JPS6236535U - - Google Patents
Info
- Publication number
- JPS6236535U JPS6236535U JP1985127619U JP12761985U JPS6236535U JP S6236535 U JPS6236535 U JP S6236535U JP 1985127619 U JP1985127619 U JP 1985127619U JP 12761985 U JP12761985 U JP 12761985U JP S6236535 U JPS6236535 U JP S6236535U
- Authority
- JP
- Japan
- Prior art keywords
- extraction electrode
- bonding wire
- semiconductor
- semiconductor chip
- bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127619U JPH0416437Y2 (https=) | 1985-08-21 | 1985-08-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985127619U JPH0416437Y2 (https=) | 1985-08-21 | 1985-08-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6236535U true JPS6236535U (https=) | 1987-03-04 |
| JPH0416437Y2 JPH0416437Y2 (https=) | 1992-04-13 |
Family
ID=31022543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985127619U Expired JPH0416437Y2 (https=) | 1985-08-21 | 1985-08-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416437Y2 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122763A (ja) * | 1982-01-14 | 1983-07-21 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1985
- 1985-08-21 JP JP1985127619U patent/JPH0416437Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58122763A (ja) * | 1982-01-14 | 1983-07-21 | Toshiba Corp | 樹脂封止型半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416437Y2 (https=) | 1992-04-13 |