JPS6237986A - Wrought conducting circuit board and reinforcement thereof - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] <Industrial Application Field> The present invention relates to a novel processed conductive circuit board and a new reinforcing method thereof. The aim is to produce substrates with precise conductive circuit patterns, such as those for sheet switches, and to provide them to the market as materials for industrial use, industrial use, daily necessities, etc.

<Details of the structure of the invention> Conventionally, conductive circuit boards have been produced by printing methods, photoresist etching methods, masking vapor deposition methods, laser etching methods, chemical dissolution methods, etc.
Various difficulties arise in terms of accuracy, productivity, economic efficiency, and technical aspects, and when it comes to particularly complex or minute designs, no matter which known manufacturing method is used, it is difficult to achieve precision and beauty. The disadvantage is that it is difficult to consistently produce high-quality products. The present inventor has continued research for many years on a new method to solve these drawbacks all at once, and has now finally completed the present invention.

That is, the present inventor brought an electroless plating mixture into contact with a conductive substrate on which a circuit pattern made of a conductive polymer containing a heteroatom was formed on the surface of a plastic molded product by electrolytic polymerization, The present invention has invented a method for reinforcing a processed conductive circuit board, characterized in that it is obtained by plating a part or all of it, and a method for reinforcing a processed conductive circuit board, which is characterized in that the processed conductive circuit board thus obtained is covered with an adhesive film. It is something.

Conductive polymers containing heteroatoms include polyaniline, nuclear-substituted polyaniline, polynaphthylamine, polyaminoanthracene, nuclear-substituted polyaminoanthracene, polythiophene, nuclear-substituted polythiophene, polypyrrole, substituted polypyrrole, polypyrazole,
substituted polypyrazole, polyimidazole, substituted polyimidazole, polytriazole, substituted polytriazole,
Polypyridine, nuclear substituted polypyridine, polydiazine, substituted polydiazine, polytriazine, substituted polytriazine, polyoxazine, substituted polyoxazine, polybenzothiophene, substituted polybenzothiophene, polybenzopyrrole, substituted polybenzopyrrole, polybenzpyrazole, substituted polybenz Pyrazole, polybenzimidazole, substituted polybenzimidazole, polyoxadiazole, polythiadiazole, polyazobenzene, substituted polyazobenzene, polyphthalocyanine, nuclear-substituted polyphthalocyanine, polycarbazole, substituted polycarbazole, polyquinoline, nuclear-substituted polyquinoline, polybenzoxazole , substituted polybenzoxazole, polytetra(naphthylo)tetraazaporphyrin, and polytetra(phenanthro)tetraazaporphyrin.

Plastic molded products include polyvinyl chloride, polyvinylidene chloride, vinyl chloride copolymers, polyvinyl fluoride, polyvinylidene fluoride, polyester, polyamide, polyvinyl carbazole, polyether, polyether ester, chlorinated polyolefin, polyamideimide, poly A membrane, film, sheet, or plate based on at least one polymer selected from the group consisting of ether sulfone, polyimide, polyamino bismaleimide, polysulfone, and polystyrene.

Examples of methods for forming circuit patterns using conductive polymers on the surface of plastic moldings by electrolytic polymerization include laminates in which circuit patterns are formed using conductive substances such as metals,
An aromatic compound having a hetero atom between the thin plate and the electrode by placing a thin plastic plate in close contact with the circuit pattern surface of the metal or the like using a film or a substrate, and installing an electrode opposite to the thin plastic plate; A method is to form a circuit pattern on the thin plate by filling it with an electrolytic solution consisting of a strong electrolyte and a polar organic solvent containing no active hydrogen atoms, and applying electricity between the metal circuit pattern and the electrode to cause electrolysis. be.

A mixture for electroless plating is brought into contact with the conductive substrate thus formed, and part or all of the circuit pattern is plated.

A mixture for electroless plating is a solution or mixture consisting of a compound of at least one metal selected from the group consisting of gold, silver, copper, platinum, haladium, chromium, iron, cobalt, nickel, and vanadium, and a reducing agent. be.

In the first place, plating that does not require electrolysis includes solution plating, penetrating plating,
There are metal spraying, cathode sputtering, vacuum evaporation, chemical plating, and immersion plating, but the one used in the present invention is mainly chemical plating, and to achieve the purpose, the following electroless plating is used. A plating mixture is used. For example, there are acid baths and ammonia baths for nickel plating and cobalt plating, and they are given various names depending on their compositions, as shown below.

■Hydroxyacetate・nickel acid bathNiCl□・
6H2030g/I, NaHzPOz・HzO10g/l, HOCH2COOH35g/I.

NaOH neutralization amount (pH 4-6).

■Titrate/acetate/nickel acid bath NiCl2
・6Hz0 30g/l.

NaHzPOz・HzOLog/I, Na zcbHso7・5.5 H2015g/I
.

CH3COON a 5 g / + 1 NaOH neutralization! (pH 4-6).

■Lactate/propionate/nickel acid bathNiC
l2.6H2026g/11 NaH2PO2・H2024g/L CH3CHOHCOOH27g/I, C2H3CO
OH2.2g/l, Pb'' 0.002g/I, NaOH neutralization amount (pH 4-6).

■Fluoride/nickel acid bath NiSO4・6H2030g/I.

NaH2PO2・H2030g/l, NH4F 15g/l, Appropriate amount of NaOH (pH 6-7).

■Titrate nickel ammonia bath N1CIz・6
H, 030g/l.

Na H2POz・Hzo 10 g/], Na
3 Cb Hs○t・5.5 H20100g/ 11
NHaCI 50 g/1, NH4OH neutralization amount (pH 8-10).

■Pyrophosphate/nickel ammonia bath NaSO
4.6Hz0 25g/l, 1NaHzPOz
-H2025g/I, NaaPzO750g/11 NH,OH neutralization 1L (pH 10-11).

■Titrate/cobalt ammonia bath COCl2/6
H2030g/l.

NaHzPOz-H2020g/l.

Na5CbH50, 5.5Hz0 35g/l, NH
4C150g/I, NH,OH neutralization amount (pH 9-10).

■Rossel salt/cobalt/nickel ammonia bath N i C12/6Lgo 30g/LCoC1□
・6H2030g/l, N a HgP O□・HzO20g/l.

NH4Cl　　　50g/l.

CaH4KNaO,, 4Hz0 200g/l, N
H4OH neutralization! (pH 8-10).

As shown above, the mixture for electroless plating contains a metal compound and a reducing agent as main components, and a pH value as an auxiliary component.
It includes regulators, buffers, complexing agents, accelerators, stabilizers, improving agents, and the like.

Regardless of whether the electroless plating bath is acidic or alkaline, the commonly used reducing agents are sodium hyposulfite, sodium sulfite, sodium hypophosphite, phosphorous acid, sodium borohydride, hydrazine, hydrazine salts, These include tartaric acid, tartrate, glucose, aminoborane, glycerin, sodium N,N-diethylglycine, and formalin. Among the auxiliary ingredients, sodium hydroxide, ammonium hydroxide, inorganic acids, and organic acids are often used as pH adjusting agents, and as buffering agents, sodium citrate, sodium acetate, alkali borate, alkali carbonate,
Alkali phosphate and the like are commonly used.

Complexing agents are added to prevent metal compounds from precipitating out of the plating bath; preferred reagents that form metal complex ions include alkali citrate, alkali acetate, alkali glycolate, and alkali cyanide. , alkali tartrate, thioglycolic acid, thiourea, ammonia, hydrazine, triethanolamine, ethylenediamine, glycine, 0-aminophenol, pyridine, ethylenediaminetetraacetic acid, and the like.

Accelerators promote plating and suppress gas generation to improve metal deposition efficiency, and small amounts of sulfides and fluorides are added. Stabilizers are used to suppress the natural decomposition (aging and unnecessary reduction) of the plating bath, and lead chlorides, sulfides, and nitrates are used in small amounts. A modifier is something that improves the condition of a plating film; for example, a small amount of a surfactant is used to improve gloss.

Sodium citrate, sodium acetate, sodium succinate, malic acid, glycine, etc. are the above buffers, accelerators,
It is an adjuvant that has the ability of a complexing agent and is very commonly used.

Contacting with such an electroless plating mixture is accomplished by immersing the conductive substrate in a plating bath, applying, spraying, or printing the plating bath onto the conductive substrate. In this case, the number of parts that come into contact with the plating bath may be large or small, and the range of application should be determined depending on the application.

When the above electroless plating mixture is brought into contact with a conductive substrate on which a circuit pattern made of a conductive polymer containing heteroatoms is formed, unless the surface of the plastic molded product has been activated by pretreatment. Plating usually occurs concentrated on the circuit pattern area, and the plating usually falls off from areas other than the circuit pattern due to washing or the like. This effect is remarkable when the surface of the plastic molded product is water repellent or liquid repellent. Therefore, in order to plate the through holes of a printed wiring board, it is necessary to pre-activate only this part so that unnecessary IΩ water resistance or liquid repellency does not occur in this part.

This pre-activation treatment is preferably carried out in the usual manner, such as trichlene cleaning, alkaline degreasing, water washing, pickling, palladium chloride liquid impregnation, stannous chloride liquid impregnation, etc.

Although the processed conductive circuit board obtained through the above method is plated only in a predetermined portion, the plated film obtained by electroless plating is generally very thin, with a thickness of 1
Since it is 0 μm or less, it may be difficult to say that it has sufficient physical and mechanical strength.

Therefore, the inventor of the present invention devised a method to provide sufficient strength for practical use by covering and reinforcing the processed conductive substrate with an adhesive film.

Covering with this adhesive film can be achieved by laminating a Blastisox film on the substrate, or by coating or printing with a paint or ink containing plastics, or the like. Of course, at this time, an appropriate adhesive may be used to strengthen the adhesion to the substrate, or pressure, heating, etc. may be used. Furthermore, in order to achieve perfect adhesion, it is extremely effective to use plastics that are compatible with or react with the plastics used for the substrate and to integrate them with the substrate.

If the plastic used for the substrate is a polyester film, and if the same or other plastics are to be adhered to it, a polyvinyl-based, polyacrylic-based, or polyurethane-based adhesive is required; however, polyvinyl chloride film, In the case of polystyrene film, polycarbonate film, polyamide film, or polyacrylic film, it is easy to adhere the same type of plastic or other plastics to it, so it may be used in the presence of a relatively small amount of adhesive or plasticizer, or in the presence of a relatively small amount of adhesive or plasticizer. The purpose can be achieved by applying the desired plastics solution in the absence of any material or simply by hot-pressing the plastics film. In any case, by adopting the above-mentioned reinforcing properties, the conductive circuit is not only stabilized by being isolated from the outside air only in the necessary parts, but also becomes strong against bending and bending, making it difficult to use as a film connector or printed circuit board. It will withstand heavy use. Of course, the substrate whose conductivity has been improved in this manner can be further subjected to tertiary processing and quaternary processing to produce a product with high commercial value.

The present inventor has carried out numerous implementations of the present invention described above and has confirmed the novelty and superiority of the present invention.
Furthermore, in order to clarify the technical content of the present invention, a few representative examples will be extracted from a large number of examples and will be shown below as examples. Therefore, the present invention should not be construed as being limited only to the embodiments shown below, and the embodiments may be arbitrarily modified and implemented without departing from the spirit and spirit of the present invention. Of course.

<Example> Example 1 50 layers of polypropylene sheet I with a thickness of IR and nickel plates with a thickness of 0.5 ml were laminated alternately, and the top and bottom of this laminate were covered with thick unsaturated polyester resin FRP plates. Using a scissor bolt and a Nando, the same pressure is applied so that the net thickness of the laminated portion is 68 to 72° C.m to form a solid product. Then, move this laminated material perpendicularly (90°) to the laminating direction.
Or cut at a nearly vertical angle (80°). The cut surface is buffed and polished with sandpaper, washed with acetone, and dried to make it completely clean. Apply purified polyvinyl chloride with a high degree of polymerization to this cut surface using a solvent (tetrahydrofuran 90%
% + 10% cyclohexanone) is applied in a clean room and the solvent is removed by blowing dry air to form a film of polyvinyl chloride with a thickness of 0.31111. The nickel plate of this laminate was used as an anode, and the nickel plate having an area slightly larger than the cut area was used as a cathode, which was placed facing the anode with a gap of about 2 cm between them. This is submerged in a desiccator filled with an electrolytic solution, degassed under reduced pressure, and then energized. The electrolyte is a mixture of 0.2 mol of tetrapropylammonium verchlorate and 0.1 mol of virol in a mixture of propylene carbonate and acetonyl (1:1) In! The temperature is maintained at -15 to -5°C.

Electricity was applied for several hours at 2 mm and 0.6 mA/ct. During this operation time, a circuit with the same pattern as the linear surface of the nickel anode is formed on the side of the polyvinyl chloride film in contact with the cut surface, and it is observed that this circuit gradually becomes stronger, so that the current is applied. After completing this process, the electrodes are pulled up, immersed in acetone, thoroughly washed and dried, and then the polyvinyl chloride film is peeled off from the cut surface. The peeled film has a circuit pattern of the same thickness when cut perpendicular to the nickel linear surface on the cut surface, and a slightly thicker circuit pattern when cut at an angle close to perpendicular. is formed. In any case, the circuit pattern made of polypyrrole obtained here is σ-15~20S/
cm, but after humidifying and stretching this film in an acetonitrile solution saturated with KPF6 (20%),
When washed with acetone and dried, it was observed that the value changed to σ-25 to 30 S/e11 due to the effects of doping and stretching.

Example 2 The following liquid A was applied to the conductive substrate surface on which the circuit pattern obtained in Example 1 was formed, and after storing it in a cool and dark place for 1 hour, the excess liquid A was wiped off. After stacking polyvinyl formal sponge sheets impregnated with liquid B as shown and holding them between two glass plates for 20 minutes at 15 to 20°C, remove the sponge sheets, wash the board thoroughly with water, and dry it to form the first circuit pattern. A processed conductive circuit board was obtained with beautiful silver plating only on the .

Solution A: Dissolve 3.5 g of silver nitrate in 60 ml of water, add aqueous ammonia to this to form a precipitate, add enough aqueous ammonia to dissolve the precipitate, and then add 60 ml of aqueous sodium hydroxide solution (containing 2.5 g of NaOH). A mixture of.

B liquid niglucose 45g 1 tartaric acid 4g 1 alcohol 100
ml dissolved in 10100O of water.

Example 3 The polyvinyl chloride solution shown in Example 1 was applied to the surface of the processed conductive circuit board obtained in Example 2, dried by blowing dry air, and then molded under pressure at 70°C, resulting in silver plating. The processed conductive circuits are sandwiched together into a reinforced processed conductive circuit board. When this was cut into a predetermined shape and the conductivity of the circuit was measured, ρ = 1.6X10
-6ΩG.

Example 4 A number of films made of vacuum-deposited gold on polyethylene terephthalate are stacked one on top of the other, and then both ends are sandwiched between hard vinyl chloride resin plates and fixed by tightening with bolts and nuts. The vertical cut surface of this laminated film is cut using a lathe cutting tool, the surface is curved and smoothed by puffing, and then washed with methanol and dried. Next, a 20% dimethylformamide solution of polyacrylonitrile with a high degree of polymerization is applied to this curved cut surface and dried in a clean room to form a polyacrylonitrile film having a thickness of Q and 5 mm. From this hemispherical film 3
After spherical graphite electrodes were placed facing each other at a distance of cm, they were immersed in an electrolytic solution, and the voltage was set at 20 V with gold as the anode and graphite as the cathode.
A current of mA/crl+ is applied at 0° C. for 6 hours. The electrolyte was a mixture of 0.1 mole of thiophene and 1 mole of lithium perchlorate in acetonitrile-methyl-1,3-dioxolane (
2:1) has a composition dissolved in 1ρ. After electrolysis, the electrodes are pulled out of the electrolytic tank, and methyl-1,3
- After immersing in dioxolane and thoroughly washing, the polyacrylonitrile film is carefully peeled off from the curved cut surface without drying, placed on a curved rubber sponge, and dried under reduced pressure. On the curved cut side, that is, the convex surface, of the curved polyacrylonitrile obtained here, the circuit pattern of the same type and number as the gold wire embedded in polyethylene terephthalate is conductive polythiophene (ρ-5OS/cm).
is reproduced in detail. This method is an example of obtaining a spherical circuit board.
If a cut surface is made using a laminate in which the film is laminated in another form, such as a spiral, a fingerprint, or a wavy form, and the same procedure as described above is performed, various shapes will be created depending on the shape of the laminate and the shape of the cut surface. A board having a circuit pattern is obtained.

Example 5 When the conductive substrate on which the circuit pattern obtained in Example 4 is formed is immersed in the following 1:3 mixture of liquid A and liquid B, only the first circuit pattern is plated with copper. After washing and drying, a beautifully processed conductive circuit board was obtained.

Solution A: 11 g of water, 14 g of copper sulfate, and 4 gf of di-SiCl chloride
i: Dissolved and to which 53 ml of 37% formalin was added.

Solution B: 45.5 g of potassium sodium tartrate, 9.0 g of sodium hydroxide, and 4.2 g of sodium carbonate in water I
Dissolved in β.

In this case, the standard unipolar potential of steel is +0.3 compared to nickel.
34V, and even formalin, which has a weak reducing power, easily precipitates copper to form a circuit.

Example 6 The surface of the processed conductive circuit board obtained in Example 5 was coated with the polyacrylonitrile solution shown in Example 4 and dried, resulting in curved copper-plated conductive circuits sandwiched in a sandwich shape. This is a reinforced processed conductive circuit board, and the conductivity of the circuit part is ρ-1.5xlO-6Ωcm.
It had very good weather resistance.

Example 7 If half of the thiophene in Example 4 was replaced with pyrrole and the same operation was performed, a conductive circuit (σ-25
S/(to)) was obtained. Furthermore, by replacing thiophene in Example 4 with various monomers and using electrolytic reactions, circuit boards with patterns drawn on them can be obtained using polymers corresponding to the respective monomers.

The type of monomer and the conductivity of the obtained circuit pattern portion are shown in the following table.

Example 8 A conductive circuit board having a pattern obtained from β,β'-dimethylpyrrole shown in the table of Example 7 was immersed for 2 to 3 hours in three types of nickel plating baths ■ to ■ shown in the table below. Nickel plated.

Using any of the nickel plating baths ① to ②, processed conductive circuit boards with beautiful circuit patterns and nickel plating were obtained.

Example 9 A conductive circuit board having a pattern obtained from aniline shown in the table of Example 7 was subjected to two types of nickel plating baths (■, ■) shown in the following table.
Soak for 1 hour and nickel plate.

Using either of the nickel plating baths (1) and (2), processed conductive circuit boards with beautiful circuit patterns and nickel plating were obtained.

Example 10 A thin layer of polyvinylethyl ether adhesive solution was applied to the surface of the processed conductive circuit board obtained in Example 9, and after drying, a cellulose triacetate film was pressed and laminated to reinforce the circuit portion. The conductivity of ρ
-7x10-6Ω (2), making it very easy to use as a film connector.

Example 11 A conductive circuit board having a pattern made of the respective polymers obtained from phthalocyanine, 1-methylimidazole, and vinylpyridine obtained in Example 7 was immersed in the non-electrolytic plating solution shown in the following table to fabricate a conductive circuit. It was used as a substrate.

Example 12 After alternately layering polyethylene plates with a thickness of 10 tm and platinum plates with a thickness of O, ltm, they were fixed to form a block in the same manner as in Example 1. This laminate was cut vertically and the next layer was cut on this surface. Apply Plasti-Nox shown in the table dissolved in a solvent (chlorohenzene, isophorone, phenol or dimethylformamide), dry to form a uniform film with a thickness of 10 μm, and apply a paste-like electrolyte on top of this. . This electrolyte was made of a mixture of 60% acetonitrile, 20% propylene carbonate, and 20% dimethoxyethane.
After dissolving PF6 to a 1N solution and further dissolving virol to a 0.5N solution, aerosol silica was added to form a paste. The amount of coating was 3fi, and on top of that, an aluminum plate with a thickness of 111 was placed as a counter electrode, and after covering it with thick plastic tape to prevent the electrolyte part from coming into contact with air, it was applied at 3V and 1mA.
/afl is energized. In this experiment, it was necessary to store the electrolyte in a drying room to prevent air from entering or creating spaces in the electrolyte, and to prevent moisture absorption. 2
When electricity is applied for 0 minutes, polypyrrole is deposited on the 10 μm film only on the cut surface of the laminate in contact with the platinum plate. Very thin polypyrrole is colorless, but as it becomes thicker it becomes colored and eventually takes on a dark to black color.

The following table shows the conductivity of circuit patterns formed on plastic film surfaces.

Example 13 A mixed solution (gold chloride 10g, salt 5g
g, 800 ml of water) is applied, and after sufficient impregnation, the excess mixture is collected. Next, reducing solution (tartaric acid 22.5g
, sodium hydroxide 300g, xtanol 380ml,
Spray 600ml of water onto the board and leave it at room temperature to plate the circuit pattern with gold. Wash the board thoroughly with water and dry it. In this way, platinum, gold, which is generally a precious metal,
A desired metal such as palladium is easily precipitated from a solution of its salt by a weak reducing agent, and this metal adheres well to the conductive circuit pattern. In addition to tartaric acid, formalin,
Glucose, glycerin, etc. are also used, but of course, aqueous solutions of seeds such as sodium hypophosphite, sodium borohydride, hydrazine, etc. can also be used.

Example 14 The conductive substrate obtained in Example 12 is partially plated with gold or platinum in the same manner as in Example 13, and then washed with water and dried. A thin layer of ink made by dissolving vinyl acetate/vinyl chloride copolymer in thinner is applied onto this surface, and the plated area is reinforced by drying, resulting in excellent water resistance and refraction resistance.

The conductivity of the plated part is the specific resistance ρ = 2~llXl0-6Ωω
The resulting product was used as a printed circuit board.

<Effects of the Invention> The present invention relates to a conductive circuit board and a method for improving its conductivity, and clarifies a method for easily and mass producing conductive circuit boards useful as electrical and electronic materials ranging from industrial parts to daily necessities. This is what I did. The conductive substrate obtained by the present invention can be used as printed circuit boards, film connectors, wiring boards, sheet switches, fuses, sensors, high-density circuits, etc. depending on its form, and its industrial applicability is extremely large. .

Claims (8)

[Claims] (1) A mixture for electroless plating is brought into contact with a conductive substrate on which a circuit pattern made of a conductive polymer containing heteroatoms is formed on the surface of a plastic molded product by electrolytic polymerization, and a part of the circuit pattern or A processed conductive substrate characterized by being obtained entirely by plating. (2) The conductive polymer containing heteroatoms is polyaniline,
Nuclear substituted poaniline, polynaphthylamine, nuclear substituted polynaphthylamine, polyaminoanthracene, nuclear substituted polyaminoanthracene, polythiophene, nuclear substituted polythiophene, polypyrrole, substituted polypyrrole, polypyrazole, substituted polypyrazole, polyimidazole, substituted polyimidazole, polytriazole, Substituted polytriazole, polypyridine, nuclear substituted polypyridine, polydiazine, substituted polydiazine, polytriazine, substituted polytriazine, polyoxazine, substituted polyoxazine, polybenzothiophene, substituted polybenzothiophene, polybenzopyrrole, substituted polybenzopyrrole, polybenzpyrazole , substituted polybenzpyrazole, polybenzimidazole, substituted polybenzimidazole, polyoxadiazole, polythiadiazole, polyazobenzene, substituted polyazobenzene, polyphthalocyanine, nuclear substituted polyphthalocyanine, polycarbazole, substituted polycarbazole, polyquinoline, nuclear substituted polyquinoline , polybenzoxazole, substituted polybenzoxazole, polytetra (
naftylo) tetraazaporphyrin and polytetra(
The processed conductive circuit board according to claim 1, characterized in that the processed conductive circuit board is at least one polymer compound selected from the group consisting of phenanthro)tetraazaporphyrin. (3) Plastic molded products include polyvinyl chloride, polyvinylidene chloride, vinyl chloride copolymers, polyvinyl fluoride, polyvinylidene fluoride, polyester, polyamide, polyvinyl carbazole, polyether, polyether ester, chlorinated polyolefin, polyamide Claims No. 1, characterized in that it is a membrane, film, sheet, or plate based on at least one polymer selected from the group consisting of imide, polyethersulfone, polyimide, polyamino bismaleimide, polysulfone, and polystyrene. Processed conductive circuit board according to item 1. (4) The mixture for electroless plating is a solution or mixture consisting of a compound of at least one metal selected from the group consisting of gold, silver, copper, platinum, palladium, chromium, iron, cobalt, nickel, and vanadium, a reducing agent, etc. A processed conductive circuit board according to claim 1, characterized in that: (5) A mixture for electroless plating is brought into contact with a conductive substrate on which a circuit pattern made of a conductive polymer containing heteroatoms is formed on the surface of a plastic molded product by electrolytic polymerization, and a part of the circuit pattern or A method for reinforcing a processed conductive circuit board, which is characterized by covering a processed conductive board obtained by completely plating with an adhesive film. (6) The conductive polymer containing heteroatoms is polyaniline,
Nuclear substituted poaniline, polynaphthylamine, nuclear substituted polynaphthylamine, polyaminoanthracene, nuclear substituted polyaminoanthracene, polythiophene, nuclear substituted polythiophene, polypyrrole, substituted polypyrrole, polypyrazole, substituted polypyrazole, polyimidazole, substituted polyimidazole, polytriazole, Substituted polytriazole, polypyridine, nuclear substituted polypyridine, polydiazine, substituted polydiazine, polytriazine, substituted polytriazine, polyoxazine, substituted polyoxazine, polybenzothiophene, substituted polybenzothiophene, polybenzopyrrole, substituted polybenzopyrrole, polybenzpyrazole , substituted polybenzpyrazole, polybenzimidazole, substituted polybenzimidazole, polyoxadiazole, polythiadiazole, polyazobenzene, substituted polyazobenzene, polyphthalocyanine, nuclear substituted polyphthalocyanine, polycarbazole, substituted polycarbazole, polyquinoline, nuclear substituted polyquinoline , polybenzoxazole, substituted polybenzoxazole, polytetra (
naftylo) tetraazaporphyrin and polytetra(
6. The method of reinforcing a processed conductive circuit board according to claim 5, wherein the reinforcing method is at least one polymeric compound selected from the group consisting of phenanthro)tetraazaporphyrin. (7) Plastic molded products include polyvinyl chloride, polyvinylidene chloride, vinyl chloride copolymers, polyvinyl fluoride, polyvinylidene fluoride, polyester, polyamide, polyvinyl carbazole, polyether, polyether ester, chlorinated polyolefin, polyamide Claims No. 1, characterized in that it is a membrane, film, sheet, or plate based on at least one polymer selected from the group consisting of imide, polyethersulfone, polyimide, polyamino bismaleimide, polysulfone, and polystyrene. A method for reinforcing a processed conductive circuit board according to item 5. (8) The mixture for electroless plating is a solution or mixture consisting of a compound of at least one metal selected from the group consisting of gold, silver, copper, platinum, palladium, chromium, iron, cobalt, nickel, and vanadium, a reducing agent, etc. A method for reinforcing a processed conductive circuit board according to claim 5, characterized in that: