JPS6231762Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a high-frequency heating device equipped with a solid-state imaging device as an image sensor, and particularly relates to an improvement in the inner wall surface treatment structure of a heating chamber.

[Technical background of the invention and its problems]

For example, in high-frequency heating devices such as microwave ovens, various means have been developed for controlling the power level, heating time, etc. of heating an object to be heated. Recently, the use of solid-state image sensors has been considered as one means for achieving this goal. This type of image sensor is, for example, called a CCD (Charge Couple Device) image sensor, and refers to a device that has a function of reading out optical information incident on its light-receiving surface by dividing it into a plurality of units. To explain, in addition to the photoelectric conversion function, it has a signal charge accumulation function that allows the photosensitive cell to accumulate signal charges generated by photoelectric conversion.

By the way, this element operates based on the magnitude (amount) of reflected light from the object to be heated stored in the heating chamber, so the light that is incident on the element from the object to be heated and its surroundings respectively. The greater the difference in the intensity of light (reflected light from a light source), the easier it becomes to identify the object to be heated. Further, the stronger the intensity of the reflected light from the object to be heated, the easier the operation of the measurement system of the element becomes. In other words, the higher the illuminance from the light source at the location of the heated object, the better, and the larger the difference in reflectance between the heated object and other parts, the better.

[Purpose of invention]

The present invention was developed in view of the above circumstances, and its purpose is to provide a high-frequency heating device that improves the measurement accuracy of solid-state image sensors and improves heating efficiency. .

[Summary of the idea]

In the present invention, a portion of the wall surface of the heating chamber within the viewing angle of the solid-state image sensor is subjected to anti-reflection treatment, and a portion outside the viewing angle is treated to obtain high reflectance.

[Example of idea]

An embodiment of the present invention will be described below based on the drawings. Reference numeral 1 in the figure is, for example, a main body of a microwave oven, and a heating chamber 2 is provided inside the main body. Heating chamber 2
A mounting shelf 3 for mounting an object to be heated (not shown) is housed in the inner bottom of the heating device. Furthermore, a CCD image sensor 4, which is a solid-state imaging device, and a light source lamp 5 are mounted on the ceiling wall of the heating chamber 2. Through holes 6 and 7 are formed in the ceiling wall portions facing these, respectively. Therefore, the CCD image sensor 4 has a through hole 6.
A viewing angle of angle θ is obtained within the heating chamber 2 through the heating chamber 2. The angle θ is an angle that allows the placement shelf 3 to be included in the field of view. The light source lamp 5 has a through hole 7
The inside of the heating chamber 2 can be irradiated through the heating chamber 2. The inner wall surface of the heating chamber 2 is treated as described below. That is, the portion included in the viewing angle θ of the CCD image sensor 4 is defined as the non-reflection processing portion 2a. In reality, a range that is larger than the viewing angle θ may be determined with some margin. All inner wall surfaces other than the non-reflection treated portion 2a are high reflection treated portions 2b having extremely high reflectance. Therefore, the light from the light source lamp 5 is reflected by the high reflection processing section 2b to become scattered light, and the object to be heated can be irradiated in a shadowless state. Moreover, since the area around the object to be heated is a non-reflection treated area 2a, only the object to be heated is reflected to the CCD image sensor 4.

The light from the light source lamp 5 is reflected by the high reflection processing section 2b and becomes scattered light, which directly or indirectly irradiates the object to be heated. Since no reflection occurs in the non-reflection processing section 2a, only the object to be heated is reflected in a raised state, and the CCD image sensor 4 receives the reflected light. This accurately measures the size of the heated object,
By sending the signal to a control section (not shown), the cooking power level, heating time, etc. can be set.

In the above embodiment, since the light source lamp 5 is attached to the ceiling wall of the heating chamber 2, the heating chamber 2
Uniform illuminance can be given to the object to be heated inside.

In the above embodiment, a CCD image sensor is used as the solid-state image sensor 4, but the invention is not limited to this, and for example,
MOS (Meta Oxide Semiconductor), CID
(Charge Injection Device) or BBD
(Bucket Brigade Device) may also be used.

[Effect of idea]

As explained above, according to the present invention, the part of the heating chamber wall that is within the viewing angle of the solid-state image sensor is subjected to anti-reflection treatment, and the part outside the viewing angle is treated to obtain high reflectance. It is possible to increase the illuminance to an object, reduce the reflectance within the viewing angle, reduce the measurement error of the solid-state image sensor, and improve the heating efficiency.

[Brief explanation of the drawing]

The drawing is a schematic longitudinal cross-sectional view of a high-frequency heating device showing an embodiment of the present invention. 2... Heating chamber, 4... Solid-state imaging device (CCD image sensor), θ... Viewing angle, 2a... Non-reflection processing section, 2b... High reflection processing section.

Claims (1)

[Scope of utility model registration request] In a device that detects the size of the object to be heated stored in a heating chamber with a solid-state image sensor and controls the power level, heating time, etc. of the heating time, a portion of the wall surface of the heating chamber that is within the viewing angle of the solid-state image sensor is non-reflective. A high-frequency heating device characterized in that a high-frequency heating device is processed to obtain a high reflectance in a portion outside the viewing angle.