JPS6239967U - - Google Patents
Info
- Publication number
- JPS6239967U JPS6239967U JP1985132696U JP13269685U JPS6239967U JP S6239967 U JPS6239967 U JP S6239967U JP 1985132696 U JP1985132696 U JP 1985132696U JP 13269685 U JP13269685 U JP 13269685U JP S6239967 U JPS6239967 U JP S6239967U
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- fixed table
- semiconductor wafer
- wafer
- wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims 3
- 238000007517 polishing process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Description
第１図は本考案の実施例の正面図、第２図はそ
の平面図、第３図は本考案の動作を説明するため
の概略図、第４図は研磨時の固定テーブルと研磨
ヘツドとの関係を示す側面図、第５図は従来の研
磨装置の斜視図である。
１：ウエハ搬入装置本体、２：研磨装置本体、
３：ウエハ搬出装置本体、４：搬送装置。
Fig. 1 is a front view of an embodiment of the present invention, Fig. 2 is a plan view thereof, Fig. 3 is a schematic diagram for explaining the operation of the present invention, and Fig. 4 shows the fixed table and polishing head during polishing. FIG. 5 is a side view showing the relationship between the two, and FIG. 5 is a perspective view of a conventional polishing apparatus. 1: Wafer loading device main body, 2: Polishing device main body,
3: Wafer unloading device main body, 4: Transfer device.
Claims (1)
研磨用砥石に対して研磨すべき半導体ウエハを固
定するとともに砥石に対して接近、上下、回転駆
動される固定テーブルと、待機位置および各固定
テーブル上にある半導体ウエハを次の研磨工程に
応じた固定テーブルおよびウエハ搬出位置に順次
吸着して搬送する搬送装置とを備えたことを特徴
とする半導体ウエハ用研磨装置。 A plurality of polishing wheels for different types of polishing, a fixed table that fixes the semiconductor wafer to be polished to each polishing wheel and is driven to approach, up and down, and rotate relative to the grinding wheel, and a standby position and each 1. A semiconductor wafer polishing apparatus, comprising a transfer device that sequentially suctions and transfers a semiconductor wafer on a fixed table to a fixed table and a wafer unloading position according to the next polishing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985132696U JPS6239967U (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985132696U JPS6239967U (en) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6239967U true JPS6239967U (en) | 1987-03-10 |
Family
ID=31032326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985132696U Pending JPS6239967U (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239967U (en) |
-
1985
- 1985-08-29 JP JP1985132696U patent/JPS6239967U/ja active Pending
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