JPS6237933U - - Google Patents
Info
- Publication number
- JPS6237933U JPS6237933U JP1985130488U JP13048885U JPS6237933U JP S6237933 U JPS6237933 U JP S6237933U JP 1985130488 U JP1985130488 U JP 1985130488U JP 13048885 U JP13048885 U JP 13048885U JP S6237933 U JPS6237933 U JP S6237933U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- bump
- blade
- semiconductor wafer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 11
- 239000008188 pellet Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130488U JPH0135475Y2 (id) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985130488U JPH0135475Y2 (id) | 1985-08-26 | 1985-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237933U true JPS6237933U (id) | 1987-03-06 |
| JPH0135475Y2 JPH0135475Y2 (id) | 1989-10-30 |
Family
ID=31028034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985130488U Expired JPH0135475Y2 (id) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0135475Y2 (id) |
-
1985
- 1985-08-26 JP JP1985130488U patent/JPH0135475Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0135475Y2 (id) | 1989-10-30 |