JPS6240867U - - Google Patents
Info
- Publication number
- JPS6240867U JPS6240867U JP13296885U JP13296885U JPS6240867U JP S6240867 U JPS6240867 U JP S6240867U JP 13296885 U JP13296885 U JP 13296885U JP 13296885 U JP13296885 U JP 13296885U JP S6240867 U JPS6240867 U JP S6240867U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- flat package
- lead terminal
- mounting pattern
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13296885U JPS6240867U (zh) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13296885U JPS6240867U (zh) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240867U true JPS6240867U (zh) | 1987-03-11 |
Family
ID=31032847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13296885U Pending JPS6240867U (zh) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240867U (zh) |
-
1985
- 1985-08-29 JP JP13296885U patent/JPS6240867U/ja active Pending
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