is a perspective view and b is a sectional view taken along the line A-A'. Fig. 2 shows an embodiment of the present invention, in which a is a perspective view and b is a side view. . 2...Printed wiring board, 3...Copper foil, 6...Solder,
7... Heater chip, 8... Printed wiring board, 9...
Reinforced copper foil, 9a...Tip, 10...Copper foil, 11
...Slit.
Claims (1)
れる接合銅箔を基材の下面に有し、その基材の上
面に熱圧着体に当接する補強銅箔を接合銅箔と同
形状に設け、この補強銅箔の前記熱圧着体との当
接部から基材先端までの間にスリツト状の銅箔切
断部を設け、熱圧着時に溶融半田の抗力により銅
箔切断部から折れ曲がるようにしたことを特徴と
する印刷配線板。 A bonding copper foil that faces the bonding copper foil of the other printed wiring board and is bonded by thermocompression is provided on the bottom surface of the base material, and a reinforcing copper foil that contacts the thermocompression bonded body is placed on the top surface of the substrate in the same shape as the bonding copper foil. A slit-shaped copper foil cut portion is provided between the contact portion of the reinforcing copper foil with the thermocompression bonding body and the tip of the base material, so that the copper foil is bent from the copper foil cut portion due to the drag force of molten solder during thermocompression bonding. A printed wiring board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982091191U JPS58193661U (en) | 1982-06-17 | 1982-06-17 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982091191U JPS58193661U (en) | 1982-06-17 | 1982-06-17 | printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58193661U JPS58193661U (en) | 1983-12-23 |
| JPS6246295Y2 true JPS6246295Y2 (en) | 1987-12-12 |
Family
ID=30099600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982091191U Granted JPS58193661U (en) | 1982-06-17 | 1982-06-17 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58193661U (en) |
-
1982
- 1982-06-17 JP JP1982091191U patent/JPS58193661U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58193661U (en) | 1983-12-23 |
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