JPS6245034B2 - - Google Patents

Info

Publication number
JPS6245034B2
JPS6245034B2 JP59045029A JP4502984A JPS6245034B2 JP S6245034 B2 JPS6245034 B2 JP S6245034B2 JP 59045029 A JP59045029 A JP 59045029A JP 4502984 A JP4502984 A JP 4502984A JP S6245034 B2 JPS6245034 B2 JP S6245034B2
Authority
JP
Japan
Prior art keywords
nozzle member
workpiece
laser beam
elevating
focus head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP59045029A
Other languages
Japanese (ja)
Other versions
JPS60191685A (en
Inventor
Yasuaki Nagano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibuya Corp
Original Assignee
Shibuya Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibuya Kogyo Co Ltd filed Critical Shibuya Kogyo Co Ltd
Priority to JP59045029A priority Critical patent/JPS60191685A/en
Publication of JPS60191685A publication Critical patent/JPS60191685A/en
Publication of JPS6245034B2 publication Critical patent/JPS6245034B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Description

【発明の詳細な説明】 本発明はレーザ光線を集光する集光レンズと被
加工物との間隔を最適な量に維持するレーザ装置
の自動焦点追従装置に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic focus tracking device for a laser device that maintains an optimum distance between a condensing lens that condenses a laser beam and a workpiece.

従来、集光レンズと被加工物との間隔を調整し
て最適なレーザ光線の焦点距離を得るようにした
焦点調整装置は既に種々のものが提案されてお
り、一般には上記集光レンズを固定したフオーカ
スヘツドと被加工物との間隙を非接触式の検出器
若しくは接触式の検出器で検出し、その検出値が
一定となるように上記フオーカスヘツドを昇降さ
せることにより、集光レンズと被加工物との間隔
が一定となるようにしている。
Conventionally, various focus adjustment devices have been proposed that adjust the distance between the condenser lens and the workpiece to obtain the optimal focal length of the laser beam, and generally, the condenser lens is fixed. The gap between the focus head and the workpiece is detected using a non-contact detector or a contact detector, and the focus head is moved up and down so that the detected value remains constant. The distance between them is kept constant.

ところで、正確な焦点距離を得るにはレーザ光
線の照射位置において上記間隙を測定することが
望ましいが、その位置ではレーザ光線によるプラ
ズマが発生しているので計測が困難であつたり誤
差が生じ易く、一般には照射位置より若干離れた
位置において計測を行なうようにしている。とこ
ろが、レーザ光線の照射位置と計測位置とを異な
らせると、例えば被加工物の加工面が傾斜してい
たり凹凸がある場合等には、不正確な位置に上記
フオーカスヘツドが位置制御されるという欠点が
あつた。
By the way, in order to obtain an accurate focal length, it is desirable to measure the above-mentioned gap at the irradiation position of the laser beam, but since plasma is generated by the laser beam at that position, measurement is difficult and errors are likely to occur. Generally, measurements are made at a position slightly distant from the irradiation position. However, if the irradiation position of the laser beam and the measurement position are different, for example, if the processing surface of the workpiece is sloped or uneven, the focus head may be controlled to an inaccurate position. It was hot.

本発明はそのような事情に鑑み、上記フオーカ
スヘツドを昇降機構によつて昇降される昇降部材
とこの昇降部材に昇降自在に設けたノズル部材と
から構成し、そのノズル部材に上記集光レンズを
取付けるとともにその先端を被加工物に接触可能
とし、かつ、上記集光レンズによるレーザ光線の
焦点位置を、上記ノズル部材が被加工物に接触す
る先端部分に略一致させたことにより、上記ノズ
ル部材を被加工物の加工面に沿つてそれと接触し
た状態で昇降自在とすると同時に、ノズル部材が
昇降しても常に最適な焦点距離を維持できるよう
にしたレーザ装置の自動焦点追従装置を提供する
ものである。
In view of such circumstances, the present invention comprises the above-mentioned focus head consisting of an elevating member that is raised and lowered by an elevating mechanism and a nozzle member provided on the elevating member so as to be able to rise and fall freely, and the above-mentioned condensing lens is attached to the nozzle member. At the same time, the tip of the nozzle member can be brought into contact with the workpiece, and the focal position of the laser beam by the condensing lens is made to substantially coincide with the tip portion of the nozzle member that contacts the workpiece. To provide an automatic focus tracking device for a laser device that can move up and down while being in contact with the processing surface of a workpiece, and at the same time can always maintain an optimum focal length even when a nozzle member goes up and down. be.

以下、図示実施例について本発明を説明する
と、図において、レーザ光線Lを照射するフオー
カスヘツド1は支持枠2に設けた案内ロツド3に
沿つて、被加工物4に向けて昇降可能となつてい
る。上記支持枠2にはそのフオーカスヘツド1を
昇降させる昇降機構5を設けてあり、図示実施例
ではその昇降機構5は、モータ6と、このモータ
6によつて正逆転される鉛直方向のねじ軸7とを
備えており、そのねじ軸7を上記フオーカスヘツ
ド1に螺合させてフオーカスヘツド1を昇降させ
ることができるようにしている。
The present invention will be described below with reference to the illustrated embodiment. In the figure, a focus head 1 that irradiates a laser beam L is movable up and down toward a workpiece 4 along a guide rod 3 provided on a support frame 2. . The support frame 2 is provided with an elevating mechanism 5 for elevating and lowering the focus head 1. In the illustrated embodiment, the elevating mechanism 5 includes a motor 6 and a vertical screw shaft 7 that is rotated forward and backward by the motor 6. The screw shaft 7 is screwed into the focus head 1 so that the focus head 1 can be moved up and down.

上記フオーカスヘツド1を昇降自在に支持する
支持枠2は、ねじ軸7に直交させて機枠8に水平
方向に設けた案内部材9に沿つて進退動可能とな
つており、図示しない上記昇降機構5と同様な駆
動機構によつてその方向に移動されるようになつ
ている。なお、上記被加工物4は図示しないテー
ブル上に載置され、そのテーブルによつて上記ね
じ軸7および案内部材9のそれぞれと直交する方
向に移動可能となつている。
The support frame 2, which supports the focus head 1 in a vertically movable manner, can move forward and backward along a guide member 9 provided horizontally on the machine frame 8 so as to be orthogonal to the screw shaft 7. It is adapted to be moved in that direction by a drive mechanism similar to that of . The workpiece 4 is placed on a table (not shown), and is movable by the table in a direction perpendicular to the screw shaft 7 and the guide member 9, respectively.

然して、上記フオーカスヘツド1は、上記案内
ロツド3とねじ軸7とに係合する昇降部材10
と、この昇降部材10の下部に形成した筒状部1
1に軸受12を介して昇降自在に設けたノズル部
材13とから構成してあり、そのノズル部材13
をばね14および15の弾撥力によつて常に下方
に付勢して、ノズル部材13の自重とばね14,
15の弾撥力とによつてノズル部材13を上記被
加工物4に所定の軽い付勢力で圧接させることが
できるようにしている。上記ノズル部材13内は
これに接続した導管16を介して図示しないアシ
ストガスの供給源に連通させている。
Accordingly, the focus head 1 has an elevating member 10 that engages with the guide rod 3 and the screw shaft 7.
and a cylindrical portion 1 formed at the bottom of this elevating member 10.
1 and a nozzle member 13 which is provided so as to be movable up and down via a bearing 12, and the nozzle member 13
is always urged downward by the elastic force of the springs 14 and 15, and the dead weight of the nozzle member 13 and the spring 14,
15 allows the nozzle member 13 to be brought into pressure contact with the workpiece 4 with a predetermined light urging force. The interior of the nozzle member 13 is communicated with an assist gas supply source (not shown) via a conduit 16 connected thereto.

また、上記ノズル部材13の上端部にレーザ光
線Lを集光させる集光レンズ20を取付けるとと
もに、そのノズル部材13の下端部外周面を円錐
形状に形成してその先端を上記被加工物4に接触
可能とし、かつその下端軸部に上記レーザ光線L
の通過を許容する孔21を形成している。そして
上記集光レンズ20によるレーザ光線Lの焦点位
置を、上記ノズル部材13のノズル部材13を被
加工物4に接触させた状態において、その被加工
物4をレーザ加工するのに好適となるような位置
に設定している。この焦点位置は、被加工物4の
材質や厚さ等によつて多少変動するが、一般には
ほぼ上記孔21の外部への開口縁部分となる。
Further, a condensing lens 20 for condensing the laser beam L is attached to the upper end of the nozzle member 13, and the outer peripheral surface of the lower end of the nozzle member 13 is formed into a conical shape, and the tip thereof is attached to the workpiece 4. The laser beam L is made contactable and the lower end shaft part is
A hole 21 is formed to allow the passage of. The focal position of the laser beam L by the condensing lens 20 is adjusted to be suitable for laser processing the workpiece 4 while the nozzle member 13 is in contact with the workpiece 4. It is set in a certain position. This focal point position varies somewhat depending on the material, thickness, etc. of the workpiece 4, but generally it is approximately at the opening edge of the hole 21 to the outside.

さらに、上記昇降部材10にこの昇降部材10
に対するノズル部材13の昇降位置を検出する検
出器22の本体23を取付け、その検出器22の
検出子24を連結部材25を介して上記ノズル部
材13に連結している。この検出器22はその本
体23に対する検出子24の位置を、したがつて
昇降部材10に対するノズル部材13の昇降位置
を検出できるようになつており、その検出器22
からの信号をマイクロコンピユータ等の制御装置
26に入力させるようにしている。この制御装置
26は検出器22からの信号に応じて昇降機構5
を制御し、上記昇降部材10に対するノズル部材
13の昇降位置を所定の昇降位置に維持すること
ができるようになつている。
Furthermore, this elevating member 10 is attached to the elevating member 10.
A main body 23 of a detector 22 for detecting the vertical position of the nozzle member 13 with respect to the main body 23 is attached, and a detector 24 of the detector 22 is connected to the nozzle member 13 via a connecting member 25. This detector 22 is designed to be able to detect the position of the detector 24 with respect to its main body 23, and therefore the vertical position of the nozzle member 13 with respect to the vertical movement member 10.
A signal from the controller is inputted to a control device 26 such as a microcomputer. This control device 26 controls the lifting mechanism 5 in response to a signal from the detector 22.
It is possible to maintain the vertical position of the nozzle member 13 with respect to the vertical movement member 10 at a predetermined vertical position.

以上の構成において、非作動状態ではフオーカ
スヘツド1は上昇端に位置しており、ノズル部材
13は自重とばね14,15の弾撥力とによつて
昇降部材10に対して下降端位置に位置してい
る。したがつてまた、ノズル部材13に連結部材
25を介して連動している検出器22の検出子2
4も下降端位置に位置している。
In the above configuration, in the non-operating state, the focus head 1 is located at the ascending end, and the nozzle member 13 is located at the descending end position with respect to the elevating member 10 due to its own weight and the elastic force of the springs 14 and 15. ing. Therefore, the detector 2 of the detector 22 is also connected to the nozzle member 13 via the connecting member 25.
4 is also located at the lower end position.

この状態から制御装置26に運転開始指令が与
えられると、この制御装置26は昇降機構5を制
御してフオーカスヘツド1を降下させ、これによ
りノズル部材13の下端部が被加工物4に接触す
るとそのノズル部材13の下降は停止するが、昇
降部材10は継続して降下される。
When a command to start operation is given to the control device 26 from this state, the control device 26 controls the lifting mechanism 5 to lower the focus head 1, so that when the lower end of the nozzle member 13 comes into contact with the workpiece 4, Although the nozzle member 13 stops descending, the elevating member 10 continues to descend.

その結果、昇降部材10に対して相対的にノズ
ル部材13が上昇されるようになり、その昇降部
材10に対するノズル部材13の上昇位置が所定
位置となると、そのことを制御装置26は検出器
22を介して検出する。ノズル部材13が所定の
高さ位置となつたことを制御装置26が検出する
と、その制御装置26は昇降機構5による昇降部
材10の降下を停止させ、次にレーザ光線Lを被
加工物4に向けて照射させて、レーザ加工を開始
させる。
As a result, the nozzle member 13 is raised relative to the elevating member 10, and when the elevated position of the nozzle member 13 relative to the elevating member 10 reaches a predetermined position, the control device 26 detects this using the detector 22. Detected through. When the control device 26 detects that the nozzle member 13 has reached a predetermined height position, the control device 26 stops the descent of the elevating member 10 by the elevating mechanism 5, and then directs the laser beam L to the workpiece 4. Aim the target and start laser processing.

上述のレーザ加工中、被加工物4が傾斜してい
たり凹凸があつたりしてそれらによりノズル部材
13が昇降部材10に対して昇降された場合であ
つても、上記集光レンズ20をそのノズル部材1
3に一体に設けてあるので、ノズル部材13の昇
降によつては集光レンズ20の焦点位置が上記孔
21の開口縁部から変位することがなく、円滑な
レーザ加工が継続される。そしてこの際、レーザ
光線Lを照射するノズル部材13自体が被加工物
4に接触しているので、レーザ光線Lの照射位置
と焦点の計測位置とが実質的に一致するようにな
り、上述のように被加工物4の加工面が傾斜して
いたり凹凸がある場合であつても、常に高精度な
レーザ加工を行なうことができるようになる。
During the laser processing described above, even if the workpiece 4 is tilted or uneven and the nozzle member 13 is moved up and down with respect to the elevating member 10, the condenser lens 20 cannot be moved to the nozzle. Part 1
3, the focal position of the condenser lens 20 will not be displaced from the opening edge of the hole 21 as the nozzle member 13 moves up and down, and smooth laser processing can be continued. At this time, since the nozzle member 13 itself that irradiates the laser beam L is in contact with the workpiece 4, the irradiation position of the laser beam L and the measurement position of the focal point substantially coincide, so that the above-mentioned Even if the processing surface of the workpiece 4 is inclined or uneven, highly accurate laser processing can be performed at all times.

そして、昇降部材10に対するノズル部材13
の昇降量が大きくなつて許容範囲を越えるように
なつた場合には、制御装置26はそのことを検出
器22を介して検出し、昇降機構5を制御して昇
降部材10を昇降させて昇降部材10に対するノ
ズル部材13の位置を常に所定の範囲内の位置に
維持する。
Then, the nozzle member 13 for the elevating member 10
If the amount of elevation increases and exceeds the allowable range, the control device 26 detects this via the detector 22 and controls the elevation mechanism 5 to raise and lower the elevation member 10. The position of the nozzle member 13 with respect to the member 10 is always maintained within a predetermined range.

なお、上記実施例では一対のばね14,15の
付勢方向を下方としているが、必要に応じていず
れか一方又は両方を省略してもよく、また付勢方
向を上方としてノズル部材13の自重に対抗させ
るようにしてもよい。また、本発明は便宜上昇降
方向を基準として説明しているがこれに限定され
るものでないことは勿論である。
In the above embodiment, the biasing direction of the pair of springs 14 and 15 is downward, but either one or both may be omitted if necessary, and the self-weight of the nozzle member 13 is It may be made to oppose. Further, although the present invention has been described based on the upward and downward directions for convenience, it is needless to say that the present invention is not limited to this.

以上のように、本発明によれば、レーザ光線の
照射位置と計測位置とを実質的に同一の位置とし
て常に最適な焦点距離を確保できるという効果が
得られるようになる。
As described above, according to the present invention, it is possible to obtain the effect that the irradiation position of the laser beam and the measurement position are substantially the same, and the optimum focal length can always be ensured.

【図面の簡単な説明】[Brief explanation of the drawing]

図は本発明の一実施例を示す断面図である。 1…レーザノズル、4…被加工物、5…昇降機
構、10…昇降部材、13…ノズル部材、20…
集光レンズ、L…レーザ光線。
The figure is a sectional view showing one embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Laser nozzle, 4... Workpiece, 5... Lifting mechanism, 10... Lifting member, 13... Nozzle member, 20...
Condensing lens, L...laser beam.

Claims (1)

【特許請求の範囲】[Claims] 1 昇降機構によつて昇降されるフオーカスヘツ
ドに集光レンズを設け、その集光レンズによつて
集光したレーザ光線を上記フオーカスヘツドから
被加工物へ照射するレーザ装置において、上記フ
オーカスヘツドを昇降機構によつて昇降される昇
降部材とこの昇降部材に昇降自在に設けたノズル
部材とから構成し、そのノズル部材に上記集光レ
ンズを取付けるとともにその先端を被加工物に接
触可能とし、かつ、上記集光レンズによるレーザ
光線の焦点位置を、上記ノズル部材が被加工物に
接触する先端部分に略一致させたことを特徴とす
るレーザ装置の自動焦点追従装置。
1. In a laser device in which a focus head that is raised and lowered by a lifting mechanism is provided with a condenser lens, and a laser beam focused by the condenser lens is irradiated from the focus head to a workpiece, the focus head is moved by the lift mechanism. It is composed of an elevating member that can be raised and lowered by moving up and down, and a nozzle member that is provided on this elevating member so that it can be raised and lowered.The condensing lens is attached to the nozzle member, and the tip thereof can be brought into contact with the workpiece, and the condensing lens is An automatic focus tracking device for a laser device, characterized in that a focal position of a laser beam by a lens is made to substantially coincide with a tip portion of the nozzle member that contacts a workpiece.
JP59045029A 1984-03-09 1984-03-09 Automatic focus follow-up device for laser device Granted JPS60191685A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59045029A JPS60191685A (en) 1984-03-09 1984-03-09 Automatic focus follow-up device for laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59045029A JPS60191685A (en) 1984-03-09 1984-03-09 Automatic focus follow-up device for laser device

Publications (2)

Publication Number Publication Date
JPS60191685A JPS60191685A (en) 1985-09-30
JPS6245034B2 true JPS6245034B2 (en) 1987-09-24

Family

ID=12707905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59045029A Granted JPS60191685A (en) 1984-03-09 1984-03-09 Automatic focus follow-up device for laser device

Country Status (1)

Country Link
JP (1) JPS60191685A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01177913U (en) * 1988-06-01 1989-12-20

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5044887B2 (en) * 2004-10-15 2012-10-10 大日本印刷株式会社 Laser processing equipment
US11154948B2 (en) * 2010-12-16 2021-10-26 Bystronic Laser Ag Laser beam machining device and a process of laser machining comprising a single lens for light focussing
CN107335927B (en) * 2017-07-21 2019-01-08 温州市镭诺科技有限公司 The efficient laser cutting device of automatic focusing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01177913U (en) * 1988-06-01 1989-12-20

Also Published As

Publication number Publication date
JPS60191685A (en) 1985-09-30

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