JPS6239567Y2 - - Google Patents
Info
- Publication number
- JPS6239567Y2 JPS6239567Y2 JP1984168479U JP16847984U JPS6239567Y2 JP S6239567 Y2 JPS6239567 Y2 JP S6239567Y2 JP 1984168479 U JP1984168479 U JP 1984168479U JP 16847984 U JP16847984 U JP 16847984U JP S6239567 Y2 JPS6239567 Y2 JP S6239567Y2
- Authority
- JP
- Japan
- Prior art keywords
- melting point
- point metal
- low melting
- metal body
- insulating substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 16
- 239000002184 metal Substances 0.000 claims description 16
- 230000008018 melting Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 5
- 239000012212 insulator Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Description
【考案の詳細な説明】
産業上の利用分野
本考案は温度ヒユーズの改良に関するものであ
る。[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improvement in a temperature fuse.
先行技術と問題点
温度ヒユーズとして、第４図に示すように絶縁
基板１′（セラミツク板）の片面に電極２′，２′
を設け、電極間に低融点金属体３′を橋設し、各
電極にリード導体４′，４′を接続し、上記絶縁基
板上に絶縁物５′をオーバコートしたもの（所
謂、基板型温度ヒユーズ）が公知である。Prior Art and Problems As a temperature fuse, electrodes 2', 2' are placed on one side of an insulating substrate 1' (ceramic board) as shown in Figure 4.
A low melting point metal body 3' is provided as a bridge between the electrodes, lead conductors 4', 4' are connected to each electrode, and an insulator 5' is overcoated on the insulating substrate (so-called substrate type). temperature fuses) are well known.
この温度ヒユーズにおいては、絶縁基板の片面
側から低融点金属体への熱伝達特性と、絶縁基板
の他面側から低融点金属体への熱伝達特性とが相
違し、従つて、方向性があり、取付け方向を誤る
と温度ヒユーズを正常に作動させ得ない。 In this temperature fuse, the heat transfer characteristics from one side of the insulating substrate to the low melting point metal body are different from the heat transfer characteristics from the other side of the insulating substrate to the low melting point metal body, and therefore the directionality is different. Yes, if the installation direction is incorrect, the temperature fuse will not work properly.
考案の目的
本考案の目的は方向性のない基板型温度ヒユー
ズを提供することにある。Purpose of the invention The purpose of the present invention is to provide a non-directional substrate-type temperature fuse.
考案の構成
本考案に係る温度ヒユーズは、絶縁基板の先端
端面に低融点金属を配設し、該低融点金属体の両
端を各リード導体に導通し、上記低融点金属体を
絶縁体で被覆したことを特徴とする構成である。Structure of the invention The temperature fuse according to the invention has a low melting point metal disposed on the tip end face of an insulating substrate, both ends of the low melting point metal body are electrically connected to each lead conductor, and the low melting point metal body is covered with an insulator. This configuration is characterized by the following.
実施例の説明 以下、図面により本考案を説明する。Description of examples The present invention will be explained below with reference to the drawings.
第１図は本考案に係る温度ヒユーズを示す説明
図、第２図は第１図における−断面説明図、
第３図は第１図における−断面説明図であ
る。 FIG. 1 is an explanatory diagram showing a temperature fuse according to the present invention, FIG. 2 is an explanatory diagram of a cross section in FIG. 1,
FIG. 3 is an explanatory diagram of the - cross section in FIG. 1.
図において、１は絶縁基板、例えばセラミツク
ス板であり、両端に電極２，２を取付けてある。
３は絶縁基板の先端端面に添設した低融点金属体
であり、両端を各電極に接合してある。４は低融
点金属体上に塗布せるフラツクスであり、樹脂を
用いることができる。５，５は各電極に接続せる
リード導体である。６は絶縁被覆である。 In the figure, reference numeral 1 denotes an insulating substrate, for example a ceramic plate, and electrodes 2, 2 are attached to both ends.
Reference numeral 3 denotes a low melting point metal body attached to the tip end face of the insulating substrate, and both ends are joined to each electrode. 4 is a flux that can be applied onto a low melting point metal body, and resin can be used. 5 and 5 are lead conductors connected to each electrode. 6 is an insulating coating.
上記の絶縁基板は低融点金属体、電極等に対す
る支持体として機能し、耐熱性樹脂板を絶縁基板
として使用することもできる。 The above-mentioned insulating substrate functions as a support for the low-melting point metal body, electrodes, etc., and a heat-resistant resin plate can also be used as the insulating substrate.
上記温度ヒユーズにおいては、低融点金属体、
すなわち、受熱によつて溶断作動する温度ヒユー
ズエレメントを絶縁基板の端面に添設してあり、
絶縁基板の上下面の何れからであつても、温度ヒ
ユーズエレメントへの熱伝達特性が等しいから、
方向性を排除できる。なお、電極の位置は、温度
ヒユーズの上記方向性に実質上、関与しないの
で、その位置は任意になし得る。 In the above temperature fuse, a low melting point metal body,
That is, a temperature fuse element that is blown by receiving heat is attached to the end face of the insulating substrate.
Since the heat transfer characteristics to the temperature fuse element are the same whether from the top or bottom of the insulating substrate,
Directionality can be eliminated. Note that the position of the electrode does not substantially affect the above-mentioned directionality of the temperature fuse, so the position can be set arbitrarily.
考案の効果
本考案に係る温度ヒユーズは上述した通りの構
成であり、熱伝達特性に対する方向性がないか
ら、取付方向の制約がなく、有利である。また、
絶縁基板が電極、低融点金属体に対し補強体とし
て機能するので、絶縁体６の被覆厚さを電気絶縁
上からのみ定めればよく、その被覆厚さを充分に
薄くでき、低融点金属体への熱伝達性を高くでき
る。従つて高感度作動を保証できる。Effects of the Invention The temperature fuse according to the present invention has the above-described configuration, and since there is no directionality with respect to heat transfer characteristics, there is no restriction on the mounting direction, which is advantageous. Also,
Since the insulating substrate functions as a reinforcement for the electrode and the low melting point metal body, it is only necessary to determine the coating thickness of the insulator 6 based on the electrical insulation, and the coating thickness can be made sufficiently thin and the low melting point metal body It can improve heat transfer to. Therefore, highly sensitive operation can be guaranteed.
第１図は本考案に係る温度ヒユーズを示す説明
図、第２図並びに第３図は第１図における−
断面説明図並びに−断面説明図、第４図は従
来公知の温度ヒユーズを示す説明図である。
図において、１は絶縁基板、２，２は電極、３
は低融点金属体、５，５はリード導体、６は絶縁
物である。
FIG. 1 is an explanatory diagram showing a temperature fuse according to the present invention, and FIGS. 2 and 3 are -
A cross-sectional explanatory view, a cross-sectional explanatory view, and FIG. 4 are explanatory views showing a conventionally known temperature fuse. In the figure, 1 is an insulating substrate, 2 and 2 are electrodes, and 3
is a low melting point metal body, 5, 5 is a lead conductor, and 6 is an insulator.
Claims (1)
該低融点金属体の両端を各リード導体に導通し、
上記低融点金属体を絶縁体で被覆したことを特徴
とする温度ヒユーズ。 A low melting point metal body is placed on the tip end face of the insulating substrate,
Connecting both ends of the low melting point metal body to each lead conductor,
A temperature fuse characterized in that the above-mentioned low melting point metal body is covered with an insulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168479U JPS6239567Y2 (en) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984168479U JPS6239567Y2 (en) | 1984-11-05 | 1984-11-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6182339U JPS6182339U (en) | 1986-05-31 |
| JPS6239567Y2 true JPS6239567Y2 (en) | 1987-10-08 |
Family
ID=30726248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984168479U Expired JPS6239567Y2 (en) | 1984-11-05 | 1984-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6239567Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337032B2 (en) * | 1974-04-26 | 1978-10-06 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722356Y2 (en) * | 1976-09-06 | 1982-05-14 |
-
1984
- 1984-11-05 JP JP1984168479U patent/JPS6239567Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337032B2 (en) * | 1974-04-26 | 1978-10-06 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6182339U (en) | 1986-05-31 |
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