JPS6244828B2 - - Google Patents
Info
- Publication number
- JPS6244828B2 JPS6244828B2 JP16668380A JP16668380A JPS6244828B2 JP S6244828 B2 JPS6244828 B2 JP S6244828B2 JP 16668380 A JP16668380 A JP 16668380A JP 16668380 A JP16668380 A JP 16668380A JP S6244828 B2 JPS6244828 B2 JP S6244828B2
- Authority
- JP
- Japan
- Prior art keywords
- optical
- light
- molded body
- optical module
- conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003287 optical effect Effects 0.000 claims description 64
- 238000006243 chemical reaction Methods 0.000 claims description 15
- 239000013307 optical fiber Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 description 12
- 238000010168 coupling process Methods 0.000 description 12
- 238000005859 coupling reaction Methods 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 9
- 238000000465 moulding Methods 0.000 description 4
- CMSGUKVDXXTJDQ-UHFFFAOYSA-N 4-(2-naphthalen-1-ylethylamino)-4-oxobutanoic acid Chemical compound C1=CC=C2C(CCNC(=O)CCC(=O)O)=CC=CC2=C1 CMSGUKVDXXTJDQ-UHFFFAOYSA-N 0.000 description 3
- 238000007493 shaping process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4292—Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
Description
【発明の詳細な説明】
本発明は光コネクタを具備する光フアイバケー
ブルを介して電気−光−電気の光通信を行なう時
に使用する送信（受信）用の光モジユールの内特
に受信用の光モジユールの改良に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical module for transmission (reception) used when performing electric-optical-electrical optical communication via an optical fiber cable equipped with an optical connector, and in particular an optical module for reception. This is related to the improvement of.
光伝送装置では、波形整形器、電流増幅器、電
気−光変換用発光ダイオード及び光コネクタ結合
部からなる送信用の光モジユールを介して入力電
気信号を光信号に変換し、この光信号を光コネク
タ結合部に装着された光コネクタにより光フアイ
バケーブルの一端部に導入し、光フアイバケーブ
ルの他端部の光コネクタを、光コネクタ結合部、
光−電気変換用PIN（PN）ホトダイオード、増
幅器及び波形整形器からなる受信用の光モジユー
ルの光コネクタ結合部に装着し、光フアイバケー
ブルを介して伝送されきた光信号を受信用の光モ
ジユールより出力電気信号として取り出す。 Optical transmission equipment converts an input electrical signal into an optical signal through a transmission optical module consisting of a waveform shaper, a current amplifier, a light emitting diode for electrical-to-optical conversion, and an optical connector coupling section, and then converts the input electrical signal into an optical signal via an optical connector. Insert the optical fiber cable into one end using the optical connector attached to the coupling part, and connect the optical connector at the other end of the optical fiber cable to the optical connector coupling part,
Optical-to-electrical conversion PIN (PN) Attached to the optical connector coupling part of the receiving optical module consisting of a photodiode, amplifier, and waveform shaper, it converts the optical signal transmitted via the optical fiber cable from the receiving optical module. Extract as an output electrical signal.
次に第１図により従来の光伝送装置の一例を説
明する。 Next, an example of a conventional optical transmission device will be explained with reference to FIG.
即ち送信用の光モジユール１は、破線で示すシ
ールド箱２内に所定の配線が形成されたプリント
配線基板３を備える。このプリント配線基板３に
は所定位置に外部導線４が取付けられ、４１には
電源として＋5V、４２には第２図ａの曲線１１
で示す入力電気信号、４３には接地電位が接続さ
れる。なお、４４は空リードフレームである。電
気信号は波形整形用IC５で第２図ｂに曲線１２
で示す電気信号に整形され、電流増幅用トランジ
スタ６で第２図ｃに曲線１３で示す電気信号に電
流増幅され、更に抵抗７を介して基板８に支持さ
れた送信側の光コネクタ結合部９内の電気−光変
換用発光ダイオード（LED）１０に加えられ
る。この電気−光変換用発光ダイオード１０から
の第２図ｄに曲線１４で示す光信号を送信側の光
コネクタ２１、光フアイバケーブル２２及び受信
側の光コネクタ２３を介して受信用の光モジユー
ル３１に導入する。この受信用の光モジユール３
１は破線で示すシールド箱３２内に設けられた基
板３８に支持された受信側の光コネクタ結合部３
９内の光−電気変換用PIN（PN）ホトダイオー
ド４０により、光フアイバケーブル２２内を伝送
する時に変形した第３図ａに曲線４１で示す光信
号がそのまま第３図ｂに曲線４２で示す電気信号
に変換されたのち、増幅器３６により、第３図ｃ
に曲線４３で示す電気信号が増幅され、更に波形
整形用IC３５により、第３図ｄに曲線４４で示
す電気信号に変換されるようになつている。な
お、外部導線３４のうち、３４１には電源として
＋5Vが印加され、３４２からは出力電気信号が
取り出され、３４３は接地電位となつており、３
４４は空ピンである。 That is, the optical module 1 for transmission includes a printed wiring board 3 on which predetermined wiring is formed inside a shield box 2 indicated by a broken line. An external conductor 4 is attached to this printed wiring board 3 at a predetermined position, 41 is connected to +5V as a power source, and 42 is connected to a curve 11 shown in FIG. 2a.
A ground potential is connected to the input electric signal 43 shown by . Note that 44 is an empty lead frame. The electric signal is processed by waveform shaping IC 5 and curve 12 is shown in Figure 2b.
The signal is shaped into an electrical signal shown by , and the current is amplified by the current amplifying transistor 6 into an electrical signal shown by a curve 13 in FIG. A light emitting diode (LED) 10 for electrical-to-optical conversion is added to the inside. The optical signal shown by the curve 14 in FIG. 2d from the light emitting diode 10 for electric-to-optical conversion is transmitted to the receiving optical module 31 via the optical connector 21 on the transmitting side, the optical fiber cable 22 and the optical connector 23 on the receiving side. to be introduced. Optical module 3 for this reception
1 is a receiving side optical connector coupling part 3 supported by a board 38 provided in a shield box 32 indicated by a broken line.
The optical-to-electrical conversion PIN (PN) photodiode 40 in the optical fiber cable 22 converts the optical signal shown by the curve 41 in FIG. After being converted into a signal, the signal shown in FIG.
The electric signal shown by a curve 43 is amplified and further converted into an electric signal shown by a curve 44 in FIG. 3d by the waveform shaping IC 35. Of the external conductors 34, +5V is applied as a power source to 341 , an output electrical signal is taken out from 342 , and 343 is at ground potential.
4 4 is an empty pin.
然るにこの様な光伝送装置に於ては、送信用の
光モジユール１、受信用の光モジユール３１は前
述したようにシールド箱２，３２中に電気−光変
換用発光ダイオード１０、光−電気変換用PIN
（PN）ホトダイオード４０を除いてプリント配線
板などに個々の部品が装着されているので、外形
も大きく、これら個々の部品からなる回路（本発
明では周辺回路と云う）の組立時間がかかり高価
となるし、また半田付などの接続部も多く信頼性
に乏しいし、更に光コネクタ結合部９，３９に組
み込まれる発光ダイオード１０やホトダイオード
４０がいずれもメタルカンに透明部材からなる窓
を設けた素子を挿入固定して使用しているため、
これらの素子の光強度分布や光受光分布の最良な
位置に数μｍ乃至数10μｍの精度で光フアイバの
光学研磨された端面部を正確に合せることが極め
て困難であり、同じように製作された送信用の光
モジユールや受信用の光モジユールを使用して同
一入力電気信号を加えても同一出力電気信号が得
られないと云う欠点があつた。 However, in such an optical transmission device, the optical module 1 for transmitting and the optical module 31 for receiving include the light emitting diode 10 for electrical-to-optical conversion and the light-emitting diode for optical-to-electrical conversion in the shield boxes 2 and 32, as described above. PIN
(PN) Except for the photodiode 40, individual components are mounted on a printed wiring board, etc., so the external size is large, and the assembly of a circuit (referred to as a peripheral circuit in the present invention) consisting of these individual components is time consuming and expensive. Moreover, there are many connections such as soldering, and the reliability is poor.Furthermore, the light emitting diode 10 and photodiode 40 incorporated in the optical connector coupling parts 9 and 39 are elements in which a window made of a transparent material is provided in a metal can. Because it is inserted and used in a fixed manner,
It is extremely difficult to precisely align the optically polished end face of an optical fiber with an accuracy of several micrometers to several tens of micrometers at the best position for the light intensity distribution and light reception distribution of these elements, and There is a drawback in that even if the same input electrical signal is applied using a transmitting optical module and a receiving optical module, the same output electrical signal cannot be obtained.
本発明は前述した従来の欠点に鑑みなされたも
のであり、小型、安価で極めて高精度で安定した
電気−光−電気の変換を行なうことが可能な光伝
送装置の特に受信用の光モジユールを提供するこ
とを目的としている。 The present invention has been made in view of the above-mentioned drawbacks of the conventional art, and provides an optical module for optical transmission equipment, especially for reception, which is small, inexpensive, and capable of extremely highly accurate and stable electrical-optical-electrical conversion. is intended to provide.
次に本発明の光モジユールの一実施例を第４図
乃至第６図により説明する。 Next, one embodiment of the optical module of the present invention will be described with reference to FIGS. 4 to 6.
即ち、受信用の光モジユール５１の外形は第４
図に示すように断面ほぼ凸字形をなし、光不透過
モールド部材からなる第２段のモールド部材５２
と、このモールド体５２の一主面５２１の中央部
に一体形成された光コネクタ結合部５９、この光
コネクタ結合部５９を挾むように設けられた一対
の取付孔部５３及び府面に植設された４本のリー
ドピン群５４からなり、その内部構造は第５図及
び第６図に示すように、銀めつきされた４本のリ
ードフレーム群５４の空リードフレーム５４４の
突出部にはチツプ状の受光素子６０が導電ペース
トを介してマウントされ、また接地リードフレー
ム５４３の端部近傍には波形整形、増幅などの部
品を一体形成、または個別に形成したチツプ状の
IC素子５５が同じく導電ペーストを介してマウ
ントされ、電源用リードフレーム５４１、出力電
気信号用リードフレーム５４２、接地リードフレ
ーム５４３、空リードフレーム５４４、IC素子
５５及び受光素子６０は所定の回路構成をなすよ
うに例えば25μｍＯ／の金からなるボンデング線５
６により熱圧着ボンデングされる。次にリードフ
レーム群５４などを基準として例えば日東電工製
透明熱硬化エポキシ樹脂MP−8500を温度160℃、
圧力30Kg／cm2の条件で受光素子６０、IC素子５
５及びボンデング線を被覆するように第１段のモ
ールドとしてのトランスフアーモールドを行な
い、受光素子６０の光軸上に集光レンズ５７ａを
有する透明モールド体５７を形成する。 That is, the outer shape of the receiving optical module 51 is
As shown in the figure, the second stage mold member 52 has a substantially convex cross section and is made of a light-opaque mold member.
An optical connector coupling part 59 integrally formed in the center of one main surface 521 of this molded body 52, a pair of mounting holes 53 provided so as to sandwich this optical connector coupling part 59, and an implanted part in the front surface. The internal structure is as shown in FIGS. 5 and 6, and the protruding portion of the empty lead frame 54 of the silver-plated four lead frame group 54 is A chip-shaped light-receiving element 60 is mounted via a conductive paste, and near the end of the ground lead frame 543 , a chip-shaped light receiving element 60 is mounted with components for waveform shaping, amplification, etc. integrally formed or separately formed.
The IC element 55 is similarly mounted via conductive paste, and the power supply lead frame 54 1 , the output electric signal lead frame 54 2 , the ground lead frame 54 3 , the empty lead frame 54 4 , the IC element 55 and the light receiving element 60 are mounted in predetermined positions. For example, a bonding wire 5 made of 25 μmO/gold is used to form a circuit configuration of
6, thermocompression bonding is performed. Next, using the lead frame group 54 as a reference, for example, use transparent thermosetting epoxy resin MP-8500 manufactured by Nitto Denko at a temperature of 160°C.
Light receiving element 60, IC element 5 under the condition of pressure 30Kg/ cm2
Transfer molding is performed as a first stage mold so as to cover 5 and the bonding wire, and a transparent mold body 57 having a condenser lens 57a on the optical axis of the light receiving element 60 is formed.
次にこの透明モールド体５７の受光素子６０に
対する光を妨げず、また貫通したリードフレーム
５４に接触しない様に電磁波シールド部材として
のネサ膜７１を被着形成する、このネサ膜は接地
リードフレーム５４３には接続されている。 Next, a Nesa film 71 as an electromagnetic wave shielding member is formed so as not to obstruct light from the light receiving element 60 of the transparent molded body 57 and not to come into contact with the lead frame 54 that has passed through it. 3 is connected.
次に例えば透明モールド体５７から出ているリ
ードフレーム群５４及び空リードフレーム５４４
の先端部５４4a、電源用のリードピン５４１の先
端部５４1aを基準として少なくとも受光素子６０
の光入力面の集光レンズ５７ａが露出し得るよう
に光コネクタ結合部５９の円筒状内壁部、即ち破
線で示す受信側の光コネクタのプラグ６３を挿入
し得る内壁部に相当する金型と第４図示の外形を
形成出来る金型を使用し、例えば住友ベークライ
ト製黒色熱硬化エポキシ樹脂EME−155Fを温度
165℃、圧力80Kg／cm2の条件で第２段のモールド
を行ない光不透過モールド体５２を形成し、第４
図に示す受信用の光モジユール５１を完成する。
この場合、光コネクタのプラグ６３内の光フアイ
バケーブルの中芯部６４とチツプ状の受光素子６
０の発光中がほぼ一致するように第２段のモール
ドを行なうことが重要であり、この第２段のモー
ルドの前に受光素子６０の発光中心を光学的に測
定し、第２段モールドの金型特に光コネクタ結合
部の金型の位置合せを行なうことが望ましい。図
に於て５８は取付ねじ部である。 Next, for example, a group of lead frames 54 and an empty lead frame 54 protruding from the transparent mold body 57.
The tip end 54 4a of the power supply lead pin 54 1 is referenced to at least the light receiving element 60 .
A mold corresponding to the cylindrical inner wall portion of the optical connector coupling portion 59, that is, the inner wall portion into which the plug 63 of the receiving side optical connector shown by the broken line can be inserted, so that the condensing lens 57a on the optical input surface of the optical connector can be exposed. Using a mold that can form the external shape shown in Figure 4, for example, heat the black thermosetting epoxy resin EME-155F manufactured by Sumitomo Bakelite.
A second stage molding is carried out at 165°C and a pressure of 80 kg/cm 2 to form a light-opaque molded body 52.
The receiving optical module 51 shown in the figure is completed.
In this case, the optical fiber cable core 64 inside the optical connector plug 63 and the chip-shaped light receiving element 6
It is important to perform the second stage molding so that the light emission centers of 0 and 0 almost coincide with each other.Before this second stage molding, the light emission center of the light receiving element 60 is optically measured and It is desirable to align the mold, especially the mold for the optical connector coupling part. In the figure, 58 is a mounting screw portion.
前述した構造の受信用の光モジユール５１の利
点は、第１に極めて小形になる。第２にチツプ状
の受光素子及び周辺回路を含むチツプ状のIC素
子をアセンプリするだけであるので組立時間が短
かい。第３に接続個所が大幅に減少するので高信
頼性である。第４にモールド成形時に極めて容易
に光コネクタと光軸を合わせてチツプ状の受光素
子を設けることが可能であるし、また集光レンズ
があるため効率良く光結合することが出来る。第
５に電磁波シールド部材が設けられているので透
明シールド部材内部の受光素子や、IC素子が外
部からシールドされるので特に受光素子に流れる
0.5μA／μｗ程度の電流に対する外部回路からの
誘導が入ることがないのでノイズが混入したり空
間より混入する電磁波ノイズを防止できる。第６
に極めて安価に作ることが出来る。 The first advantage of the receiving optical module 51 having the above-described structure is that it is extremely compact. Second, since only a chip-shaped IC element including a chip-shaped light receiving element and peripheral circuits is assembled, the assembly time is short. Thirdly, the number of connection points is greatly reduced, resulting in high reliability. Fourthly, during molding, it is very easy to align the optical axis with the optical connector and provide a chip-shaped light-receiving element, and since there is a condenser lens, efficient optical coupling can be achieved. Fifth, since the electromagnetic wave shielding member is provided, the light receiving element inside the transparent shielding member and the IC element are shielded from the outside, so the electromagnetic wave flows particularly to the light receiving element.
Since there is no induction from an external circuit for a current of about 0.5 μA /μW, it is possible to prevent noise from entering or electromagnetic wave noise from entering from space. 6th
It can be made extremely cheaply.
前記実施例に於ては透明モールド体の受光素子
に対する光を防げることなくネサ膜７１を形成し
たが、ネサ膜が透明である場合には第７図に示す
ように透明モールド体５７の集光レンズ５７ａを
含めた全面に電磁波シールド部材としてのネサ膜
７２を設けても良いし、また第８図に示すように
光不透過モールド体５２の光コネクタ接合部５９
を除く外面の所定位置を電磁波シールド部材とし
ての金属板や金属箱など７３で被覆してもよい
し、更に図示しないが透明モールド体を形成した
段階で外部リードフレームに絶縁被膜を形成して
から金属粉、金属細線、金属メツシユなど金属部
材を混入した光不透過モールド体を使用してもよ
いことは明らかであり、この電磁波シールドは特
に受信側の光モジユールに必要なことは前述した
通りである。 In the embodiment described above, the NESA film 71 was formed without blocking light from the light-receiving element of the transparent mold body. However, when the NESA film is transparent, the light condensing of the transparent mold body 57 is performed as shown in FIG. A NESA film 72 as an electromagnetic shielding member may be provided on the entire surface including the lens 57a, or the optical connector joint 59 of the light-opaque molded body 52 may be provided as shown in FIG.
A predetermined position on the outer surface other than the outer lead frame may be covered with a metal plate or metal box 73 as an electromagnetic wave shielding member, or, although not shown, an insulating coating may be formed on the external lead frame at the stage of forming the transparent mold body. It is clear that a light-opaque molded body mixed with metal components such as metal powder, thin metal wire, or mesh may be used, and as mentioned above, this electromagnetic wave shield is especially necessary for the optical module on the receiving side. be.
第１図は一般の光伝送装置を示す斜視図、第２
図は送信用の光モジユール内の主要部のそれぞれ
の波形を示す曲線図、第３図は受信用の光モジユ
ール内の主要部のそれぞれの波形を示す曲線図、
第４図乃至第６図は本発明の光モジユールの一実
施例を示す図であり、第４図は斜視図、第５図は
第４図をＡ−Ａ線に沿つて切断して見た断面図、
第６図は透明モールド体中の回路構成を示す平面
図、第７図及び第８図は本発明のそれぞれ他の実
施例を示す断面図である。
１，３１，５１……光モジユール、５，３５，
５５……IC素子、９，３９，５９……光コネク
タ結合部、１０，４０，６０……電気−光（光−
電気）変換素子、５２……光不透過モールド体、
５７……透明モールド体、７１，７２，７３……
電磁波シールド部材。
Figure 1 is a perspective view of a general optical transmission device;
The figure is a curve diagram showing the waveforms of each main part in the optical module for transmission, and FIG. 3 is a curve diagram showing the waveforms of each main part in the optical module for reception.
4 to 6 are views showing one embodiment of the optical module of the present invention, FIG. 4 is a perspective view, and FIG. 5 is a view of FIG. 4 cut along the line A-A. cross section,
FIG. 6 is a plan view showing the circuit structure in the transparent mold body, and FIGS. 7 and 8 are sectional views showing other embodiments of the present invention. 1, 31, 51... Optical module, 5, 35,
55...IC element, 9,39,59...Optical connector coupling part, 10,40,60...Electrical-optical (optical-
electrical) conversion element, 52...light-opaque molded body,
57...Transparent mold body, 71, 72, 73...
Electromagnetic shielding material.
Claims (1)
アイバケーブルを介した伝送し、更に光−電気変
換を行ない出力電気信号として取り出す時に使用
される受信用の光モジユールに於て、前記光−電
気変換を行なう変換素子及びその周辺回路または
前記変換素子を含む前記周辺回路が透明モールド
体により被覆されていると共に、少くとも前記変
換素子に対応して設けられる光コネクタ接合部の
内壁部を除き光不透過モールド体で外形が形成さ
れ更に前記透明モールド体または前記光不透過モ
ールド体に電磁波シールド部材が設けられている
ことを特徴とする光モジユール。 ２ 電磁波シールド部材が透明モールド体及びま
たは光不透過モールド体に被着形成されたネサ膜
であることを特徴とする特許請求の範囲第１項記
載の光モジユール。 ３ 電磁シールド部材が透明モールド体及びまた
は光不透過モールド体を所定部を覆うように形成
された金属であることを特徴とする特許請求の範
囲第１項記載の光モジユール。 ４ 電磁シールド部材が電磁シールド作用をなし
得る程度に金属部材を混入した光不透過モールド
体であることを特徴とする特許請求の範囲第１項
記載の光モジユール。[Scope of Claims] 1. A receiving optical module used to perform electrical-to-optical conversion on an input electrical signal, transmit it via an optical fiber cable, perform further optical-to-electrical conversion, and extract it as an output electrical signal. The conversion element that performs the optical-to-electrical conversion and its peripheral circuit, or the peripheral circuit including the conversion element are covered with a transparent molded body, and at least an optical connector joint portion is provided corresponding to the conversion element. 1. An optical module having an outer shape formed of a light-impermeable molded body except for an inner wall portion thereof, and further comprising an electromagnetic wave shielding member provided on the transparent molded body or the light-impermeable molded body. 2. The optical module according to claim 1, wherein the electromagnetic wave shielding member is a Nesa film adhered to a transparent mold body and/or a light-opaque mold body. 3. The optical module according to claim 1, wherein the electromagnetic shielding member is a metal formed to cover a predetermined portion of the transparent molded body and/or the light-opaque molded body. 4. The optical module according to claim 1, wherein the electromagnetic shielding member is a light-impermeable molded body containing a metal member to the extent that it can perform an electromagnetic shielding effect.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16668380A JPS5791568A (en) | 1980-11-28 | 1980-11-28 | Light module |
| DE8181305590T DE3175956D1 (en) | 1980-11-28 | 1981-11-26 | Module for a fiber optic link |
| EP81305590A EP0053482B1 (en) | 1980-11-28 | 1981-11-26 | Module for a fiber optic link |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16668380A JPS5791568A (en) | 1980-11-28 | 1980-11-28 | Light module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5791568A JPS5791568A (en) | 1982-06-07 |
| JPS6244828B2 true JPS6244828B2 (en) | 1987-09-22 |
Family
ID=15835791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16668380A Granted JPS5791568A (en) | 1980-11-28 | 1980-11-28 | Light module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5791568A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62170654U (en) * | 1986-04-18 | 1987-10-29 | ||
| JP5412069B2 (en) | 2008-07-30 | 2014-02-12 | 矢崎総業株式会社 | Female optical connector and manufacturing method of female optical connector |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54115089A (en) * | 1978-02-28 | 1979-09-07 | Omron Tateisi Electronics Co | Photo sensor |
| JPS5553307A (en) * | 1978-10-16 | 1980-04-18 | Motorola Inc | Optical fiber and connector for active elements |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5286373U (en) * | 1975-12-24 | 1977-06-28 |
-
1980
- 1980-11-28 JP JP16668380A patent/JPS5791568A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54115089A (en) * | 1978-02-28 | 1979-09-07 | Omron Tateisi Electronics Co | Photo sensor |
| JPS5553307A (en) * | 1978-10-16 | 1980-04-18 | Motorola Inc | Optical fiber and connector for active elements |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5791568A (en) | 1982-06-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2828220B2 (en) | Electro-optical assembly | |
| US5122893A (en) | Bi-directional optical transceiver | |
| US4539476A (en) | Module for a fiber optic link | |
| US4268113A (en) | Signal coupling element for substrate-mounted optical transducers | |
| US6540412B2 (en) | Optical transceiver | |
| US7970284B2 (en) | Optical and electric signals transmission apparatus, optical and electric signals transmission system, and electronic equipment using such a system | |
| US5202943A (en) | Optoelectronic assembly with alignment member | |
| US4720630A (en) | Active optical connector including an electronic circuit board and an optical fiber | |
| US6977423B2 (en) | Light-receiving assembly | |
| EP0053482B1 (en) | Module for a fiber optic link | |
| CN111458816A (en) | Optical module | |
| US6948863B2 (en) | Optical module and optical transceiver module | |
| JP4828103B2 (en) | Optical transceiver module | |
| JPS6244828B2 (en) | ||
| WO1994011929A2 (en) | Optoelectronic devices | |
| WO2023109210A1 (en) | Optical module | |
| JPH053330A (en) | Optical transmission-reception module | |
| CN214278494U (en) | Optical module | |
| JPS6052600B2 (en) | Manufacturing method of optical module | |
| JPS6244830B2 (en) | ||
| JPS6259478B2 (en) | ||
| JPH04151880A (en) | Manufacture of optical module | |
| JPS6244829B2 (en) | ||
| RU195171U1 (en) | Optoelectronic module | |
| CN217360388U (en) | Optical module |