JPS623985B2 - - Google Patents

Info

Publication number
JPS623985B2
JPS623985B2 JP56038743A JP3874381A JPS623985B2 JP S623985 B2 JPS623985 B2 JP S623985B2 JP 56038743 A JP56038743 A JP 56038743A JP 3874381 A JP3874381 A JP 3874381A JP S623985 B2 JPS623985 B2 JP S623985B2
Authority
JP
Japan
Prior art keywords
heat
porous sintered
sintered layer
heat dissipation
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56038743A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57153458A (en
Inventor
Tooru Morimoto
Toshihisa Oogaki
Kyoshi Nakanishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NDC Co Ltd
Original Assignee
NDC Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NDC Co Ltd filed Critical NDC Co Ltd
Priority to JP56038743A priority Critical patent/JPS57153458A/ja
Publication of JPS57153458A publication Critical patent/JPS57153458A/ja
Publication of JPS623985B2 publication Critical patent/JPS623985B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56038743A 1981-03-19 1981-03-19 Heat radiating material Granted JPS57153458A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56038743A JPS57153458A (en) 1981-03-19 1981-03-19 Heat radiating material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56038743A JPS57153458A (en) 1981-03-19 1981-03-19 Heat radiating material

Publications (2)

Publication Number Publication Date
JPS57153458A JPS57153458A (en) 1982-09-22
JPS623985B2 true JPS623985B2 (enExample) 1987-01-28

Family

ID=12533789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56038743A Granted JPS57153458A (en) 1981-03-19 1981-03-19 Heat radiating material

Country Status (1)

Country Link
JP (1) JPS57153458A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02163490A (ja) * 1988-12-16 1990-06-22 Matsushita Refrig Co Ltd 回転式圧縮機

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10055454A1 (de) * 2000-11-09 2002-05-23 Fujitsu Siemens Computers Gmbh Kühlkörper
DE10343020B4 (de) * 2003-09-16 2018-01-18 Mayser Holding Gmbh & Co. Kg Kühlkörper, insbesondere für elektronische Bauelemente
DE10346423B4 (de) * 2003-10-07 2006-07-13 M.Pore Gmbh Modularer Wärmetauscher
JP2016184648A (ja) * 2015-03-26 2016-10-20 住友電気工業株式会社 ヒートシンク及び電子機器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02163490A (ja) * 1988-12-16 1990-06-22 Matsushita Refrig Co Ltd 回転式圧縮機

Also Published As

Publication number Publication date
JPS57153458A (en) 1982-09-22

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