JPS6233327Y2 - - Google Patents

Info

Publication number
JPS6233327Y2
JPS6233327Y2 JP1982099079U JP9907982U JPS6233327Y2 JP S6233327 Y2 JPS6233327 Y2 JP S6233327Y2 JP 1982099079 U JP1982099079 U JP 1982099079U JP 9907982 U JP9907982 U JP 9907982U JP S6233327 Y2 JPS6233327 Y2 JP S6233327Y2
Authority
JP
Japan
Prior art keywords
stem
glass
lead wire
external lead
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982099079U
Other languages
English (en)
Japanese (ja)
Other versions
JPS593550U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982099079U priority Critical patent/JPS593550U/ja
Publication of JPS593550U publication Critical patent/JPS593550U/ja
Application granted granted Critical
Publication of JPS6233327Y2 publication Critical patent/JPS6233327Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1982099079U 1982-06-30 1982-06-30 大電力半導体用ステム Granted JPS593550U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982099079U JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982099079U JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Publications (2)

Publication Number Publication Date
JPS593550U JPS593550U (ja) 1984-01-11
JPS6233327Y2 true JPS6233327Y2 (en:Method) 1987-08-26

Family

ID=30234955

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982099079U Granted JPS593550U (ja) 1982-06-30 1982-06-30 大電力半導体用ステム

Country Status (1)

Country Link
JP (1) JPS593550U (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH063050B2 (ja) * 1986-07-26 1994-01-12 株式会社マブチ 組立型構造物に使用されるフロア・パネル

Also Published As

Publication number Publication date
JPS593550U (ja) 1984-01-11

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