JPS6236599U - - Google Patents

Description

[Brief explanation of the drawing]

1 is a diagram showing an embodiment of the present invention, FIG. 2 is a perspective view of the shield fitting 20 shown in FIG. 1, FIG. 3 is an enlarged end view of the engagement groove 12e shown in FIG. 1, and FIG. FIG. 5 is a diagram showing the first conventional example, and FIG. 5 is a diagram showing the second conventional example. In Figures 1, 2, and 3, 11 is a metal plate, 12
is a high frequency module (e.g. an amplification module),
12a is a board, 12b is a package part, 12c,
12d is a connection terminal (conductor pattern), 12e is an engagement groove, 13 and 14 are input/output terminals (coaxial terminals),
15 is a bias terminal (coaxial terminal), 19 is a connection ribbon (for example, a gold ribbon), 20 is a shield metal fitting, and 20a is an engaging portion, respectively.

Claims (1)

[Claims for Utility Model Registration] Package portion 12b provided on substrate 12a
The high-frequency module 12, which is formed by incorporating and sealing a predetermined electronic element etc. into the package part 12b and forming a package, is attached to the package part 1.
In the high frequency circuit device, a plurality of connection terminals 12c, 12d drawn out from opposite sides of the high frequency module 12 are arranged and connected in series on the metal plate 11, with the connection terminals 12c, 12d facing each other.
Engagement grooves 12e are provided on opposite side surfaces of the package part 12b perpendicular to the pulling direction of the package part 12d, and a shield fitting 20 formed in a substantially U-shaped cross section and having an engagement part 20a at its free edge is attached to the package part 12d. A radio wave shield structure characterized in that it is removably engaged in the engagement groove 12e of the module 12b and is disposed to cover the connection terminals 12c and 12d between the adjacent modules 12.