JPS6245287U - - Google Patents
Info
- Publication number
- JPS6245287U JPS6245287U JP13795685U JP13795685U JPS6245287U JP S6245287 U JPS6245287 U JP S6245287U JP 13795685 U JP13795685 U JP 13795685U JP 13795685 U JP13795685 U JP 13795685U JP S6245287 U JPS6245287 U JP S6245287U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- recess
- pallet
- rectangular
- individual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
Landscapes
- Packaging Frangible Articles (AREA)
Description
第1図、第2図はこの考案の一実施例を示す断
面図で、第1図は板状体を重積する前の状態を、
第2図は重積した状態を示す。第3図は従来のI
C個装パレツトの一部を示す部分欠載平面図、第
4図は、第3図の―線断面図である。
図において1は板状体、2は方形凹部、4はI
C素子、5はそれの中央モールド部、6はリード
部、7はIC素子収納空間、8は台形凸部、9は
クツシヨン材である。図中同一符号は同一或は相
当部分を示す。
Figures 1 and 2 are cross-sectional views showing one embodiment of this invention, and Figure 1 shows the state before stacking the plate-like bodies.
FIG. 2 shows the stacked state. Figure 3 shows the conventional I
FIG. 4, which is a partially cut-out plan view showing a part of the C individual packaging pallet, is a sectional view taken along the line -- in FIG. 3. In the figure, 1 is a plate-shaped body, 2 is a rectangular recess, and 4 is an I
C element, 5 is its central mold part, 6 is a lead part, 7 is an IC element storage space, 8 is a trapezoidal convex part, and 9 is a cushion material. The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
枚重積し、各板状体の上面方形凹部とその上に重
積される板状体の方形凹部の裏面との間で形成さ
れる空間内に、中央モールド部とその4周辺にフ
オーミングされたリード部を備えたIC素子を収
納するようにしたIC個装パレツトにおいて、上
記各板状体凹部内底面の中央に上記IC素子載置
用台形凸部を形成し、その凸部裏面にクツシヨン
材を固着したことを特徴とするIC個装パレツト
。 (2) 上記IC素子は、上記板状体方形凹部の台
形凸部と、その上に重積される板状体の台形凸部
裏面のクツシヨン材下面との間に中央モールド部
が挟着支持され、それの周辺のリード部が方形凹
部底面に接しないよう収納されることを特徴とす
る実用新案登録請求の範囲第1項記載のIC個装
パレツト。[Scope of Claim for Utility Model Registration] (1) A plurality of plate-like bodies each having a rectangular recess formed on the top surface are stacked, and each plate-like body has a rectangular recess on its upper surface and the rectangular shape of the plate-like body stacked thereon. In the individual IC pallet in which an IC element having a central mold part and lead parts formed around the central mold part is housed in a space formed between the recess and the back surface of the recess, each plate-shaped body recess is A pallet for individual IC packaging, characterized in that the trapezoidal convex portion for mounting the IC element is formed at the center of the inner bottom surface, and a cushion material is fixed to the back surface of the convex portion. (2) The IC element is supported by the central mold part sandwiched between the trapezoidal convex part of the rectangular concave part of the plate-like body and the lower surface of the cushion material on the back side of the trapezoidal convex part of the plate-like body stacked thereon. 2. The individual IC pallet according to claim 1, wherein the IC pallet is housed so that the peripheral lead portion thereof does not come into contact with the bottom surface of the rectangular recess.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13795685U JPS6245287U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13795685U JPS6245287U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6245287U true JPS6245287U (en) | 1987-03-19 |
Family
ID=31042492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13795685U Pending JPS6245287U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6245287U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03256882A (en) * | 1990-02-27 | 1991-11-15 | Matsushita Electric Ind Co Ltd | Packer of electrolysis condenser |
-
1985
- 1985-09-09 JP JP13795685U patent/JPS6245287U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03256882A (en) * | 1990-02-27 | 1991-11-15 | Matsushita Electric Ind Co Ltd | Packer of electrolysis condenser |
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