JPS62292070A - Contact type image sensor and its production - Google Patents

Abstract

PURPOSE:To make the size in subscanning direction small and to improve the accuracy of dimension in production by positioning the adjacent photoelectric conversion element at the end of adjacent photoelectic conversion element substrates on a base member having the prescribed plane accuracy in the interval corrsponding to picture element density. CONSTITUTION:A base member 1 having the prescribed plane accurcy holds plural photoelectric conversion element substrates 2 by bringing the substrates 2 into contact directly with its base. The substrates 2 has photoelectric conversion elements 3 in array at the interval of g=62.5mum (sixteen dots/mm) and the interval of the elements 3 positioned at the end of the adjacent substrates 2 is set g=62.5upsilonm. The plural substrates 2 are arrayed in a straight line and the elements 3 are arranged in a straight line. When the distance of the edges of the elements 3 positioned at the foremost end and the substrates 2 is set as l and the interval between the substrates 2 is set as delta, g=2l+delta is obtained. If delta=0 and g=2l are set, the substrates 2 are arranged tightly. Thus the size in subscanning direction can be made small and the accuracy of dimension in production can be improved.

Description

[Detailed description of the invention] 3. Detailed description of the invention.

[Industrial application field]

The present invention is suitable for large size materials.1. The present invention relates to a contact type image sensor that allows a photoelectric conversion element array having the same length as the document width to be linearly arranged with a predetermined accuracy even if the image sensor is yr, and a method for manufacturing the same.

[Conventional technology]

As a conventional contact type image sensor, for example,
There is one shown in Japanese Patent No. 0-128772. The contact image sensor shown here has a photoelectric conversion element substrate (for example, a photoelectric conversion element substrate (such as amorphous silicon, C6S, etc.) having a photoelectric conversion element array made of amorphous silicon, C6S, etc. on two parallel straight lines separated by a predetermined number of pinches in the sub-scanning direction. The image sensor chips (image sensor chips) are arranged in a staggered manner at predetermined intervals in the main scanning direction.

In the above configuration, for example, when an original is placed on the platen (not shown) of a facsimile machine and the original is transported at a speed corresponding to the sub-scanning speed, the reflected light on the original scanning line irradiated by the light source Fock lens (not shown)
The image is formed on the corresponding photoelectric conversion element via the .

At this time, the contents of the document are read on two scanning lines separated by a predetermined number of pitches in the sub-scanning direction, at intervals corresponding to the spacing of the photoelectric conversion element board in the main scanning direction, and converted into electrical signals. After that, it undergoes predetermined signal processing. That is, by alternately combining and synthesizing the reading signals of the odd-numbered areas read on the first scanning line and the reading signals of the even-numbered areas read on the second scanning line, main scanning corresponding to the document width is performed. A read signal of scan lines with constant direction can be obtained. Therefore, even if the original size becomes large, it is possible to obtain a contact image sensor with a length corresponding to the original size while using a photoelectric conversion element substrate that has a limited length due to manufacturing or cost reasons. .

[Problem that the invention seeks to solve]

However, in conventional contact-type image sensors, the photoelectric conversion element substrates are arranged in a staggered manner on two parallel straight lines, so the read signals of odd-numbered areas and even-numbered areas must be combined. Moreover, a portion of the document is read redundantly at the connection portion between both areas. Therefore, the size in the sub-scanning direction becomes large, the position of the photoelectric conversion element substrate placed on two straight lines must be set to a predetermined accuracy, and the processing of redundantly read signals is required. is necessary.

[Means for solving problems]

The present invention has been made in view of the above, and is intended to eliminate the need for extra signal processing, reduce the size in the sub-scanning direction, and easily achieve dimensional accuracy in manufacturing. The present invention provides a contact type image sensor and a method for manufacturing the same, in which the end of the image sensor is cut at a predetermined position, and then adjacent photoelectric conversion elements are arranged in a straight line at intervals corresponding to the pixel density at this end. be.

Hereinafter, a contact type image sensor and a method for manufacturing the same according to the present invention will be explained in detail.

〔Example〕

FIGS. 1(A) and 1(B) show an embodiment of the contact type image sensor of the present invention, in which a base member 1 having a predetermined planar area directly contacts a plurality of photoelectric conversion element substrates 2 with its bottom surface. and support it. The photoelectric conversion element substrate 2 has g=62.
The photoelectric conversion elements 3 are arranged in an array at intervals of 5 μm (16 dots/1 m), and the spacing between elements 30 located at the ends of adjacent substrates 2 is also set to g = 62.5 μm. Since the plurality of substrates 3 are arranged in a straight line, the elements 3 are also in a straight line.

FIG. 1(B) is an enlarged view of the edges of adjacent substrates 2. If the distance between the edge of the substrate 2 and the element 3 located at the end is β, and the distance between the substrates 2 is δ, then g= It becomes 21+δ.

δ−01g=27! In this case, the substrates 2 will be closely placed. That is, the end portion of the substrate 2 may be cut so that 1=62.572 μm.

Here, an example of a contact type image sensor applied to an AO size document reading device is as follows.

Length of base member 874 ■ Effective length of photoelectric conversion section 864 Dragon Number of dots in photoelectric conversion section 13.824 Dot density (dot spacing) 16/■ (62.5 μm)
In the above contact-type image sensor, a 4096-inch, 257-mm substrate is used, and both ends of the substrate are cut to form a 3,456-inch substrate 2, and four of these are used to obtain the above-mentioned contact-type image sensor. Ta.

Next, a method for manufacturing a contact type image sensor according to the present invention will be explained with reference to FIGS. 2(a) and 2(b).

As described above, both ends of the substrate with 4096 dots and 2571 dots are cut and polished to obtain a substrate 2 having 3456 dots of photoelectric conversion elements (the effective length of the photoelectric conversion part is 216 dots).

The ends of the substrate 2 are placed on the base member 1 in close contact with each other, and pressed from one side of the substrate 2 via the elastic member 4,
Press from the other side via the micrometer 5. Pressing via the micrometer 5 is performed against the elastic force of the elastic member 4, and fine adjustment of the micrometer 5 causes the substrate 2 to be pressed.
Set the position to a predetermined position and temporarily secure it. After this temporary fixing, adhesive 6 is applied to the side surface of the substrate 2, and the substrate 2 is fixed while keeping the base member 1 and the substrate 2 in direct contact (without intervening adhesive between them) (see Fig. 2). )).

FIG. 3 shows a position adjustment device for adjusting the position of the substrate 2 described above, and includes a base 10 on which the base member 1 is placed, and an elastic mechanism 14 and a micrometer mechanism 15 provided on both sides of the base. The elastic mechanism 14 has a compression spring 16 inside, and the rod 1 is pushed out by the compression spring 16.
7 is biased, and the biasing force of the rod 17 is applied to the spacer 18 that is in contact with one side of the substrate 2. On the other hand, the micrometer mechanism 15 has a rod 19 that moves forward and backward by adjustment, and has a rod 19 such that the initial value of each micrometer is the same when each tip of the rod is on a straight line.
The spacer 20, which is in contact with the other side surface of the substrate 2 at its tip, is moved left and right in the drawing.

In the above configuration, the base member 1 is placed on the base 10, a plurality of substrates 2 are arranged on the base member 1, and the substrates 2 are sandwiched from both sides by the spacers 18 and 20. Therefore, the substrate 2 is biased to the left in the drawing by the compression spring 16.

At this time, the substrate 2 is pressed down from above in the drawing by a compression spring (not shown) to prevent it from floating up, and in this state, the micrometer is finely adjusted, thereby giving the substrate 2 a movement against the biasing force to move the substrate 2 into a predetermined position. Set to the position. After this, the above-described substrate 2 is temporarily fixed to the base member l.

The contact type image sensor of the present invention has a lower positional accuracy than the conventional one having substrates arranged in a staggered manner because there is no need to synthesize read signals based on scanning on two scanning lines. For example, 31 μm) can be set.

Here, if a photoelectric conversion element substrate 2 having a common electrode along the photoelectric conversion element array is used, it will be difficult to cut the edges, so the pair of electrodes that drive each photoelectric conversion element will be It is preferable to use independent ones.

〔Effect of the invention〕

As explained above, the close-contact image sensor of the present invention
According to the manufacturing method, the end of the photoelectric conversion element substrate is cut at a predetermined position, and then adjacent photoelectric conversion elements are arranged in a straight line at intervals corresponding to the pixel density at this end. It is possible to eliminate the need for extra signal processing, reduce the size in the sub-scanning direction, and easily achieve dimensional accuracy in manufacturing.

[Brief explanation of the drawing]

FIGS. 1A and 1B are explanatory diagrams showing an embodiment of the contact type image sensor of the present invention. FIGS. 2(A) and 2(B) are explanatory diagrams showing an embodiment of the method for manufacturing a contact type image sensor of the present invention. FIG. 3 is an explanatory diagram of a position adjustment device used in the embodiment of FIG. 2(A). Explanation of symbols 1 --- Base member 2 --- Photoelectric conversion element substrate 3
-・-Photoelectric conversion element 4-・---m-Elastic member 5---Micrometer Patent applicant Fuji Xerox Co., Ltd. Agent Patent attorney Taira 1) Tadao vE1 diagram (b) (b)

Claims (2)

[Claims] (1) A plurality of photoelectric conversion element substrates having photoelectric conversion element arrays arranged linearly at intervals according to pixel density, and a plurality of photoelectric conversion element substrates arranged in tandem to form the photoelectric conversion element arrays in a straight line. a base member supporting the plurality of photoelectric conversion element substrates in direct contact with the plurality of photoelectric conversion element substrates on a surface having a predetermined planar accuracy, The photoelectric conversion element substrate is a contact type image sensor, wherein adjacent photoelectric conversion elements are located at the end portions of the adjacent photoelectric conversion element substrates at intervals corresponding to the pixel density. (2) Cutting the ends of a plurality of photoelectric conversion element substrates having photoelectric conversion element arrays arranged linearly at intervals according to pixel density, and cutting the ends of adjacent ends of the plurality of photoelectric conversion element substrates. Adjacent photoelectric conversion elements are arranged in tandem so that they are located at intervals according to the pixel density, and the plurality of photoelectric conversion element substrates are elastically pressed from one side and pressed from the other side through a position measuring member. and press the plurality of photoelectric conversion element substrates by pressing the plurality of photoelectric conversion element substrates, and pressing the plurality of photoelectric conversion element substrates from the other side surface against the elastic force of the one side surface based on the position measurement of the position measurement member. A method of manufacturing a contact type image sensor, the method comprising: fixing the image sensor to the base member after setting the image sensor to the position of the base member.