JPS6240401Y2 - - Google Patents
Info
- Publication number
- JPS6240401Y2 JPS6240401Y2 JP13020181U JP13020181U JPS6240401Y2 JP S6240401 Y2 JPS6240401 Y2 JP S6240401Y2 JP 13020181 U JP13020181 U JP 13020181U JP 13020181 U JP13020181 U JP 13020181U JP S6240401 Y2 JPS6240401 Y2 JP S6240401Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- printed
- resin
- copper foil
- carbon resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 229910052799 carbon Inorganic materials 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 125000004122 cyclic group Chemical group 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Description
【考案の詳細な説明】
本考案は、カーボンレジン系抵抗体を有する印
刷抵抗基板の改良に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an improvement of a printed resistor substrate having a carbon resin resistor.
従来、カーボンレジン系の抵抗ペーストを用い
て製造されたプリント基板は第１図ａ，ｂのよう
な構造を有している。同図において１は絶縁基
板、２は銅箔パターン、３は銀ペースト、４は銀
ペースト３に接するように印刷されたカーボンレ
ジン系抵抗体である。 Conventionally, a printed circuit board manufactured using a carbon resin-based resistance paste has a structure as shown in FIGS. 1a and 1b. In the figure, 1 is an insulating substrate, 2 is a copper foil pattern, 3 is a silver paste, and 4 is a carbon resin resistor printed so as to be in contact with the silver paste 3.
以上のように従来においては、カーボンレジン
系抵抗体４は銀ペースト３を介在して銅箔パター
ン２に接続されているが、これは直接カーボンレ
ジン系抵抗体４を銅箔パターン２に印刷した場合
には、乾燥工程（〜150℃）において両者の接触
部に銅の酸化物が生じて接触抵抗の増大や雑音の
発生の原因となるのでこれを防止するためであ
る。 As described above, conventionally, the carbon resin resistor 4 is connected to the copper foil pattern 2 via the silver paste 3, but in this case, the carbon resin resistor 4 is directly printed on the copper foil pattern 2. This is to prevent copper oxides from forming in the contact area between the two during the drying process (up to 150° C.), which can cause an increase in contact resistance and the generation of noise.
このように従来においては銀ペーストを必要と
するために、コストアツプは避けられない。 As described above, since silver paste is required in the conventional method, an increase in cost is unavoidable.
本考案は以上の欠点を除去するためなされたも
ので、環元性レジンを含有するカーボンレジン系
抵抗体を印刷することにより銅の酸化物の生成を
防止して銀ペーストの使用を不要となした印刷抵
抗基板を提供することを目的とするものである。
以下図面を参照して本考案実施例を説明する。 The present invention was developed to eliminate the above-mentioned drawbacks, and by printing a carbon resin resistor containing a cyclic resin, it prevents the formation of copper oxides and eliminates the need for silver paste. The purpose of the present invention is to provide a printed resistor substrate with a high quality.
Embodiments of the present invention will be described below with reference to the drawings.
第２図ａ，ｂは本考案実施例による印刷抵抗基
板を示す上面図および断面図で、カーボンレジン
系抵抗体４は直接に銅箔パターン２面に接するよ
うに形成される。このカーボンレジン系抵抗体４
を形成するには、予めカーボンレジンに環元性レ
ジン例えばヒドロキリニ系に属するピロカラコー
ル誘導体を混合したペーストを用いて、基板１表
面の銅箔パターン２に接するように印刷する。続
いて乾燥処理することにより不要物を除去させて
カーボンレジン系抵抗体４となすことができ、環
元性レジンの存在により銅の酸化物は形成されな
い。 FIGS. 2a and 2b are a top view and a cross-sectional view of a printed resistor board according to an embodiment of the present invention, in which the carbon resin resistor 4 is formed in direct contact with the copper foil pattern 2. FIG. This carbon resin resistor 4
To form the pattern, a paste prepared by mixing carbon resin with a cyclic resin such as a pyrocaracol derivative belonging to the hydroquilinylic group is used and printed so as to be in contact with the copper foil pattern 2 on the surface of the substrate 1. Subsequently, by drying, unnecessary substances can be removed to form the carbon resin resistor 4, and no copper oxide is formed due to the presence of the cyclic resin.
上記環元性レジンとしては他のレジンのラジカ
ル又はイオン反応の禁止剤として働くものであつ
てならず、さらにレジンの硬化反応を妨げるもの
であつてはならない。この条件を満足するもので
あれば上記実施例に示したものに限らず他の環元
性レジンを用いることができる。 The above-mentioned cyclic resin must not act as an inhibitor of radical or ionic reactions of other resins, and must not interfere with the curing reaction of the resin. As long as it satisfies this condition, it is possible to use not only those shown in the above embodiments but also other cyclic resins.
以上述べて明らかなように本考案実施例によれ
ば、環元性レジンを含有するカーボンレジン系抵
抗体を印刷するように構成するものであるから、
銀ペーストの使用は不要となすことができる。し
たがつて高価な銀ペーストを使用しないので材料
費をダウンさせることができると共に、製造工程
も簡略化されるのでコストダウンを計ることがで
きる。 As is clear from the above description, according to the embodiment of the present invention, the carbon resin resistor containing the cyclic resin is printed.
The use of silver paste can be made unnecessary. Therefore, since expensive silver paste is not used, material costs can be reduced, and the manufacturing process is also simplified, so costs can be reduced.
第１図ａ，ｂは従来例を示す上面図および断面
図、第２図ａ，ｂは本考案実施例を示す上面図お
よび断面図である。
１……基板、２……銅箔パターン、３……銀ペ
ースト、４……カーボンレジン系抵抗体。
1A and 1B are a top view and a sectional view showing a conventional example, and FIGS. 2A and 2B are a top view and a sectional view showing an embodiment of the present invention. 1...Substrate, 2...Copper foil pattern, 3...Silver paste, 4...Carbon resin resistor.
Claims (1)
うに印刷された還元性レジンを含有するカーボン
レジン系抵抗体とを含むことを特徴とする印刷抵
抗基板。 A printed resistance board comprising a copper foil pattern and a carbon resin resistor containing a reducing resin printed in contact with the copper foil pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13020181U JPS5834701U (en) | 1981-09-01 | 1981-09-01 | printed resistance board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13020181U JPS5834701U (en) | 1981-09-01 | 1981-09-01 | printed resistance board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5834701U JPS5834701U (en) | 1983-03-07 |
| JPS6240401Y2 true JPS6240401Y2 (en) | 1987-10-16 |
Family
ID=29923842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13020181U Granted JPS5834701U (en) | 1981-09-01 | 1981-09-01 | printed resistance board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834701U (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04133350U (en) * | 1991-02-12 | 1992-12-11 | 古河電池株式会社 | Storage battery equipped with bulk water replenishment device |
-
1981
- 1981-09-01 JP JP13020181U patent/JPS5834701U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5834701U (en) | 1983-03-07 |
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