JPS6240471Y2 - - Google Patents
Info
- Publication number
- JPS6240471Y2 JPS6240471Y2 JP1981014077U JP1407781U JPS6240471Y2 JP S6240471 Y2 JPS6240471 Y2 JP S6240471Y2 JP 1981014077 U JP1981014077 U JP 1981014077U JP 1407781 U JP1407781 U JP 1407781U JP S6240471 Y2 JPS6240471 Y2 JP S6240471Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- groove
- supplementary heat
- supplementary
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 239000002470 thermal conductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
【考案の詳細な説明】
本考案は補足用ヒートシンクを増結することに
より、放熱効果を補足するヒートシンク装置に関
するものである。[Detailed Description of the Invention] The present invention relates to a heat sink device that supplements the heat dissipation effect by adding a supplementary heat sink.
従来、オーデイオ機器のヒートシンクの設計に
於ては放熱部品のパワー等を考慮してヒートシン
クの大きさ、形状、厚み等を変化させていた。こ
の場合放熱部品の変更、パワー等の変更により、
設計を変更する必要が生じ、押出し金型、プレス
金型を変更せねばならず、変更に要する期間が長
くかかり、変更費用が多くかかる欠点があつた。 Conventionally, when designing a heat sink for audio equipment, the size, shape, thickness, etc. of the heat sink have been changed in consideration of the power of the heat dissipating component. In this case, due to changes in heat dissipation parts, power, etc.
It became necessary to change the design, and the extrusion mold and press mold had to be changed, which had the disadvantage that the change took a long time and the change cost was high.
本考案は上記欠点を取除く為に考案されたもの
で、図面に示す実施例について説明すれば、第１
図、第２図に示すごとく、ヒートシンク基体１の
フイン５の先端部６に、補足用ヒートシンク２の
胴部に形成した膨大突部３を嵌入して結合する空
隙部７を有する溝４が形成され、前記補足用ヒー
トシンク２の胴部の前記膨大突部３とは反対側の
面に、上記空隙部７を有する溝４と同一形状をし
た空隙部７′を有する溝４′が形成されており、当
該溝４′に前記補足用ヒートシンク２と同一形状
をした別の補足用ヒートシンク２′の膨大突部
３′を嵌入結合することにより、前記ヒートシン
ク基体１のフイン５を更に延長して必要に応じて
複数個の補足用ヒートシンクを増結し得る構造と
なしたことを特徴とするヒートシンク装置であ
る。 The present invention was devised to eliminate the above-mentioned drawbacks, and if the embodiment shown in the drawings is explained, the first
As shown in FIGS. 2 and 2, a groove 4 having a cavity 7 into which the enlarged protrusion 3 formed on the body of the supplementary heat sink 2 is fitted is formed in the tip 6 of the fin 5 of the heat sink base 1. A groove 4' having a cavity 7' having the same shape as the groove 4 having the cavity 7 is formed on the side of the body of the supplementary heat sink 2 opposite to the enlarged protrusion 3. Then, by fitting and coupling the large protrusion 3' of another supplementary heat sink 2' having the same shape as the supplementary heat sink 2 into the groove 4', the fins 5 of the heat sink base 1 can be further extended as necessary. This heat sink device is characterized by having a structure in which a plurality of supplementary heat sinks can be added according to the requirements.
尚、前記膨大突部３を溝４又は溝４′に嵌入す
るとき、該膨大突部３と溝４又は溝４′の間にシ
リコングリースのような熱の良導体の塗布するこ
とにより、増結された補足用ヒートシンクの放熱
効果を、より一層高めることができる。 Incidentally, when the enlarged protrusion 3 is inserted into the groove 4 or 4', a good thermal conductor such as silicone grease is applied between the enlarged protrusion 3 and the groove 4 or 4'. The heat dissipation effect of the supplementary heat sink can be further enhanced.
本考案は上記のような構造になつているので、
ヒートシンク基体１の放熱面積が少くて放熱効果
が不足の場合、必要なだけ補足用ヒートシンクを
増結することにより放熱面積の拡大を計ることを
可能とする簡単で有効な考案である。 Since the present invention has the structure described above,
This is a simple and effective idea that makes it possible to expand the heat radiation area by adding as many supplementary heat sinks as necessary when the heat radiation effect is insufficient due to the small heat radiation area of the heat sink base 1.
第１図は本考案ヒートシンク基体の断面図、第
２図は本考案補足用ヒートシンクの断面図。
１はヒートシンク基体、２，２′は補足用ヒー
トシンク、３，３′は突出部、４，４′は溝、５は
フイン、６は先端部、７，７′は空隙部。
FIG. 1 is a cross-sectional view of the heat sink base of the present invention, and FIG. 2 is a cross-sectional view of the supplementary heat sink of the present invention. 1 is a heat sink base, 2 and 2' are supplementary heat sinks, 3 and 3' are protrusions, 4 and 4' are grooves, 5 is a fin, 6 is a tip, and 7 and 7' are voids.
Claims (1)
補足用ヒートシンク２の胴部の一方の面に形成さ
れている膨大突部３を嵌入して結合する、空隙部
７を有する溝４が形成され、前記補足用ヒートシ
ンク２の胴部の前記膨大突部３とは反対側の面
に、上記空隙部７を有する溝４と同一形状をした
空隙部７′を有する溝４′が形成されており、当該
溝４′に前記補足用ヒートシンク２と同一形状を
した別の補足用ヒートシンク２′の膨大突部３′を
嵌入結合することにより必要に応じて複数個の補
足用ヒートシンクを増結し得る構造となしたこと
を特徴とするヒートシンク装置。 At the tip 6 of the fin 5 of the heat sink base 1,
A groove 4 having a gap 7 is formed into which the large protrusion 3 formed on one side of the body of the supplementary heat sink 2 is fitted and coupled, and the large protrusion 3 on the body of the supplementary heat sink 2 is fitted into the groove 4. A groove 4' having a cavity 7' having the same shape as the groove 4 having the cavity 7 is formed on the surface opposite to the part 3. A heat sink device characterized in that it has a structure in which a plurality of supplementary heat sinks can be added as needed by fitting and coupling a large protrusion 3' of another shaped supplementary heat sink 2'.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981014077U JPS6240471Y2 (en) | 1981-02-02 | 1981-02-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981014077U JPS6240471Y2 (en) | 1981-02-02 | 1981-02-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57128195U JPS57128195U (en) | 1982-08-10 |
| JPS6240471Y2 true JPS6240471Y2 (en) | 1987-10-16 |
Family
ID=29812141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981014077U Expired JPS6240471Y2 (en) | 1981-02-02 | 1981-02-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240471Y2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5855835Y2 (en) * | 1979-03-06 | 1983-12-21 | パイオニア株式会社 | power amplifier |
-
1981
- 1981-02-02 JP JP1981014077U patent/JPS6240471Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57128195U (en) | 1982-08-10 |
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