JPS624129U - - Google Patents
Info
- Publication number
- JPS624129U JPS624129U JP1985094492U JP9449285U JPS624129U JP S624129 U JPS624129 U JP S624129U JP 1985094492 U JP1985094492 U JP 1985094492U JP 9449285 U JP9449285 U JP 9449285U JP S624129 U JPS624129 U JP S624129U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- external lead
- chip mounting
- resin
- connecting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5363—
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094492U JPH0351977Y2 (en:Method) | 1985-06-24 | 1985-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094492U JPH0351977Y2 (en:Method) | 1985-06-24 | 1985-06-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624129U true JPS624129U (en:Method) | 1987-01-12 |
| JPH0351977Y2 JPH0351977Y2 (en:Method) | 1991-11-08 |
Family
ID=30653056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985094492U Expired JPH0351977Y2 (en:Method) | 1985-06-24 | 1985-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0351977Y2 (en:Method) |
-
1985
- 1985-06-24 JP JP1985094492U patent/JPH0351977Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351977Y2 (en:Method) | 1991-11-08 |