JPS6232554U - - Google Patents
Info
- Publication number
- JPS6232554U JPS6232554U JP12489685U JP12489685U JPS6232554U JP S6232554 U JPS6232554 U JP S6232554U JP 12489685 U JP12489685 U JP 12489685U JP 12489685 U JP12489685 U JP 12489685U JP S6232554 U JPS6232554 U JP S6232554U
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- plating
- layer
- nickel layer
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 6
- 229910052759 nickel Inorganic materials 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12489685U JPS6232554U (un) | 1985-08-14 | 1985-08-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12489685U JPS6232554U (un) | 1985-08-14 | 1985-08-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6232554U true JPS6232554U (un) | 1987-02-26 |
Family
ID=31017315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12489685U Pending JPS6232554U (un) | 1985-08-14 | 1985-08-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6232554U (un) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56142633A (en) * | 1980-04-08 | 1981-11-07 | Mitsubishi Electric Corp | Forming method for back electrode of semiconductor wafer |
-
1985
- 1985-08-14 JP JP12489685U patent/JPS6232554U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56142633A (en) * | 1980-04-08 | 1981-11-07 | Mitsubishi Electric Corp | Forming method for back electrode of semiconductor wafer |