JPS6233582U - - Google Patents
Info
- Publication number
- JPS6233582U JPS6233582U JP6857385U JP6857385U JPS6233582U JP S6233582 U JPS6233582 U JP S6233582U JP 6857385 U JP6857385 U JP 6857385U JP 6857385 U JP6857385 U JP 6857385U JP S6233582 U JPS6233582 U JP S6233582U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- series
- cavity
- cavities
- fitted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 238000004804 winding Methods 0.000 description 2
Landscapes
- Packaging Frangible Articles (AREA)
- Packaging Of Machine Parts And Wound Products (AREA)
- Packages (AREA)
Description
第1図はこの考案の一実施例を示す断面図解図
である。第2図は第1図実施例に用いられる電子
部品連の一例を示す斜視図である。第3図は巻芯
の一例を示す斜視図である。第4図は電子部品連
の他の例を示す斜視図である。第5図は第4図の
電子部品連を巻回した状態を示す断面図である。
第6図は電子部品連のさらに他の例を示す斜視図
である。第7図は第6図の電子部品連が用いられ
たこの考案の別の実施例を示す断面図である。第
8図は電子部品連のさらに他の例を示す斜視図で
ある。第9図は第8図の電子部品連が巻回された
状態を示す断面図解図である。第10図は多数の
電子部品連巻回体を並置保持した状態を示す図解
図である。
図において、10は電子部品連巻回体、16は
保持体、18はキヤビテイ、26は溝、28は突
条、30は切欠、34は側面部、36は凹部、3
8は係合部、40は傾斜部、42はスリツトを示
す。
FIG. 1 is an illustrative cross-sectional view showing one embodiment of this invention. FIG. 2 is a perspective view showing an example of a series of electronic components used in the embodiment shown in FIG. FIG. 3 is a perspective view showing an example of the winding core. FIG. 4 is a perspective view showing another example of the electronic component series. FIG. 5 is a sectional view showing a state in which the series of electronic components shown in FIG. 4 is wound.
FIG. 6 is a perspective view showing still another example of the electronic component series. FIG. 7 is a sectional view showing another embodiment of this invention in which the electronic component series of FIG. 6 is used. FIG. 8 is a perspective view showing still another example of the electronic component series. FIG. 9 is an illustrative cross-sectional view showing a state in which the series of electronic components shown in FIG. 8 is wound. FIG. 10 is an illustrative view showing a state in which a large number of electronic component serially wound bodies are held side by side. In the figure, 10 is an electronic component continuous winding body, 16 is a holding body, 18 is a cavity, 26 is a groove, 28 is a protrusion, 30 is a notch, 34 is a side surface, 36 is a recess, 3
8 represents an engaging portion, 40 represents an inclined portion, and 42 represents a slit.
Claims (1)
して多数のキヤビテイが形成され、さらにそのキ
ヤビテイの形成位置とは異なる位置にキヤビテイ
の底面より下方に突出する第1部分およびこの第
1部分が嵌合可能な第2部分が形成され、それぞ
れのキヤビテイにチツプ部品が保持された電子部
品連を含み、 前記電子部品連が巻芯の外面に巻回され、前記
第1部分が、隣接する前記第2部分に嵌合されて
いる、電子部品連巻回体。 2 前記第2部分は凹部を含む、実用新案登録請
求の範囲第1項記載の電子部品連巻回体。 3 前記第2部分はスリツトを含む、実用新案登
録請求の範囲第1項記載き電子部品連巻回体。[Claims for Utility Model Registration] 1. By molding a resin tape, a large number of cavities are formed distributed in the length direction of the tape, and a first cavity protrudes downward from the bottom surface of the cavity at a position different from the position where the cavities are formed. a part and a second part into which the first part can be fitted, and each cavity includes a series of electronic parts holding a chip part, the series of electronic parts being wound around the outer surface of the core, and a second part fitable with the first part; A serially wound electronic component body, wherein one part is fitted into the adjacent second part. 2. The electronic component serially wound body according to claim 1, wherein the second portion includes a recess. 3. The electronic component serially wound body according to claim 1, wherein the second portion includes a slit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6857385U JPH0356547Y2 (en) | 1985-05-08 | 1985-05-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6857385U JPH0356547Y2 (en) | 1985-05-08 | 1985-05-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6233582U true JPS6233582U (en) | 1987-02-27 |
JPH0356547Y2 JPH0356547Y2 (en) | 1991-12-19 |
Family
ID=30908511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6857385U Expired JPH0356547Y2 (en) | 1985-05-08 | 1985-05-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0356547Y2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01167888U (en) * | 1988-05-13 | 1989-11-27 | ||
JP2010215246A (en) * | 2009-03-13 | 2010-09-30 | Denso Corp | Emboss carrier |
-
1985
- 1985-05-08 JP JP6857385U patent/JPH0356547Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01167888U (en) * | 1988-05-13 | 1989-11-27 | ||
JP2010215246A (en) * | 2009-03-13 | 2010-09-30 | Denso Corp | Emboss carrier |
Also Published As
Publication number | Publication date |
---|---|
JPH0356547Y2 (en) | 1991-12-19 |
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