JPS62296378A - Parts for solder connection - Google Patents
Parts for solder connectionInfo
- Publication number
- JPS62296378A JPS62296378A JP14086086A JP14086086A JPS62296378A JP S62296378 A JPS62296378 A JP S62296378A JP 14086086 A JP14086086 A JP 14086086A JP 14086086 A JP14086086 A JP 14086086A JP S62296378 A JPS62296378 A JP S62296378A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- flux
- temperature indicating
- temperature
- indicating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 36
- 230000004907 flux Effects 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 20
- 238000002845 discoloration Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000008602 contraction Effects 0.000 description 8
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 6
- 239000000987 azo dye Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- 239000004677 Nylon Substances 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 229950011260 betanaphthol Drugs 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 229920001778 nylon Polymers 0.000 description 3
- 239000000088 plastic resin Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- ALKYHXVLJMQRLQ-UHFFFAOYSA-N 3-Hydroxy-2-naphthoate Chemical compound C1=CC=C2C=C(O)C(C(=O)O)=CC2=C1 ALKYHXVLJMQRLQ-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- 239000004709 Chlorinated polyethylene Substances 0.000 description 1
- 241000594009 Phoxinus phoxinus Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000001055 blue pigment Substances 0.000 description 1
- 229920003020 cross-linked polyethylene Polymers 0.000 description 1
- 239000004703 cross-linked polyethylene Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910001504 inorganic chloride Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 210000002784 stomach Anatomy 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- PRZSXZWFJHEZBJ-UHFFFAOYSA-N thymol blue Chemical compound C1=C(O)C(C(C)C)=CC(C2(C3=CC=CC=C3S(=O)(=O)O2)C=2C(=CC(O)=C(C(C)C)C=2)C)=C1C PRZSXZWFJHEZBJ-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- PEAGNRWWSMMRPZ-UHFFFAOYSA-L woodstain scarlet Chemical compound [Na+].[Na+].OC1=CC=C2C=C(S([O-])(=O)=O)C=C(S([O-])(=O)=O)C2=C1N=NC(C=C1)=CC=C1N=NC1=CC=CC=C1 PEAGNRWWSMMRPZ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
６、発明の詳細な説明
（産業上の利用分野）
本発明は、電線、金属パイプ等に装着、加熱して、半田
付けと絶縁保護あるいは防蝕保護等を同時に処理する示
温材付フラックスを内蔵した半田接続用部品に関するも
のである。[Detailed Description of the Invention] 6. Detailed Description of the Invention (Field of Industrial Application) The present invention provides a method for attaching and heating electric wires, metal pipes, etc. to simultaneously process soldering, insulation protection, corrosion protection, etc. This invention relates to solder connection parts that have a built-in flux with a temperature indicator.
（従来の技術）
従来の示温材付フラックス内蔵半田リング入りチューブ
は第３図に示すように熱収縮チューブ１内に半田リング
２（示温材入りフラックス３を半田表面にコーティング
しである）を装着したものである。これを電線に装着加
熱し、半田付けと絶縁保護あるいは防蝕保護を同時に処
理している。(Prior art) As shown in Fig. 3, a conventional tube with a solder ring and a temperature-indicating flux has a solder ring 2 (with a temperature-indicating flux 3 coated on the solder surface) inside a heat-shrinkable tube 1. This is what I did. This is attached to the wire and heated to provide soldering and insulation protection or corrosion protection at the same time.
なお、フラックスは上述のように半田付は完了温度を、
その温度での変色によって知らしめる示温材が含有され
ている。In addition, as mentioned above, the soldering completion temperature of the flux is
It contains a temperature indicating material that indicates the temperature by changing color.
（発明が解決しようとする問題点）
従来の半田接続用部品すなわち示温材付フラックス内蔵
の半田リング入りチューブを電線芯材に装着した際の収
縮初期、中期、後期の状態をそれぞれ第４図（イ） 、
（ＣＩ 、 （→に示して説明する。(Problems to be Solved by the Invention) Figure 4 shows the initial, middle, and late stages of shrinkage when a conventional solder connection component, that is, a tube with a solder ring containing a built-in flux with a temperature indicator, is attached to a wire core material. stomach) ,
(CI, (shown and explained in →).
（づは収縮チューブ１を電線芯材４に装着した収縮初期
で、示温材付フラックス３．半田リング２に大きな変化
は認められない。(This is the initial stage of shrinkage when the shrink tube 1 is attached to the wire core material 4, and no major changes are observed in the flux 3 with temperature indicator and the solder ring 2.
しかし、（鴫の収縮中期（乙０〜に００Ｃ）においては
、半田がとける前（フラックスの融点は乙ｏ−ｇｏ°Ｃ
７半田の融点は／ＩＩ３〜／す３°Ｃ）に示温材付フラ
ンクスが（ロ）のように流動状態となり、収縮チューブ
の収縮力でフラックスが両サイドに逃げる。なお・この
収縮中期の湿度では示温材は変化しない。However, before the solder melts (during the middle stage of flux contraction (0 to 00C), the melting point of flux is 0 to 00C).
7. The melting point of solder is /II3~/S3°C), and the flux with temperature indicator becomes fluid as shown in (b), and the shrinkage force of the shrink tube causes the flux to escape to both sides. Note that the temperature indicator material does not change at this humidity during the middle of contraction.
収縮後期にはＧ／→のように示温材付フラックス３は半
田部位から全くおしのけられてしまう。In the latter stage of contraction, the temperature indicating flux 3 is completely pushed away from the soldering area as shown by G/→.
従って、半田表面に示温材が残らず観察困難である上、
半田の温度も正確に指示できない。Therefore, no temperature indicating material remains on the solder surface, making it difficult to observe.
It is also not possible to accurately indicate the temperature of the solder.
これは示温材が流動的なフラックスに含有されているか
らである。This is because the temperature indicating material is contained in a fluid flux.
この点が本発明の解決しようとする問題点である。This point is the problem to be solved by the present invention.
（問題点を解決するための手段）
フラックスを半田内に含有あるいは分散・混合させ、示
温材を直接半田表面にコーティングすることにして、フ
ラックスと示温材を分離させた。(Means for solving the problem) The flux was contained or dispersed/mixed in the solder, and the temperature indicating material was coated directly on the solder surface, thereby separating the flux and the temperature indicating material.
（作用）
フラックスを半田内に含有あるいは分散・混合させ、示
温材を半田表面にコーティングさせているので示温材が
流されることがない。(Function) Flux is contained or dispersed/mixed in the solder, and the temperature indicating material is coated on the solder surface, so the temperature indicating material is not washed away.
（実施例）
第１図は本発明の示温材付フラックス内蔵半田リング１
０入りチューブのチューブを省略した実施例説明図で、
半田１１はその中にフラックス粒１２を含有し、その外
側に示温材１３をコーティングしである。(Example) Fig. 1 shows a solder ring 1 with temperature indicating material and built-in flux of the present invention.
This is an explanatory diagram of an embodiment in which a tube containing 0 is omitted,
The solder 11 contains flux particles 12 therein and is coated with a temperature indicating material 13 on the outside.
第２図は、第１図の半田リング１０を装着した熱収縮チ
ューブの使用状況を示すもので、（イ）は収縮初期の状
態で１は熱収縮チューブ、１０は半田リング、（に）は
収縮後期の状態で示温材１３が収縮完了まで流されるこ
となく半田表面に残る。Figure 2 shows the usage of the heat-shrinkable tube with the solder ring 10 of Figure 1 attached. In the late stage of contraction, the temperature indicating material 13 remains on the solder surface without being washed away until the contraction is completed.
本実施例に用いられる（１）透明または半透明な熱収縮
チューブの材質例、（２）示温材の例、（３１フラツク
スの例を以下に列挙する。Examples of (1) transparent or translucent heat shrink tube material, (2) temperature indicating material, and (31 flux) used in this example are listed below.
（１）透明または半透明な熱収縮チューブの材質架橋ポ
リエチレン 架橋ナイロン乙架橋ＥＶＡ
架橋ナイロン／２架橋ＥＥＡ 架橋４
乙ナイロン架橋難燃塩素化ポリエチレン
その他架橋ポリオレフィン混合物
ｖＣ
難燃ＰＶＣ
ＶＤＦ
ＴＦＥ
（２）示温材の例
ＡＣｉｄ Ｒｅｄ ７３
（Ｐフェルアゾアニリンとして２−ナフトール乙、ｆ−
ジスルホン酸から誘導されるジアゾ染料）
Ｐｉｇｍｅｎｔ Ｒｅｄ ３
（２−＝ドローＰ−トルイジンと２−ナフトールから誘
導されるアゾ染料）
チモールブルー
Ｐｉｇｍｅｎｔ Ｒｅｄ ３；２
（２−７ミノー５−クロロ−Ｐ−トルエンスルホン酸と
３−ヒドロキシ−２−ナフトエ酸から誘導されるアゾ染
料）
プレモクレソルグリーン
Ｓ、）ｌｙｅｎｔ Ｒｅｄ ２１１−
（ｇ−ｏ−トリルアゾ−〇−）ルイジンと２ナフトール
から誘導されるアゾ染料）
ｐ ｉ ｇｍｅｎ ｔ ’ｆｅ Ｉ Ｉ ｏｗ ！；（
０−ニトロアニリンとアクトアクタニライドから誘導さ
れるアゾ染料）
ＢａｓｉＣＶｉｏｌｅｔ ／Ｉｆ
（アニリンとトルイジンから誘導される物質）Ｐｉｇｍ
ｅｎｔ Ｑｒａｎｇｅ 、１
（０−ニトロアニリンと２−す７トールカラ誘導される
アゾ染料）
（３） フラックスの例
ＡＣ：無機塩化物フラックス（粉末状）Ｒ：非活性化ロ
ジンフラックス（粉末状およびプラスチック樹脂状）
ＲＭＡ：弱活性化ロジンフラックス（粉末状およびプラ
スチック樹脂状）
ＲＡ＝活性化ロジンフラックス（粉末状およびプラスチ
ック樹脂状）
および上記を溶剤にとかした液状
（発明の効果）
本発明の半田接続用部品は、示温材が直接半田に付着し
ているので、示温材の変化が明瞭に観察できるのが大き
な効果である。(1) Material of transparent or translucent heat shrink tube: Cross-linked polyethylene, cross-linked nylon, cross-linked EVA
Crosslinked nylon/2 crosslinked EEA crosslinked 4
Otsu Nylon crosslinked flame-retardant chlorinated polyethylene and other crosslinked polyolefin mixtures vC Flame-retardant PVC VDF TFE (2) Examples of temperature indicating materials ACid Red 73 (2-naphthol Otsu as Pferazoaniline, f-
Diazo dye derived from disulfonic acid) Pigment Red 3 (Azo dye derived from 2-=draw P-toluidine and 2-naphthol) Thymol Blue Pigment Red 3;2 (2-7 minnow 5-chloro-P-toluene Azo dye derived from sulfonic acid and 3-hydroxy-2-naphthoic acid) Premocresol Green S,) lyent Red 211- (Azo dye derived from go-o-tolylazo-〇-)luidine and 2-naphthol) p I gment 'fe I Iow! ;(
Azo dye derived from 0-nitroaniline and acto-actanilide) BasiCViolet /If (substance derived from aniline and toluidine) Pigm
ent Qrange, 1 (Azo dye derived from 0-nitroaniline and 2-S7 Tolkala) (3) Examples of fluxes AC: Inorganic chloride flux (powder form) R: Non-activated rosin flux (powder form and plastic resin RMA: Weakly activated rosin flux (powder form and plastic resin form) RA = Activated rosin flux (powder form and plastic resin form) and liquid form obtained by dissolving the above in a solvent (effects of the invention) For solder connections of the present invention Since the temperature indicating material is directly attached to the solder of the component, a major effect is that changes in the temperature indicating material can be clearly observed.
第１図は本発明の半田接続用部品の最重要部である半田
リングの斜視図、第２図は第１図の半田リングを装着し
た収縮チューブの使用状態を示すもので、（イ）はチュ
ーブの収縮初期、（→はチューブの収縮後期の説明図、
第３図は従来の示温付人りフラックス付半田リング入り
熱収縮チューブの説明図、第４図は第３図の使用状況図
で、（づは収縮初期、（→は収縮中期、（／つは収縮後
期の説明図である。
１・・・熱収縮チューブ、２・・・半田リング（示温付
人りフラックスを半田表面にコーティングしである）、
３・・・示温付人りフラックス、４・・・電線芯材、１
０・・・本発明に係る半田リング、１１・・・半田、１
２・・・フラックス粒、１３・・・示温材。
第１図
第２図Fig. 1 is a perspective view of the solder ring, which is the most important part of the solder connection component of the present invention, and Fig. 2 shows the use state of the shrink tube with the solder ring of Fig. 1 attached. Early stage of tube contraction, (→ is an explanatory diagram of the late stage of tube contraction,
Figure 3 is an explanatory diagram of a conventional heat-shrinkable tube containing a solder ring with a temperature indicator and flux, and Figure 4 is a usage diagram of Figure 3. 1 is an explanatory diagram of the late stage of contraction. 1... Heat shrinkable tube, 2... Solder ring (temperature indicating flux is coated on the solder surface),
3... Temperature indicator flux, 4... Wire core material, 1
0...Solder ring according to the present invention, 11...Solder, 1
2...Flux grains, 13...Temperature indicating material. Figure 1 Figure 2
Claims (1)
ューブからなる物品であつて、前記半田部材がフラック
スを含有し、該半田部材の外周表面に示温材層が設けら
れ、前記熱収縮性チューブが前記示温材の変色を少なく
とも透視できる程度に透明または半透明であることを特
徴とする半田接続用部品。 ２、フラックスが半田部材内に分散されていることを特
徴とする特許請求の範囲第１項記載の半田接続用部品。[Scope of Claims] 1. An article consisting of a heat-shrinkable tube with a ring-shaped solder member attached therein, the solder member containing flux, and a temperature indicating material layer on the outer peripheral surface of the solder member. A solder connection component, wherein the heat-shrinkable tube is transparent or translucent to the extent that at least the discoloration of the temperature indicating material can be seen through. 2. The solder connection component according to claim 1, wherein flux is dispersed within the solder member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14086086A JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14086086A JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62296378A true JPS62296378A (en) | 1987-12-23 |
| JPH0361990B2 JPH0361990B2 (en) | 1991-09-24 |
Family
ID=15278425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14086086A Granted JPS62296378A (en) | 1986-06-16 | 1986-06-16 | Parts for solder connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62296378A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231568A (en) * | 1984-04-13 | 1985-11-18 | レイケム・ソシエテ・アノニム | Instrument for solder connecting and formation and application thereof |
-
1986
- 1986-06-16 JP JP14086086A patent/JPS62296378A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60231568A (en) * | 1984-04-13 | 1985-11-18 | レイケム・ソシエテ・アノニム | Instrument for solder connecting and formation and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0361990B2 (en) | 1991-09-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |