JPS6237929U - - Google Patents

Info

Publication number
JPS6237929U
JPS6237929U JP12843485U JP12843485U JPS6237929U JP S6237929 U JPS6237929 U JP S6237929U JP 12843485 U JP12843485 U JP 12843485U JP 12843485 U JP12843485 U JP 12843485U JP S6237929 U JPS6237929 U JP S6237929U
Authority
JP
Japan
Prior art keywords
clamp
spring plate
movable spring
clamping force
movable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12843485U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0236279Y2 (cs
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12843485U priority Critical patent/JPH0236279Y2/ja
Publication of JPS6237929U publication Critical patent/JPS6237929U/ja
Application granted granted Critical
Publication of JPH0236279Y2 publication Critical patent/JPH0236279Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus

Landscapes

  • Wire Bonding (AREA)
JP12843485U 1985-08-23 1985-08-23 Expired JPH0236279Y2 (cs)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (cs) 1985-08-23 1985-08-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12843485U JPH0236279Y2 (cs) 1985-08-23 1985-08-23

Publications (2)

Publication Number Publication Date
JPS6237929U true JPS6237929U (cs) 1987-03-06
JPH0236279Y2 JPH0236279Y2 (cs) 1990-10-03

Family

ID=31024099

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12843485U Expired JPH0236279Y2 (cs) 1985-08-23 1985-08-23

Country Status (1)

Country Link
JP (1) JPH0236279Y2 (cs)

Also Published As

Publication number Publication date
JPH0236279Y2 (cs) 1990-10-03

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