JPS6236291Y2 - - Google Patents
Info
- Publication number
- JPS6236291Y2 JPS6236291Y2 JP1982007003U JP700382U JPS6236291Y2 JP S6236291 Y2 JPS6236291 Y2 JP S6236291Y2 JP 1982007003 U JP1982007003 U JP 1982007003U JP 700382 U JP700382 U JP 700382U JP S6236291 Y2 JPS6236291 Y2 JP S6236291Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- view
- holder
- bias supply
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP700382U JPS58109260U (ja) | 1982-01-21 | 1982-01-21 | 半導体素子取付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP700382U JPS58109260U (ja) | 1982-01-21 | 1982-01-21 | 半導体素子取付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58109260U JPS58109260U (ja) | 1983-07-25 |
| JPS6236291Y2 true JPS6236291Y2 (en:Method) | 1987-09-16 |
Family
ID=30019778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP700382U Granted JPS58109260U (ja) | 1982-01-21 | 1982-01-21 | 半導体素子取付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58109260U (en:Method) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5324264U (en:Method) * | 1976-08-09 | 1978-03-01 | ||
| JPS55181353U (en:Method) * | 1979-06-15 | 1980-12-26 |
-
1982
- 1982-01-21 JP JP700382U patent/JPS58109260U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58109260U (ja) | 1983-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2801534B2 (ja) | パワー半導体モジュールおよびそれに使用する絶縁金属基板 | |
| US4117508A (en) | Pressurizable semiconductor pellet assembly | |
| JP2002513217A (ja) | ヒートシンクを有する集積回路相互結合要素 | |
| JPH0644600B2 (ja) | 半導体組立ユニット | |
| US3478420A (en) | Method of providing contact leads for semiconductors | |
| US4314270A (en) | Hybrid thick film integrated circuit heat dissipating and grounding assembly | |
| JPS59132152A (ja) | セルフロツクコンタクト | |
| JPS6236291Y2 (en:Method) | ||
| US7968984B2 (en) | Universal pad arrangement for surface mounted semiconductor devices | |
| US3280383A (en) | Electronic semiconductor device | |
| JPH03180054A (ja) | 樹脂封止型半導体装置 | |
| JPH10256319A (ja) | 半導体装置 | |
| JPS6239592Y2 (en:Method) | ||
| JPS593580Y2 (ja) | 半導体チツプ支持装置 | |
| JPS58175641U (ja) | 半導体部品の取付装置 | |
| CN222071928U (zh) | 一种散热型贴片式二极管 | |
| CN222619755U (zh) | 封装结构 | |
| JPH06216267A (ja) | ダイオード | |
| JPH0536227Y2 (en:Method) | ||
| JPS58158445U (ja) | 半導体素子試験用治具 | |
| JPS62202Y2 (en:Method) | ||
| JPH0541559Y2 (en:Method) | ||
| JPH02205347A (ja) | 半導体装置 | |
| JP2806622B2 (ja) | ヒートシンクの取付構造 | |
| JPS58222549A (ja) | ヒ−トシンク装置 |