JPS62294208A - Method for connecting waveguide and optical fiber - Google Patents
Method for connecting waveguide and optical fiberInfo
- Publication number
- JPS62294208A JPS62294208A JP13749186A JP13749186A JPS62294208A JP S62294208 A JPS62294208 A JP S62294208A JP 13749186 A JP13749186 A JP 13749186A JP 13749186 A JP13749186 A JP 13749186A JP S62294208 A JPS62294208 A JP S62294208A
- Authority
- JP
- Japan
- Prior art keywords
- waveguide
- optical fiber
- face
- guide
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 65
- 238000000034 method Methods 0.000 title claims description 13
- 230000003287 optical effect Effects 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 230000002093 peripheral effect Effects 0.000 claims abstract description 6
- 229910052751 metal Inorganic materials 0.000 claims description 32
- 239000002184 metal Substances 0.000 claims description 32
- 230000004927 fusion Effects 0.000 claims description 4
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052737 gold Inorganic materials 0.000 abstract description 6
- 239000010931 gold Substances 0.000 abstract description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 5
- 239000011651 chromium Substances 0.000 abstract description 5
- 229910052804 chromium Inorganic materials 0.000 abstract description 5
- 229910052709 silver Inorganic materials 0.000 abstract description 5
- 239000004332 silver Substances 0.000 abstract description 5
- 238000003466 welding Methods 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 238000007796 conventional method Methods 0.000 description 5
- 238000005253 cladding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000012792 core layer Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- -1 ROM Chemical compound 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 210000000080 chela (arthropods) Anatomy 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔概要〕
導波路基板に所望の導波路が形成された平板形光部品を
、光ファイバーを使用して外部接続するにあたり、導波
路基板に設けたガイドと光ファイバーとに、それぞれ金
属膜を形成し、金属膜を融着するか、或いは半田付は接
着することにより、固着強度を高めて、光結合度を向上
させる。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] When connecting a planar optical component, in which a desired waveguide is formed on a waveguide substrate, to the outside using an optical fiber, A metal film is formed on each of the guide and the optical fiber, and the metal film is fused or bonded by soldering to increase the adhesion strength and improve the degree of optical coupling.
本発明方法は、導波路と光ファイバーとの接続方法の改
良に関する。The method of the present invention relates to an improvement in the method of connecting a waveguide and an optical fiber.
光部品は、光ファイバーを導波路として、光ファイバー
、レンズ、プリズム、或いは光合分波機能を有するガラ
ス板を、基台上に光結合させて組合わせた、所謂バルク
形光部品から、導波路基板の表面にチャンネル状に突出
した所謂、リッジ形感波路、或いは導波路基板の表面側
の内部をパターン状に屈折率を高くした所謂、埋込み形
感波路を備えた平板形光部品に変換しつつある。Optical components range from so-called bulk optical components, in which optical fibers are used as waveguides, and optical fibers, lenses, prisms, or glass plates with optical multiplexing and demultiplexing functions are optically coupled together on a base. They are being converted into planar optical components with so-called ridge-shaped waveguides protruding from the surface in the form of channels, or so-called embedded waveguides with a high refractive index patterned inside the surface side of the waveguide substrate. .
このような平板形光部品である光集積回路、光合・分岐
器、光合・分波器、或いは光スィッチ等は、小形で、光
結合損失が小さい等の長所を備えているので、広く使用
されつつある。These planar optical components such as optical integrated circuits, optical multiplexers/branchers, optical multiplexers/demultiplexers, and optical switches have advantages such as small size and low optical coupling loss, so they are widely used. It's coming.
第３図は平板形光部品の１例の平面図であって、図示し
た平板形光部品は、光合・分岐器を示し、導波路基板１
の表面に、１本の導波路素子が途中で、２本の導波路素
子に分岐された導波路２を形成しである。FIG. 3 is a plan view of an example of a flat optical component.
A waveguide 2 is formed on the surface of the waveguide 2, in which one waveguide element is branched into two waveguide elements midway.
なお、この導波路２は埋込み形、或いはリッジ形の導波
路である。Note that this waveguide 2 is a buried type or ridge type waveguide.
平板形光部品と外部とを接続するには、伝送路として光
ファイバー３が使用される。光ファイバー３と導波路２
とを光結合させるには、光ファイバー３と導波路２の軸
心を一致させ、且つ光ファイバー端面３ａと導波路端面
２ａとを当接させる必要がある。An optical fiber 3 is used as a transmission path to connect the flat optical component to the outside. Optical fiber 3 and waveguide 2
In order to optically couple the two, it is necessary to align the axes of the optical fiber 3 and the waveguide 2, and to bring the optical fiber end face 3a and the waveguide end face 2a into contact.
このことを容易にするために、光結合状態で光ファイバ
ー３を固着するガイド４を、それぞれの導波路素子の延
長線上に設けである。そして、ガイド４にそれぞれの光
ファイバー３の端末部を嵌入・固着している。To facilitate this, a guide 4 for fixing the optical fiber 3 in an optically coupled state is provided on the extension line of each waveguide element. Then, the end portions of the respective optical fibers 3 are fitted into the guide 4 and fixed thereto.
なお、導波路２がリッジ形導波路の場合は、ガイド４は
導波路基板１の上面に突出した２条の平行した突起体よ
りなり、導波路２が埋込み形感波路の場合は、ガイド４
は導波路基板１に設けた溝である。Note that when the waveguide 2 is a ridge-type waveguide, the guide 4 consists of two parallel protrusions protruding from the top surface of the waveguide substrate 1, and when the waveguide 2 is an embedded waveguide, the guide 4
is a groove provided in the waveguide substrate 1.
上述のような平板形光部品の導波路と光ファイバーとの
接続に際し、光ファイバーの接着強度が充分に強いこと
が要求されている。When connecting the optical fiber to the waveguide of the flat optical component as described above, it is required that the adhesive strength of the optical fiber be sufficiently strong.
第４図の（ａｌ、 （ｂｌは従来方法の工程を示す１図
であって、第４図に示す導波路２は埋込み形感波路であ
る。(al and (bl) in FIG. 4 are diagrams showing the steps of a conventional method, and the waveguide 2 shown in FIG. 4 is a buried waveguide.
第４図（ａ）の如くに、板厚の薄い鉤子板状の導波路基
板１は、例えばニオブ酸リチウムのような電゛気光学効
果を有する結晶板であって、表面側よりＴｉ等を拡散し
て、導波路基板よりは屈折率の大きい導波路２を形成し
である。この導波路端面２ａは、■溝形、Ｕ溝形、或い
は半円溝形等である。As shown in FIG. 4(a), the waveguide substrate 1 in the shape of a thin pincer plate is a crystal plate having an electro-optical effect, such as lithium niobate, and is coated with Ti or the like from the surface side. The light is diffused to form a waveguide 2 having a higher refractive index than the waveguide substrate. This waveguide end face 2a is shaped like a ■ groove, a U groove, or a semicircular groove.
そして、導波路２の端末の延長線部分を、エツチングし
て、導波路基板１の側端面で開口する溝る、従来方法は
下記の如くである。The conventional method of etching the extension of the end of the waveguide 2 to form a groove opening at the side end surface of the waveguide substrate 1 is as follows.
従来は、第４図（ａｌのような導波路２を有する導波路
基板１のガイド４の内壁、或いは光ファイバー３の外周
面に、接着剤５を塗布した後に、第４図（ｂｌの如くに
、光ファイバー端面３ａが導波路端面２ａに当接するよ
うに、光ファイバー３をガイド４に嵌入する。Conventionally, after applying the adhesive 5 to the inner wall of the guide 4 of the waveguide substrate 1 having the waveguide 2 as shown in FIG. 4 (al) or to the outer peripheral surface of the optical fiber 3, , the optical fiber 3 is inserted into the guide 4 so that the optical fiber end face 3a contacts the waveguide end face 2a.
そして、光ファイバー３をガイド４に押圧した状態で放
置して、接着材５を硬化させて、光ファイバー３を導波
路基板１に固着している。Then, the optical fiber 3 is left pressed against the guide 4 to allow the adhesive 5 to harden, thereby fixing the optical fiber 3 to the waveguide substrate 1.
しかしながら上記従来方法は、光ファイバー３に引張力
が附加されると、接着剤５の接着力が弱いことに起因し
て、光ファイバー３が動き、光ファイバー端面３ａと導
波路端面２ａとの間に隙間が生じ、その結果、光結合損
失が増加するという問題点がある。However, in the above conventional method, when a tensile force is applied to the optical fiber 3, the optical fiber 3 moves due to the weak adhesive force of the adhesive 5, and a gap is created between the optical fiber end surface 3a and the waveguide end surface 2a. As a result, there is a problem that optical coupling loss increases.
また、光ファイバー３と導波路基板ｌとの熱膨張係数が
異なるので、周囲温度が著しく変動すると、接着剤５の
接着力が弱いので、光ファイバー端面３ａがずれたり、
或いは導波路端面２ａとの間に隙間が生じて、光結合損
失が変動するという問題点がある。Furthermore, since the coefficients of thermal expansion of the optical fiber 3 and the waveguide substrate l are different, if the ambient temperature fluctuates significantly, the adhesive force of the adhesive 5 will be weak, causing the optical fiber end face 3a to shift.
Alternatively, there is a problem in that a gap is generated between the waveguide end face 2a and the optical coupling loss fluctuates.
さらにまた、接着剤５の硬化時間が長いという問題点が
ある。Furthermore, there is a problem that the curing time of the adhesive 5 is long.
Ｃ問題点を解決するための手段〕
上記従来の問題点を解決するため本発明方法はは、第１
図に示すように、導波路２の延長線上の導波路基板１部
分に、ガイド４を設け、ガイド４に、例えば金、銀、銅
、クロム、ニッケル等の金属膜７を形成する。また一方
、ガイド４に嵌入して導波路２と光結合する光ファイバ
ー３の外周面を、例えば金、銀、銅、り、ロム、ニッケ
ル等でコーテングして、金属膜６を設ける。Means for Solving Problem C] In order to solve the above-mentioned conventional problems, the method of the present invention has the following features:
As shown in the figure, a guide 4 is provided on a portion of the waveguide substrate 1 on an extension of the waveguide 2, and a metal film 7 of, for example, gold, silver, copper, chromium, nickel, etc. is formed on the guide 4. On the other hand, the outer peripheral surface of the optical fiber 3 that is inserted into the guide 4 and optically coupled to the waveguide 2 is coated with, for example, gold, silver, copper, phosphor, ROM, nickel, etc., to provide a metal film 6.
そして、光ファイバー３をガイド４に嵌太し、光ファイ
バー端面３ａを導波路端面２ａに当接した状態で、金属
膜６と金属膜７とを融着、または半田付は接着するよう
にしたものである。Then, the optical fiber 3 is fitted into the guide 4, and with the optical fiber end face 3a in contact with the waveguide end face 2a, the metal film 6 and the metal film 7 are fused or soldered together. be.
或いは光ファイバー端面３ａと導波路端面２ａとを、融
着、または光学接着剤で接着すること、及び金属膜６と
金属膜７とを融着、または半田付は接着することを併用
するようにしたものである。Alternatively, the optical fiber end face 3a and the waveguide end face 2a are fused or bonded with an optical adhesive, and the metal film 6 and the metal film 7 are fused or soldered together. It is something.
上記本発明方法によれば、光ファイバー３とガイド４と
を、金属膜同志の融着、または半田付は接着するので、
固着時間が短く、且つ固着強度が強い。したがって、光
ファイバー３に引張力が附加されたり、或いは周囲温度
が著しく変動しても、光ファイバー３がずれたりして、
光ファイバー端面３ａと導波路端面２ａとの間に隙間が
生ずる恐れがなく、光結合度が安定する。According to the method of the present invention, the optical fiber 3 and the guide 4 are bonded together by fusion or soldering of the metal films.
The fixing time is short and the fixing strength is strong. Therefore, even if a tensile force is applied to the optical fiber 3 or the ambient temperature changes significantly, the optical fiber 3 may be displaced.
There is no possibility that a gap will be formed between the optical fiber end face 3a and the waveguide end face 2a, and the degree of optical coupling is stabilized.
また、光ファイバー端面３ａと導波路端面２ａとを、融
着、または光学接着剤で接着した後に、金属膜６と金属
膜７とを融着、または半田付は接着するので、光ファイ
バー３をガイド４に固着時に、光ファイバー端面３ａと
導波路端面２ａとの間に隙間が生ずる恐れがない。Further, after the optical fiber end face 3a and the waveguide end face 2a are fused or bonded with an optical adhesive, the metal film 6 and the metal film 7 are bonded by fusion or soldering, so that the optical fiber 3 is attached to the guide 4. There is no possibility that a gap will be formed between the optical fiber end face 3a and the waveguide end face 2a when the optical fiber end face 3a and the waveguide end face 2a are fixed to each other.
以下図を参照しながら、本発明方法を具体的に説明する
。なお、企図を通じて同一符号は同一対象物を示す。The method of the present invention will be specifically explained below with reference to the drawings. Note that the same reference numerals refer to the same objects throughout the plan.
第２図の（ａ）、 （ｂ）は本発明方法の一実施例の工
程を示す図であって、導波路基板１０は石英ガラス等よ
りなる角板状で、導波路基板１０の上部には、リッジ形
導波路である導波路２０が形成されている。FIGS. 2(a) and 2(b) are diagrams showing the steps of an embodiment of the method of the present invention, in which the waveguide substrate 10 is made of quartz glass or the like and has a rectangular plate shape. A waveguide 20, which is a ridge-shaped waveguide, is formed.
第２図＋ａ）のように、この導波路２０は、導波路基板
１０の表面の全面に、基板よりは屈折率の大きい層２２
の上面にコア層２２よりも屈折率の小さいクラッド層２
３を形成した後に、エツチングして、クラッドＮ２１．
コア層２２．クラッドＮ２３を帯状に残したパターンを
設けたものである。As shown in FIG. 2+a), this waveguide 20 has a layer 22 on the entire surface of the waveguide substrate 10, which has a higher refractive index than the substrate.
A cladding layer 2 having a lower refractive index than the core layer 22 is disposed on the upper surface of the core layer 22.
After forming cladding N21.3, etching is performed to form cladding N21.
Core layer 22. A pattern is provided in which the cladding N23 remains in a band shape.
また、導波路端面２０ａ側の導波路２０の延長線上で導
波路２０の側縁近傍に、この延長線を挟んで両側に、突
出した平行した２条の突起体となるように、エツチング
等してガイド４０を設ける。In addition, etching is performed on the extension line of the waveguide 20 on the waveguide end face 20a side, near the side edge of the waveguide 20, so that two protruding parallel protrusions are formed on both sides of the extension line. A guide 40 is provided.
このガイド４０の内壁、及び上面に、スパッタリング、
蒸着或いはメッキ等して金、銀、銅、クロム、ニッケル
等の金属膜７を形成する。Sputtering is applied to the inner wall and upper surface of this guide 40.
A metal film 7 of gold, silver, copper, chromium, nickel, etc. is formed by vapor deposition or plating.
また、光ファイバー３の外周面の金属膜７に対応する個
所を、金、根、銅、クロム、二、ケル等よりなる金属膜
６をスパッタリング、蒸着或いはメッキ等して形成する
。Further, a metal film 6 made of gold, metal, copper, chromium, carbon dioxide, or the like is formed on the outer peripheral surface of the optical fiber 3 at a location corresponding to the metal film 7 by sputtering, vapor deposition, plating, or the like.
上述のような光ファイバー３を、第２図（ｂ）のように
、ガイド４０に嵌入し、光ファイバー端面３ａを導波路
端面２０ａに当接し、この当接部８を、例えばＣＯ□レ
ーザーで照射して、光ファイバー３の端部を溶融して、
導波路端面２０ａに融着する。The optical fiber 3 as described above is inserted into the guide 40 as shown in FIG. 2(b), the optical fiber end face 3a is brought into contact with the waveguide end face 20a, and this contact portion 8 is irradiated with, for example, a CO□ laser. and melt the end of the optical fiber 3,
It is fused to the waveguide end face 20a.
なお、融着せずに光ファイバー端面３ａと導波路端面２
０ａとを光学接着剤で接着しても良い。Note that the optical fiber end face 3a and the waveguide end face 2 are bonded without being fused.
0a may be bonded with an optical adhesive.
その後、光ファイバー３とガイド４０の接触部に、例え
ばＹＡＧレーザーを照射して、金属膜６と金属膜７とを
融着する。Thereafter, the contact portion between the optical fiber 3 and the guide 40 is irradiated with, for example, a YAG laser to fuse the metal film 6 and the metal film 7 together.
この際、適当の波長のレーザーを照射することにより、
光ファイバー３．或いはガイド４０が溶融することなく
、金属膜６と金属膜７のみが溶融・固着するので、光フ
ァイバー３をガイド４に固着することができる。At this time, by irradiating a laser with an appropriate wavelength,
Optical fiber 3. Alternatively, the optical fiber 3 can be fixed to the guide 4 because only the metal film 6 and the metal film 7 are melted and fixed without the guide 40 melting.
また、金属膜６と金属膜７とを融着固定せずに、半田付
は接着しても良い。Further, the metal film 6 and the metal film 7 may be soldered together without being fused and fixed.
この際、ガイド４０と光ファイバー３とは、それぞれ金
属膜７．金属膜６が形成されているので、半田の濡れ性
が良くて、半田付けの強度が強い。At this time, the guide 40 and the optical fiber 3 each have a metal film 7. Since the metal film 6 is formed, the solder wettability is good and the soldering strength is strong.
上記の光ファイバー３とガイド４０とは、融着、半田付
は接着のいずれにせよ、金属同志の接着であるので、そ
の接着強度は、従来の接着剤によるものよりは、充分に
大きく強いものである。The optical fiber 3 and the guide 40 are bonded between metals, whether by fusion bonding or soldering, so the bonding strength is sufficiently larger and stronger than that of conventional adhesives. be.
実施例は光ファイバー端面３ａと導波路端面２ａとを融
着、または光学接着剤で接着後に、光ファイバー３をガ
イド４０に固着したものであるが、このようなことをせ
ずに、単に光ファイバー３をガイド４０に、融着、或い
は半田付けしても、その固着作業時間が短いので、光フ
ァイバー端面３ａと導波路端面２０ａとの間に間隙の生
ずる恐れが少ない。In the embodiment, the optical fiber 3 is fixed to the guide 40 after the optical fiber end face 3a and the waveguide end face 2a are fused or bonded with an optical adhesive, but instead of doing this, the optical fiber 3 is simply attached. Even if the guide 40 is fused or soldered, the fixing time is short, so there is little possibility that a gap will occur between the optical fiber end face 3a and the waveguide end face 20a.
なお、本発明方法は、導波路かりフジ形導波路でなく、
第４図のような、埋込み形翼波路の場合でも上述のよう
な効果があることは勿論である。Note that the method of the present invention is applicable not only to waveguides but also to Fuji-shaped waveguides.
Of course, the above-mentioned effects can be obtained even in the case of a built-in blade waveguide as shown in FIG.
以上説明したように本発明方法は、光ファイバーとガイ
ドとの固着強度が強く、且つ固着作業が短時間であり、
また、光ファイバーに外力が付与されたり、或いは導波
路基板の周囲の温度変動があっても、光ファイバー端面
と導波路端面と間に隙間が生じる恐れがなくて、光結合
度が安定している等、実用上で優れた効果がある。As explained above, the method of the present invention has strong adhesion strength between the optical fiber and the guide, and the adhesion work is short.
In addition, even if an external force is applied to the optical fiber or there are temperature fluctuations around the waveguide substrate, there is no risk of creating a gap between the end face of the optical fiber and the end face of the waveguide, and the degree of optical coupling is stable. , has excellent practical effects.
第１図は本発明方法の原理を示す構成図、第２図の（ａ
） 、 （ｂ）は本発明方法の実施例の工程を示す図、
第３図は平板形光部品の平面間、
第４図の（ａｌ、 （ｂｌは従来方法の工程を示す図で
ある。
図において、
１．１０は導波路基板、
２．２０は導波路、
２ａ、 ２０ａは導波路端面、
３は光ファイバー、
４．４０はガイド、
第２層
子柄形九吉戸品の乎［相］図
第３ 図
祁４図Figure 1 is a block diagram showing the principle of the method of the present invention, and Figure 2 (a
) and (b) are diagrams showing the steps of an embodiment of the method of the present invention, FIG. 3 is a diagram showing the steps between the planes of a flat optical component, and FIG. 4 (al and (bl) are diagrams showing the steps of the conventional method. In the figure, 1.10 is the waveguide substrate, 2.20 is the waveguide, 2a and 20a are the waveguide end faces, 3 is the optical fiber, 4.40 is the guide, and the second layer is a Kuyoshito product with a lattice pattern. Figure 3 Figure 4
Claims (1)
、ガイド（４）を設け、該ガイド（４）に金属膜（７）
を形成し、 該導波路（２）と光結合すべく、該ガイド（４）に嵌入
・固定する光ファイバー（３）の外周面を、金属膜（６
）で被覆して、 光ファイバー端面（３ａ）を導波路端面（２ａ）に当接
した状態で、該金属膜（６）と該金属膜（７）とを融着
、または半田付け接着することを特徴とする導波路と光
ファイバーとの接続方法。 ２、導波路（２）の延長線上の導波路基板（１）部分に
、ガイド（４）を設け、該ガイド（４）に金属膜（７）
を形成し、該導波路（２）と光結合すべく、該ガイド（
４）に嵌入・固定する光ファイバー（３）の外周面を、
金属膜（６）で被覆して、 光ファイバー端面（３ａ）を導波路端面（２ａ）に当接
した状態で、該光ファイバー端面（３ａ）と、該導波路
端面（２ａ）とを、融着、または光学接着剤で接着する
とともに、 該金属膜（６）と該金属膜（７）とを融着、または半田
付け接着することを特徴とする導波路と光ファイバーと
の接続方法。[Claims] 1. A guide (4) is provided on the waveguide substrate (1) portion on the extension line of the waveguide (2), and a metal film (7) is provided on the guide (4).
The outer peripheral surface of the optical fiber (3) to be fitted and fixed to the guide (4) is coated with a metal film (6
), and with the optical fiber end face (3a) in contact with the waveguide end face (2a), the metal film (6) and the metal film (7) are fused or bonded by soldering. Features a method of connecting waveguides and optical fibers. 2. A guide (4) is provided on the waveguide substrate (1) portion on the extension line of the waveguide (2), and a metal film (7) is provided on the guide (4).
and optically couple with the waveguide (2).
4) The outer peripheral surface of the optical fiber (3) to be inserted and fixed into the
With the optical fiber end face (3a) abutting the waveguide end face (2a) while being coated with a metal film (6), the optical fiber end face (3a) and the waveguide end face (2a) are fused, Alternatively, a method for connecting a waveguide and an optical fiber, characterized in that the metal film (6) and the metal film (7) are bonded by fusion or soldering, in addition to being bonded with an optical adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13749186A JPS62294208A (en) | 1986-06-13 | 1986-06-13 | Method for connecting waveguide and optical fiber |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13749186A JPS62294208A (en) | 1986-06-13 | 1986-06-13 | Method for connecting waveguide and optical fiber |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62294208A true JPS62294208A (en) | 1987-12-21 |
Family
ID=15199891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13749186A Pending JPS62294208A (en) | 1986-06-13 | 1986-06-13 | Method for connecting waveguide and optical fiber |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62294208A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358592A2 (en) * | 1988-09-08 | 1990-03-14 | Honeywell Inc. | Metallic bond for mounting of optical fibers to integrated optical chips |
| EP0559364A1 (en) * | 1992-03-02 | 1993-09-08 | Motorola, Inc. | Magnetic holding methods for optical fiber I/O assembly |
| JPH0961674A (en) * | 1995-08-21 | 1997-03-07 | Nec Corp | Optical module and its production |
| EP1116975A2 (en) * | 2000-01-12 | 2001-07-18 | Sumitomo Electric Industries, Ltd. | Optical microbench for coupling an optical fiber and a semiconductor module |
| JP2002286977A (en) * | 2001-03-27 | 2002-10-03 | Rohm Co Ltd | Optical communication module |
-
1986
- 1986-06-13 JP JP13749186A patent/JPS62294208A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0358592A2 (en) * | 1988-09-08 | 1990-03-14 | Honeywell Inc. | Metallic bond for mounting of optical fibers to integrated optical chips |
| EP0559364A1 (en) * | 1992-03-02 | 1993-09-08 | Motorola, Inc. | Magnetic holding methods for optical fiber I/O assembly |
| JPH0961674A (en) * | 1995-08-21 | 1997-03-07 | Nec Corp | Optical module and its production |
| EP1116975A2 (en) * | 2000-01-12 | 2001-07-18 | Sumitomo Electric Industries, Ltd. | Optical microbench for coupling an optical fiber and a semiconductor module |
| EP1116975A3 (en) * | 2000-01-12 | 2004-07-07 | Sumitomo Electric Industries, Ltd. | Optical microbench for coupling an optical fiber and a semiconductor module |
| JP2002286977A (en) * | 2001-03-27 | 2002-10-03 | Rohm Co Ltd | Optical communication module |
| JP4515654B2 (en) * | 2001-03-27 | 2010-08-04 | ローム株式会社 | Module for optical communication |
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