JPS6230334U - - Google Patents
Info
- Publication number
- JPS6230334U JPS6230334U JP12095985U JP12095985U JPS6230334U JP S6230334 U JPS6230334 U JP S6230334U JP 12095985 U JP12095985 U JP 12095985U JP 12095985 U JP12095985 U JP 12095985U JP S6230334 U JPS6230334 U JP S6230334U
- Authority
- JP
- Japan
- Prior art keywords
- stage
- semiconductor substrate
- mound
- crusher device
- crushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
Description
第１図は本考案の一実施例に使用したマウンド
クラツシヤー装置のステージと半導体基板との関
係を説明する縦断面図、第２図は従来のマウンド
クラツシヤー装置の構成を説明する縦断面図、第
３図は従来のマウンドクラツシヤー装置のステー
ジと裏面外周に突起のある半導体基板との関係を
説明する縦断面図である。
１…クラツシユ板ホルダー、２…クラツシユ板
、３…半導体基板、４…ステージ、５…ステージ
球面部、６…シリンダー、７…シリンダー台、８
…高圧空気導入口、９…半導体基板裏面外周にあ
る突起、１０…半導体基板とステージの間にでき
る空間、１１…ステージ表面に刻設した溝。
FIG. 1 is a vertical sectional view illustrating the relationship between the stage and semiconductor substrate of a mound crusher device used in an embodiment of the present invention, and FIG. 2 is a vertical sectional view illustrating the configuration of a conventional mound crusher device. The plan view and FIG. 3 are longitudinal sectional views illustrating the relationship between the stage of a conventional mound crusher device and a semiconductor substrate having a protrusion on the outer periphery of the back surface. DESCRIPTION OF SYMBOLS 1...Crush plate holder, 2...Crash plate, 3...Semiconductor substrate, 4...Stage, 5...Stage spherical part, 6...Cylinder, 7...Cylinder stand, 8
...High-pressure air inlet, 9...Protrusion on the outer periphery of the back surface of the semiconductor substrate, 10...Space formed between the semiconductor substrate and the stage, 11...Groove carved on the surface of the stage.
Claims (1)
ージと対向して設置されるクラツシユ板と、ステ
ージが移動して半導体基板をクラツシユ板に押し
つけマウンドを潰す機構とを有するマウンドクラ
ツシヤー装置において、半導体基板外周と同形状
の溝をステージ表面に刻設したことを特徴とする
マウンドクラツシヤー装置。 In a mound crusher device that has a stage for fixing a conductive substrate, a crushing plate installed opposite to the stage, and a mechanism for moving the stage and crushing the semiconductor substrate by pressing the semiconductor substrate against the crushing plate, A mound crusher device characterized in that a groove having the same shape as the outer periphery of a substrate is carved on the stage surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12095985U JPS6230334U (en) | 1985-08-07 | 1985-08-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12095985U JPS6230334U (en) | 1985-08-07 | 1985-08-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6230334U true JPS6230334U (en) | 1987-02-24 |
Family
ID=31009770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12095985U Pending JPS6230334U (en) | 1985-08-07 | 1985-08-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6230334U (en) |
-
1985
- 1985-08-07 JP JP12095985U patent/JPS6230334U/ja active Pending