JPS6228444U - - Google Patents
Info
- Publication number
- JPS6228444U JPS6228444U JP1985120659U JP12065985U JPS6228444U JP S6228444 U JPS6228444 U JP S6228444U JP 1985120659 U JP1985120659 U JP 1985120659U JP 12065985 U JP12065985 U JP 12065985U JP S6228444 U JPS6228444 U JP S6228444U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- package
- package body
- integrated
- encapsulates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985120659U JPS6228444U (xx) | 1985-08-05 | 1985-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985120659U JPS6228444U (xx) | 1985-08-05 | 1985-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6228444U true JPS6228444U (xx) | 1987-02-20 |
Family
ID=31009184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985120659U Pending JPS6228444U (xx) | 1985-08-05 | 1985-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228444U (xx) |
-
1985
- 1985-08-05 JP JP1985120659U patent/JPS6228444U/ja active Pending