JPS62297472A - Method for sensitizing surface of insulating material before electroless plating - Google Patents
Method for sensitizing surface of insulating material before electroless platingInfo
- Publication number
- JPS62297472A JPS62297472A JP14093286A JP14093286A JPS62297472A JP S62297472 A JPS62297472 A JP S62297472A JP 14093286 A JP14093286 A JP 14093286A JP 14093286 A JP14093286 A JP 14093286A JP S62297472 A JPS62297472 A JP S62297472A
- Authority
- JP
- Japan
- Prior art keywords
- insulating material
- epoxy resin
- copper
- film
- palladium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 title claims abstract description 30
- 238000007772 electroless plating Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims abstract description 16
- 230000001235 sensitizing effect Effects 0.000 title claims description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000010949 copper Substances 0.000 claims abstract description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052802 copper Inorganic materials 0.000 claims abstract description 32
- 239000000084 colloidal system Substances 0.000 claims abstract description 19
- 229910052763 palladium Inorganic materials 0.000 claims description 27
- 239000007864 aqueous solution Substances 0.000 claims description 17
- 239000000243 solution Substances 0.000 claims description 12
- -1 palladium ions Chemical class 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 abstract description 34
- 229920000647 polyepoxide Polymers 0.000 abstract description 34
- 229910052751 metal Inorganic materials 0.000 abstract description 18
- 239000002184 metal Substances 0.000 abstract description 18
- 238000007747 plating Methods 0.000 abstract description 15
- 206010070834 Sensitisation Diseases 0.000 abstract description 7
- 230000008313 sensitization Effects 0.000 abstract description 7
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 4
- 150000002500 ions Chemical class 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 239000003365 glass fiber Substances 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 150000003606 tin compounds Chemical class 0.000 description 4
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 3
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- MUJIDPITZJWBSW-UHFFFAOYSA-N palladium(2+) Chemical compound [Pd+2] MUJIDPITZJWBSW-UHFFFAOYSA-N 0.000 description 3
- 239000001119 stannous chloride Substances 0.000 description 3
- 235000011150 stannous chloride Nutrition 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- KPVWDKBJLIDKEP-UHFFFAOYSA-L dihydroxy(dioxo)chromium;sulfuric acid Chemical compound OS(O)(=O)=O.O[Cr](O)(=O)=O KPVWDKBJLIDKEP-UHFFFAOYSA-L 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RILZRCJGXSFXNE-UHFFFAOYSA-N 2-[4-(trifluoromethoxy)phenyl]ethanol Chemical compound OCCC1=CC=C(OC(F)(F)F)C=C1 RILZRCJGXSFXNE-UHFFFAOYSA-N 0.000 description 1
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000005844 autocatalytic reaction Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
［産業上の利用分野］
本発明は絶縁材表面を無電解めっきするための増感方法
、特に絶縁材表面に自己触媒反応で無電解めっきするた
めのめつき触媒を形成する増感方法に関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a sensitizing method for electroless plating on the surface of an insulating material, particularly a sensitizing method for electroless plating on the surface of an insulating material by an autocatalytic reaction. The present invention relates to a sensitization method for forming a plating catalyst for use in sensitization.
［従来の技術］
エポキシ樹脂などの絶縁材は電気絶縁性がすぐれている
ため、広く電子工業に使用されている。[Prior Art] Insulating materials such as epoxy resins have excellent electrical insulation properties and are therefore widely used in the electronics industry.
例えば印刷配線板においては無電解銅めっきによってエ
ポキシ樹脂板上に導電回路を形成し、半導体集積回路等
の電子部品の搭載用に使用されている。For example, in printed wiring boards, conductive circuits are formed on epoxy resin plates by electroless copper plating, and are used for mounting electronic components such as semiconductor integrated circuits.
エポキシ樹脂板上に無電解銅めっき等の無電解めっきを
するためには、エポキシ樹脂板の表面で無電解めっき反
応が選択的におこるように予めエポキシ樹脂板の表面に
パラジウムなどの触媒金属を吸着ざぜ増感しておかなけ
ればならない。従来エポキシ樹脂板の表面にパラジウム
触媒金属を吸着させ、増感する方法としては次のような
方法が広く使用されている。即ち、まずエポキシ樹脂板
の表面をクロム酸−硫酸混液、過マンガン酸カリウムの
アルカリ性水溶液、またはリン酸イオンを含む無電解め
っき用コンディショナー水溶液等で化学的に親水化した
後、塩化第一錫と塩化パラジウムとの混合コロイド水溶
液に接触させる。次いで、パラジウム金属（塩化パラジ
ウムが塩化第一錫で還元され、パラジウム金属が生成し
ている）と同時に吸着した錫化合物を塩酸溶液、おるい
はホウフッ化水素酸溶液に浸漬して除去し、パラジウム
金属を露出させ、無電解めっきのための増感が行なわれ
ている。このような塩化第一錫と塩化パラジウムとの混
合コロイド水溶液としては特公昭３８−４１６１号に無
電解銅めっき用増感剤（触媒液）として開示されている
。In order to perform electroless plating such as electroless copper plating on an epoxy resin plate, a catalytic metal such as palladium is applied to the surface of the epoxy resin plate in advance so that the electroless plating reaction occurs selectively on the surface of the epoxy resin plate. The adsorption must be sensitized. Conventionally, the following methods have been widely used to sensitize palladium by adsorbing palladium catalyst metal onto the surface of an epoxy resin plate. That is, first, the surface of the epoxy resin plate is chemically made hydrophilic with a chromic acid-sulfuric acid mixture, an alkaline aqueous solution of potassium permanganate, or an aqueous electroless plating conditioner solution containing phosphate ions, and then treated with stannous chloride. Contact with a mixed colloidal aqueous solution with palladium chloride. Next, the tin compound adsorbed at the same time as palladium metal (palladium chloride is reduced with stannous chloride to form palladium metal) is removed by immersion in a hydrochloric acid solution, or a borofluoric acid solution. The metal is exposed and sensitized for electroless plating. Such a mixed colloidal aqueous solution of stannous chloride and palladium chloride is disclosed in Japanese Patent Publication No. 38-4161 as a sensitizer (catalyst solution) for electroless copper plating.
［発明が解決しようとする問題点コ
しかし、上記の従来のエポキシ樹脂板の無電解めっきの
ための増感方法においては、エポキシ樹脂板の表面にパ
ラジウム金属と同時に吸着した錫化合物を除去する際、
吸着したパラジウム金属もかなりの程度除去される。特
にガラス繊維で強化されたエポキシ樹脂板においてはガ
ラス繊維面（例えば貫通孔壁ではガラス繊維が露出して
いる）に吸着しているパラジウム金属が錫化合物を除去
する際、はとんど除去され、ガラス繊維面の無電解めっ
きの析出不良がしばしば発生していた。上記の貫通孔壁
のガラス繊維面に無電解めっきが析出しにくいのは、ガ
ラス繊維面（貫通孔壁）はもともと負に帯電しており、
負の電荷を有する塩化パラジウム−塩化第一錫混合コロ
イドがガラス繊維面に吸着しにくく、ガラス繊維面の吸
着したパラジウム金属の濃度はエポキシ樹脂面の濃度よ
り小さくなり易い。そのため、錫化合物を除去する際、
ガラス繊維面のパラジウム金属が消失しやすく、無電解
めっき析出不良が生ずる。[Problems to be Solved by the Invention] However, in the above-mentioned conventional sensitization method for electroless plating of an epoxy resin plate, when removing the tin compound adsorbed on the surface of the epoxy resin plate at the same time as palladium metal, ,
Adsorbed palladium metal is also removed to a considerable extent. In particular, in the case of glass fiber-reinforced epoxy resin plates, palladium metal adsorbed on the glass fiber surface (for example, glass fibers are exposed on the walls of through-holes) is almost completely removed when the tin compound is removed. , poor deposition of electroless plating on glass fiber surfaces often occurred. The reason why electroless plating is difficult to deposit on the glass fiber surface of the through-hole wall is that the glass fiber surface (through-hole wall) is originally negatively charged.
The negatively charged palladium chloride-stannic chloride mixed colloid is difficult to adsorb onto the glass fiber surface, and the concentration of adsorbed palladium metal on the glass fiber surface tends to be lower than the concentration on the epoxy resin surface. Therefore, when removing tin compounds,
Palladium metal on the glass fiber surface tends to disappear, resulting in poor electroless plating deposition.
［発明の従来技術に対する相違点］
本発明の目的はかかる従来の欠点を除去したエポキシ樹
脂板等の絶縁材表面を無電解めっきするための増感方法
を提供することにあり、特にパラジウム金属を絶縁材表
面に吸着した銅コロイドとパラジウムイオンの置換めっ
き反応によって絶縁材表面に形成し、増感させるという
独創的内容を有する。[Differences between the invention and the prior art] An object of the present invention is to provide a sensitizing method for electroless plating the surface of an insulating material such as an epoxy resin plate, which eliminates the drawbacks of the prior art. It has an original content in that it is formed on the surface of an insulating material and sensitized by a displacement plating reaction between copper colloid adsorbed on the surface of the insulating material and palladium ions.
［問題点を解決するための手段］
本発明の絶縁材表面を無電解めっきするための増感方法
は絶縁材表面を親水化する工程と、前記親水化された絶
縁材表面を銅コロイド水溶液に接触させ、絶縁材表面に
銅コロイド膜を形成させる工程と、銅コロイド膜の形成
された前記絶縁材表面をパラジウムイオン（Ｐｄ ）
を含む水溶液に接触させる工程とを行うことを特徴とす
るものである。[Means for Solving the Problems] The sensitization method for electroless plating the surface of an insulating material of the present invention includes a step of making the surface of the insulating material hydrophilic, and a step of making the surface of the insulating material hydrophilic in a copper colloid aqueous solution. a step of contacting the insulating material to form a colloidal copper film on the surface of the insulating material;
The method is characterized by carrying out a step of contacting with an aqueous solution containing.
［原理・作用］
本発明における絶縁材表面の親水化方法としては前記従
来方法と同様な化学的親水化方法、あるいはプラズマエ
ツチング法を使用することができる。銅コロイド水溶液
としては銅−ゼラチンコロイドを含むＰＨ＝２〜８の水
溶液を使用することができ、銅−ゼラチンコロイドはＰ
Ｈ＝２〜８において正に帯電しており、エポキシ樹脂板
（ガラス繊維強化板）の貫通孔壁のガラス繊維面にも吸
着しやすい。パラジウムイオン（Ｐｄ ）を含む水溶
液としては塩化パラジウム、硫酸パラジウムの酸性水溶
液が使用でき、パラジウムイオンの濃度はｏ、ｏｏｉ〜
０．１ｇ＃！が適当であるが、最も好ましい範囲は０．
００５〜０．０５ ＣＩ＃！である。パラジウムイオン
を含む水溶液のＰＨは４以下が適当であるが、最も好ま
しい範囲はＯ〜２である。パラジウムイオンを含む水溶
液（以下パラジウムイオン水溶液と称す）中の塩素イオ
ンの濃度が１ ｇ／ｆ！をこえると、銅コロイド膜の腐
食反応が増加するため、該水溶液中の塩素イオンの濃度
は１ ｇ／ｌ以下が適当である。絶縁材の表面に吸着形
成された銅コロイド膜はパラジウムイオン水溶液中で、
下記の（１）式で示されるようにパラジウムイオンと置
換反応し、銅コロイド膜の表面にはパラジウム金属が形
成される。[Principle/Operation] As a method for making the surface of an insulating material hydrophilic in the present invention, a chemical hydrophilic method similar to the conventional method described above or a plasma etching method can be used. As the copper colloid aqueous solution, an aqueous solution containing copper-gelatin colloid and having a pH of 2 to 8 can be used.
When H=2 to 8, it is positively charged and easily adsorbed to the glass fiber surface of the through-hole wall of the epoxy resin board (glass fiber reinforced board). As an aqueous solution containing palladium ions (Pd), an acidic aqueous solution of palladium chloride or palladium sulfate can be used, and the concentration of palladium ions is o, ooi ~
0.1g#! is appropriate, but the most preferable range is 0.
005~0.05 CI#! It is. The pH of the aqueous solution containing palladium ions is suitably 4 or less, but the most preferable range is 0 to 2. The concentration of chlorine ions in an aqueous solution containing palladium ions (hereinafter referred to as palladium ion aqueous solution) is 1 g/f! If the concentration exceeds 1 g/l, the corrosion reaction of the copper colloid film will increase, so the concentration of chlorine ions in the aqueous solution is preferably 1 g/l or less. The copper colloid film adsorbed and formed on the surface of the insulating material is dissolved in a palladium ion aqueous solution.
As shown by the following formula (1), a substitution reaction occurs with palladium ions, and palladium metal is formed on the surface of the copper colloid film.
＋＋
Ｃｕ＋Ｐｄ −＋ Ｐｄ＋Ｃｕ −・−
・−（１）本発明においてはエポキシ樹脂板の貫通孔壁
のガラス繊維面には銅コロイド膜が強固に形成されてお
り、上記（１）式で示される反応でガラス繊維面にもパ
ラジウム金属を従来技術より多く形成することができる
。またいったん絶縁材の表面に形成された金属パラジウ
ムは従来技術のように塩酸溶液、あるいはホウフッ化水
素酸溶液で処理する必要がなく、増感工程で消失するこ
ともない。なお、銅コロイド膜自身も無電解めっき反応
の触媒としての働きがあるが、無電解めっき反応が開始
する時間がパラジウム金属より長く、無電解めっき液も
活性な液（例えば高析出速度液等）を使用する必要があ
る。++ Cu+Pd −+ Pd+Cu −・−
・-(1) In the present invention, a copper colloid film is firmly formed on the glass fiber surface of the through-hole wall of the epoxy resin plate, and palladium metal is also formed on the glass fiber surface by the reaction shown in equation (1) above. can be formed in larger numbers than in the prior art. Furthermore, the metal palladium once formed on the surface of the insulating material does not need to be treated with a hydrochloric acid solution or a fluoroboric acid solution as in the prior art, and does not disappear during the sensitization process. Although the copper colloid film itself acts as a catalyst for the electroless plating reaction, the time it takes for the electroless plating reaction to start is longer than that of palladium metal, and the electroless plating solution is also an active solution (for example, a high deposition rate solution). need to be used.
［実施例コ 以下、本発明の実施例について詳細に説明する。[Example code] Examples of the present invention will be described in detail below.
（実施例１）
絶縁材としてガラス繊維強化エポキシ樹脂板を用意し、
ドリルで該エポキシ樹脂板に貫通孔を形成した。次いで
、液温７０℃のシプレー社製無電解めっき用コンディシ
ョナー１１７５でエポキシ樹脂板を５分間処理し、エポ
キシ樹脂板の表面（含貫通孔壁）を親水化した。次いで
水洗後ＰＨ＝ ５．５゜液温２５℃の銅コロイド水溶液
に３分間浸漬し、エポキシ樹脂板の全面（含貫通孔壁）
に銅コロイド膜を形成させた。次に、水洗後、塩化パラ
ジウム０．０１ （１／ｆ！（パラジウムイオンとして
０．００６ｇ／ｊ ＞ 、 ＰＨ＝ １．８のパラジウ
ムイオン水溶液に約３０秒間浸漬し、銅コロイド膜の表
面にパラジウム金属を形成した後、水洗を２分間行ない
、エポキシ樹脂板を無電解銅めっきを行なうために増感
した。増感したエポキシ樹脂板を液温２５℃、 ＰＨ＝
１２．８の無電解銅めっき液に約１０分間浸漬し、無電
解銅めっき膜をエポキシ樹脂板の全面に析出させた。エ
ポキシ樹脂板の表面及び貫通孔壁の無電解銅めっき膜を
光学顕微鏡で観察したところ、貫通孔壁のガラス繊維面
を含むエポキシ樹脂板の全面が無電解銅めっきで完全に
被覆されていた。(Example 1) A glass fiber reinforced epoxy resin board was prepared as an insulating material,
A through hole was formed in the epoxy resin plate using a drill. Next, the epoxy resin plate was treated with Conditioner 1175 for electroless plating manufactured by Shipley Co., Ltd. at a liquid temperature of 70° C. for 5 minutes to make the surface of the epoxy resin plate (including the through-hole walls) hydrophilic. Then, after washing with water, the entire surface of the epoxy resin board (including the walls of the through holes) was immersed in a copper colloid aqueous solution with a pH of 5.5° and a liquid temperature of 25°C for 3 minutes.
A copper colloid film was formed. Next, after washing with water, palladium chloride 0.01 (1/f! (0.006 g/j as palladium ions > PH = 1.8) was immersed in a palladium ion aqueous solution for about 30 seconds to coat the surface of the copper colloid membrane with palladium. After forming the metal, it was washed with water for 2 minutes, and the epoxy resin plate was sensitized for electroless copper plating.
12.8 for about 10 minutes to deposit an electroless copper plating film over the entire surface of the epoxy resin board. When the electroless copper plating film on the surface of the epoxy resin plate and the walls of the through holes was observed using an optical microscope, it was found that the entire surface of the epoxy resin plate, including the glass fiber surface of the through hole walls, was completely covered with electroless copper plating.
（実施例２）
絶縁材として実施例１と同じエポキシ樹脂板を用意した
。エポキシ樹脂板の表面を液温６０°Ｃのクロム酸−硫
酸混液で約２０分間処理し親水化した。(Example 2) The same epoxy resin board as in Example 1 was prepared as an insulating material. The surface of the epoxy resin plate was treated with a chromic acid-sulfuric acid mixture at a temperature of 60° C. for about 20 minutes to make it hydrophilic.
次いで亜硫酸水素ナトリウム水溶液に３分間浸漬し、エ
ポキシ樹脂板表面のクロムイオン（６価）を中和し、無
毒化する。Next, the plate is immersed in an aqueous sodium bisulfite solution for 3 minutes to neutralize the chromium ions (hexavalent) on the surface of the epoxy resin plate and render it nontoxic.
次に実施例１と同様な操作により、エポキシ樹脂板表面
にパラジウム金属を形成させ、エポキシ樹脂板を無電解
銅めっきを行なうために増感した。Next, palladium metal was formed on the surface of the epoxy resin plate by the same operation as in Example 1, and the epoxy resin plate was sensitized for electroless copper plating.
増感したエポキシ樹脂板を液温２５℃、 Ｐｔ＋＝１２
．８の無電解銅めっき液に約１５分間浸漬し、エポキシ
樹脂板の全面に無電解銅めっき膜を検出させた。エポキ
シ樹脂板は無電解銅めっき膜で完全に被覆された。Sensitized epoxy resin plate at liquid temperature of 25℃, Pt+=12
．． The plate was immersed in the electroless copper plating solution No. 8 for about 15 minutes, and an electroless copper plating film was detected on the entire surface of the epoxy resin plate. The epoxy resin plate was completely covered with an electroless copper plating film.
［発明の効果］
以上説明したように本発明により、絶縁材の表面はパラ
ジウム金属で従来技術より確実に増感させることができ
、従って絶縁材の表面を無電解めっきで完全に被覆でき
る効果がある。[Effects of the Invention] As explained above, according to the present invention, the surface of the insulating material can be more reliably sensitized with palladium metal than in the prior art, and therefore the surface of the insulating material can be completely covered with electroless plating. be.
また本発明は実施例で示したエポキシ樹脂板の絶縁材ば
かりでなく、セラミック基板等の絶縁材に無電解めっき
するための増感にも使用することができる効果を有する
ものでおる。Furthermore, the present invention has the effect that it can be used not only for the insulating material of epoxy resin plates as shown in the examples, but also for sensitization for electroless plating of insulating materials such as ceramic substrates.
Claims (1)
た絶縁材表面を銅コロイド水溶液に接触させ、絶縁材表
面に銅コロイド膜を形成させる工程と、銅コロイド膜の
形成された前記絶縁材表面をパラジウムイオン（Ｐｄ＾
＋＾＋）を含む水溶液に接触させる工程とを行うことを
特徴とする絶縁材表面を無電解めつきするための増感方
法。(1) A step of making the surface of the insulating material hydrophilic; a step of bringing the hydrophilized surface of the insulating material into contact with an aqueous copper colloid solution to form a copper colloid film on the surface of the insulating material; The surface of the insulating material is coated with palladium ions (Pd^
1. A sensitizing method for electroless plating the surface of an insulating material, the method comprising the step of bringing the surface of an insulating material into contact with an aqueous solution containing +^+).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14093286A JPS62297472A (en) | 1986-06-17 | 1986-06-17 | Method for sensitizing surface of insulating material before electroless plating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14093286A JPS62297472A (en) | 1986-06-17 | 1986-06-17 | Method for sensitizing surface of insulating material before electroless plating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62297472A true JPS62297472A (en) | 1987-12-24 |
Family
ID=15280168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14093286A Pending JPS62297472A (en) | 1986-06-17 | 1986-06-17 | Method for sensitizing surface of insulating material before electroless plating |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62297472A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04183873A (en) * | 1990-11-19 | 1992-06-30 | Agency Of Ind Science & Technol | Electroless plating method to high-polymer molding by using ultraviolet laser |
| US6264851B1 (en) * | 1998-03-17 | 2001-07-24 | International Business Machines Corporation | Selective seed and plate using permanent resist |
-
1986
- 1986-06-17 JP JP14093286A patent/JPS62297472A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04183873A (en) * | 1990-11-19 | 1992-06-30 | Agency Of Ind Science & Technol | Electroless plating method to high-polymer molding by using ultraviolet laser |
| US6264851B1 (en) * | 1998-03-17 | 2001-07-24 | International Business Machines Corporation | Selective seed and plate using permanent resist |
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