JPS6234430U - - Google Patents

Info

Publication number
JPS6234430U
JPS6234430U JP12549885U JP12549885U JPS6234430U JP S6234430 U JPS6234430 U JP S6234430U JP 12549885 U JP12549885 U JP 12549885U JP 12549885 U JP12549885 U JP 12549885U JP S6234430 U JPS6234430 U JP S6234430U
Authority
JP
Japan
Prior art keywords
workpiece
heating device
heater block
bonding position
bond position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12549885U
Other languages
Japanese (ja)
Other versions
JPH0510357Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12549885U priority Critical patent/JPH0510357Y2/ja
Publication of JPS6234430U publication Critical patent/JPS6234430U/ja
Application granted granted Critical
Publication of JPH0510357Y2 publication Critical patent/JPH0510357Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例を示す断面図、第２
図は本考案の他の実施例を示す断面図、第３図及
び第４図はそれぞれ従来例を示す断面図、第５図
ａ，ｂ，ｃはワークの温度分布を示す説明図であ
る。 １：ワーク、４：ヒータブロツク、４ａ，４ｂ
：表面、Ａ：ボンド位置。 Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a cross-sectional view showing another embodiment of the present invention, FIGS. 3 and 4 are cross-sectional views showing a conventional example, and FIGS. 5 a, b, and c are explanatory diagrams showing the temperature distribution of a workpiece. 1: Work, 4: Heater block, 4a, 4b
: Surface, A: Bond position.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ワークをボンド位置に送つてボンド位置よりワ
ーク供給側に伸びたヒータブロツクで加熱するワ
ーク加熱装置において、前記ヒータブロツクは、
ボンド位置近傍の表面よりボンド位置近傍以外の
表面を全て低く形成したことを特徴とするワーク
加熱装置。 In a workpiece heating device that sends a workpiece to a bonding position and heats it with a heater block extending from the bonding position to the workpiece supply side, the heater block:
A workpiece heating device characterized in that all surfaces other than the surface near the bond position are formed lower than surfaces near the bond position.
JP12549885U 1985-08-17 1985-08-17 Expired - Lifetime JPH0510357Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12549885U JPH0510357Y2 (en) 1985-08-17 1985-08-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12549885U JPH0510357Y2 (en) 1985-08-17 1985-08-17

Publications (2)

Publication Number Publication Date
JPS6234430U true JPS6234430U (en) 1987-02-28
JPH0510357Y2 JPH0510357Y2 (en) 1993-03-15

Family

ID=31018447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12549885U Expired - Lifetime JPH0510357Y2 (en) 1985-08-17 1985-08-17

Country Status (1)

Country Link
JP (1) JPH0510357Y2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605125U (en) * 1983-05-31 1985-01-14 ロ−ム株式会社 Heater block for semiconductor device assembly
JPS6016430A (en) * 1983-07-08 1985-01-28 Toshiba Corp Manufacture of semiconductor device
JPS60167336A (en) * 1984-02-10 1985-08-30 Hitachi Ltd Heating device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605125B2 (en) * 1977-03-31 1985-02-08 株式会社東芝 Sealed switchgear

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS605125U (en) * 1983-05-31 1985-01-14 ロ−ム株式会社 Heater block for semiconductor device assembly
JPS6016430A (en) * 1983-07-08 1985-01-28 Toshiba Corp Manufacture of semiconductor device
JPS60167336A (en) * 1984-02-10 1985-08-30 Hitachi Ltd Heating device

Also Published As

Publication number Publication date
JPH0510357Y2 (en) 1993-03-15

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