JPS6236535U - - Google Patents

Info

Publication number
JPS6236535U
JPS6236535U JP1985127619U JP12761985U JPS6236535U JP S6236535 U JPS6236535 U JP S6236535U JP 1985127619 U JP1985127619 U JP 1985127619U JP 12761985 U JP12761985 U JP 12761985U JP S6236535 U JPS6236535 U JP S6236535U
Authority
JP
Japan
Prior art keywords
extraction electrode
bonding wire
semiconductor
semiconductor chip
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1985127619U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416437Y2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985127619U priority Critical patent/JPH0416437Y2/ja
Publication of JPS6236535U publication Critical patent/JPS6236535U/ja
Application granted granted Critical
Publication of JPH0416437Y2 publication Critical patent/JPH0416437Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W70/682—
    • H10W70/685—
    • H10W72/5445—

Landscapes

  • Wire Bonding (AREA)
JP1985127619U 1985-08-21 1985-08-21 Expired JPH0416437Y2 (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (cg-RX-API-DMAC10.html) 1985-08-21 1985-08-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985127619U JPH0416437Y2 (cg-RX-API-DMAC10.html) 1985-08-21 1985-08-21

Publications (2)

Publication Number Publication Date
JPS6236535U true JPS6236535U (cg-RX-API-DMAC10.html) 1987-03-04
JPH0416437Y2 JPH0416437Y2 (cg-RX-API-DMAC10.html) 1992-04-13

Family

ID=31022543

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985127619U Expired JPH0416437Y2 (cg-RX-API-DMAC10.html) 1985-08-21 1985-08-21

Country Status (1)

Country Link
JP (1) JPH0416437Y2 (cg-RX-API-DMAC10.html)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58122763A (ja) * 1982-01-14 1983-07-21 Toshiba Corp 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0416437Y2 (cg-RX-API-DMAC10.html) 1992-04-13

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