JPS6242261U - - Google Patents
Info
- Publication number
- JPS6242261U JPS6242261U JP13326885U JP13326885U JPS6242261U JP S6242261 U JPS6242261 U JP S6242261U JP 13326885 U JP13326885 U JP 13326885U JP 13326885 U JP13326885 U JP 13326885U JP S6242261 U JPS6242261 U JP S6242261U
- Authority
- JP
- Japan
- Prior art keywords
- lamp body
- light
- emitting diode
- lamp
- reflecting surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13326885U JPS6242261U (US07579456-20090825-P00002.png) | 1985-08-30 | 1985-08-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13326885U JPS6242261U (US07579456-20090825-P00002.png) | 1985-08-30 | 1985-08-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6242261U true JPS6242261U (US07579456-20090825-P00002.png) | 1987-03-13 |
Family
ID=31033424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13326885U Pending JPS6242261U (US07579456-20090825-P00002.png) | 1985-08-30 | 1985-08-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242261U (US07579456-20090825-P00002.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587364B2 (ja) * | 1976-12-10 | 1983-02-09 | 住友金属工業株式会社 | 連続圧延機の板厚制御方法 |
| JPS5839063B2 (ja) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | 押出成形機の充填ステ−シヨンの閉鎖装置 |
-
1985
- 1985-08-30 JP JP13326885U patent/JPS6242261U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS587364B2 (ja) * | 1976-12-10 | 1983-02-09 | 住友金属工業株式会社 | 連続圧延機の板厚制御方法 |
| JPS5839063B2 (ja) * | 1978-03-08 | 1983-08-27 | アントン・ヘツゲンスタラ− | 押出成形機の充填ステ−シヨンの閉鎖装置 |
