JPS62275921A - Conveying device for chip parts - Google Patents

Conveying device for chip parts

Info

Publication number
JPS62275921A
JPS62275921A JP11779586A JP11779586A JPS62275921A JP S62275921 A JPS62275921 A JP S62275921A JP 11779586 A JP11779586 A JP 11779586A JP 11779586 A JP11779586 A JP 11779586A JP S62275921 A JPS62275921 A JP S62275921A
Authority
JP
Japan
Prior art keywords
chip
magnet
chip component
chip parts
attracting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11779586A
Other languages
Japanese (ja)
Inventor
Haruhisa Mori
森 治久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Original Assignee
Renesas Semiconductor Manufacturing Co Ltd
Kansai Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Manufacturing Co Ltd, Kansai Nippon Electric Co Ltd filed Critical Renesas Semiconductor Manufacturing Co Ltd
Priority to JP11779586A priority Critical patent/JPS62275921A/en
Publication of JPS62275921A publication Critical patent/JPS62275921A/en
Pending legal-status Critical Current

Links

Landscapes

  • Belt Conveyors (AREA)
  • Specific Conveyance Elements (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To convey chip parts without causing damage to them by providing a moving body with magnets at specified intervals for each magnet attracting only one piece of chip part of a columnar shape having mouthpiece electrodes of a magnetic material conductive to the end part. CONSTITUTION:Holding a pellet 7 between flanged 8 mouthpiece electrodes 6 and 6 of a magnetic material located on both sides of a glass tube 5, with a minute gaps between the flanges 8 and the glass tube 5, a chip part 4 is constituted. A turntable 10 rotatably supported about a vertical axis X is provided on its peripheral part at a specified intervals with a plurality of magnets 9 for attracting one side of the mouthpiece electrodes 6, with the magnet 9 being a size enough for attracting only one piece of the chip part 4. The chip parts 4 are supplied from a hopper 12, attracted one by one by means of the magnet 9, rotated in the direction of the arrow, stamped 14 for example, chuted 15, and held in a box 13. With the above arrangement, the chip parts 4 can be conveyed without being damaged.

Description

【発明の詳細な説明】 3、発明の詳細な説明 童栗↓q剋朋分野 本発明は、端部に磁性体を有する円柱形のチップ部品、
例えばリードレスダイオード等の移送装置に関するもの
である。
[Detailed Description of the Invention] 3. Detailed Description of the Invention Field of the present invention is a cylindrical chip component having a magnetic material at its end;
For example, it relates to a transfer device such as a leadless diode.

従来■孜貨 チップ部品の製造過程において、例えばチップ部品の外
周面部に性能や極性を示す捺印を施してこれを移送する
工程や、捺印後のチップ部品を移送させながら外観をチ
ェックする工程がある。
In the manufacturing process of conventional chip components, for example, there is a process of stamping the outer circumferential surface of the chip component to indicate performance and polarity and then transporting it, and a process of checking the external appearance while transporting the chip component after stamping. .

発明が解決しようとする問題点 かかる工程に用いられるチップ部品の移送装置として、
第6図に示すように、極く小径のチップ部品よりも薄い
ステンレスベルト34に、チップ部品35を収容する多
数の凹部36を設けて、該ヘルド34を駆動回転させる
ものが用いられているが、短期間でヘルド34が摩耗し
、交換頻度が大でコス]・的に極めて不利であった。
Problems to be solved by the invention As a chip component transfer device used in such a process,
As shown in FIG. 6, a stainless steel belt 34 that is thinner than an extremely small diameter chip component is provided with a number of recesses 36 for accommodating chip components 35, and the heald 34 is driven and rotated. However, the heald 34 wore out in a short period of time and had to be replaced frequently, which was extremely disadvantageous in terms of cost and cost.

また捺印後の移送工程においてば、チップ部品35が回
転することによって捺印部が擦られてしまい、捺印消え
も発生している。
In addition, in the transfer process after the stamp is stamped, the stamp part is rubbed due to the rotation of the chip component 35, and the stamp may be erased.

問題点を解決するための千月 本発明は、上記の事情を考慮して考案されたもので、捺
印消え等も生じることのない好適な移送装置を提供する
ことを目的としている。
The present invention has been devised in consideration of the above-mentioned circumstances, and aims to provide a suitable transfer device that does not cause the stamp to disappear.

上記目的を達成するための本発明によるチップ部品の移
送装置は、端部まで導出している磁性体の口金電極を有
する円柱形チップ部品の1個を吸着する磁石を、移動体
に所定間隔おきに設けた点に特徴を有する。
In order to achieve the above object, a chip component transfer device according to the present invention has a magnet that attracts one of the cylindrical chip components having a magnetic cap electrode extending to the end thereof, which is attached to a moving body at a predetermined interval. It is characterized by the fact that it is provided in

作用 上記の特徴構成によれば、チップ部品の端部を磁力吸着
して、このチップ部品をその周面を他物を摺接させるこ
となく移送させることができる。
Effects According to the above characteristic configuration, the end portion of the chip component can be magnetically attracted and the chip component can be transferred without the peripheral surface of the chip component coming into sliding contact with another object.

実施例 以下、本発明の実施例を図面に基づいて説明すると、第
1図は未完成チップ部品に対する捺印処理設備の概略を
示し、捺印設備1と、捺印後のチップ部品を熱風乾燥す
る乾燥設@2と、乾燥後のチップ部品の外観をチェック
する外観チェック設備3とから成る。
Embodiment Hereinafter, embodiments of the present invention will be explained based on the drawings. Fig. 1 shows an outline of a stamping processing equipment for unfinished chip parts, and includes a marking equipment 1 and a drying equipment for drying the chip parts after stamping with hot air. @2 and an appearance check equipment 3 for checking the appearance of chip parts after drying.

捺印処理されるチップ部品4は、第2図に示すように、
ガラス管5の両側部に、磁性体材料から成るツバ付き口
金電極6.6を配置してペレット7を挾み付げした状態
でガラス封着すると共に、膨張係数差を考慮して、前記
口金電極6.6のツバ部8とガラス管端面とのマークに
微小の隙間を有せしめである。
The chip component 4 to be stamped is, as shown in FIG.
Flange cap electrodes 6.6 made of a magnetic material are disposed on both sides of the glass tube 5, and the pellets 7 are sandwiched between the cap electrodes 6.6, which are sealed with glass. A minute gap is provided between the mark between the collar 8 of the electrode 6.6 and the end surface of the glass tube.

前記捺印設(+iM”1は、第3図に示すように、前記
チップ部品4の一方の口金電極6を吸着する磁石9を、
移動体の一例である。縦軸まわりで駆動回転自在に構成
されたターンテーブル10の外周面部側に所定間隔をへ
だてて多数段げて、磁力吸着されたチップ部品4を移送
する移送装置11を構成すると共に、該移送装置1]に
対するチップ部品4の第1供給部12から乾燥設(JN
2へのチップ部品4の第2供給部13にわたる回転移送
経路の途中に、前記磁力吸着されたチップ部品4の外周
面部に捺印を施す捺印装置14を配置し、かつ、前記第
2供給部13の近くに、チップ部品移送経路を斜めに横
断する状態のシュート15を設けて成り、而して、ター
ンテーブル10の回転に伴ってチップ部品4の外周面部
に捺印が施されると共に、該捺印後のチップ部品4が前
記シュート15に当接して、核部においてチップ部品4
が磁力に抗して強制的に掻き落とされ、そのまま前記第
2供給部13に送り込まれるようになっている。
As shown in FIG.
This is an example of a moving object. A transfer device 11 for transferring magnetically attracted chip components 4 is constructed by stacking a plurality of stages at predetermined intervals on the outer peripheral surface side of a turntable 10 configured to be freely driven and rotatable around a vertical axis. 1] from the first supply section 12 of the chip components 4 to the drying facility (JN
A marking device 14 for stamping the outer peripheral surface of the magnetically attracted chip component 4 is disposed in the middle of a rotational transfer path across the second supply section 13 of the chip component 4 to the second supply section 13. A chute 15 that diagonally crosses the chip component transfer path is provided near the chute 15, and as the turntable 10 rotates, a mark is applied to the outer peripheral surface of the chip component 4, and the stamp is The rear chip component 4 comes into contact with the chute 15, and the chip component 4 at the core part
is forcibly scraped off against the magnetic force and fed into the second supply section 13 as it is.

尚、前記磁石9のチップ部品吸着面部は、前記口金電極
6の直径の1.0〜1.5倍程度に設定してあって、該
磁石9に単−個のチップ部品4が吸着面部に起立状態で
吸着されるようにしである。
The chip component attracting surface of the magnet 9 is set to about 1.0 to 1.5 times the diameter of the cap electrode 6, so that a single chip component 4 can be attached to the magnet 9 on the attracting surface. It is designed to be absorbed in an upright position.

前記外観チェック設@3は第4図及び第5図に示すよう
に構成されている。即ち、移動体の他の例である所定間
隔おきに略円形のボス部16を備えたエンドレスのベル
ト17を、横軸まわりで回転自在で且つ前記ボス部16
を噛合する形状の回転体18゜]9に巻回すると共に、
乾燥後のチップ部品4を吸着する磁石20を取付けたホ
ルダー21を、軸受22を介して前記ボス部16の夫々
に横軸芯まわりで遊転自在に装着し、かつ、一方の回転
体18を前記乾燥設備2のチップ部品取出部23近くに
配置すると共に、前記磁石20のチップ部品吸着面部の
径を口金6の直径の1.0〜1.5倍程度に設定して、
前記チップ部品取出部23から順次、単−個のチップ部
品4を磁石20に起立吸着してこれを直線移送させるよ
うにしである。
The appearance check facility @3 is constructed as shown in FIGS. 4 and 5. That is, an endless belt 17, which is another example of a moving body, is provided with approximately circular boss portions 16 at predetermined intervals, and is rotatable around a horizontal axis and has substantially circular boss portions 16 at predetermined intervals.
At the same time, it is wound around a rotating body 18°]9 shaped to mesh with the
A holder 21 equipped with a magnet 20 that attracts the chip component 4 after drying is attached to each of the boss portions 16 via a bearing 22 so as to be freely rotatable about the horizontal axis, and one rotating body 18 is The magnet 20 is placed near the chip component take-out section 23 of the drying equipment 2, and the diameter of the chip component attraction surface of the magnet 20 is set to about 1.0 to 1.5 times the diameter of the cap 6.
Single chip components 4 are sequentially attracted to the magnet 20 from the chip component take-out section 23 and then linearly transferred.

そして、該チップ部品4の移送経路の途中の所定ポジシ
ョンに、前工程における捺印の良否を外観検出するアイ
カメラ等の外観チェック装置24を配置するとともに、
該チェック装置の後方に該外観チェック装置24からの
外観不良の検出情報を基にして不良チップ部品4を経路
外に排除する排除機構(ソレノイド25とこれの作動部
に連設されたチップ部品打ち落し具26から成る。)2
7とを配置しである。
Then, at a predetermined position along the transfer path of the chip component 4, an appearance checking device 24 such as an eye camera for visually detecting the quality of the stamping in the previous process is arranged.
Behind the checking device, there is a removal mechanism (a chip component striking mechanism connected to a solenoid 25 and its operating section) that eliminates defective chip components 4 from the path based on the detection information of appearance defects from the appearance checking device 24. Consists of a dropping tool 26)2
7 is arranged.

一方、前記ホルダー21の端部にローラ28を連設する
と共に、前記外観チェック装置24の配置部近傍に、前
記ベルト17の移動に伴って前記ローラ28を回転させ
ることにより磁石20を回転させる磁石回転部材29を
設け、もって、前記磁石20に吸着されているチップ部
品4を、外観チェック装置24による外観チェック部に
おいてその中心軸回りに回転させるようにしである。
On the other hand, a roller 28 is connected to the end of the holder 21, and a magnet that rotates the magnet 20 by rotating the roller 28 as the belt 17 moves is placed near the location of the appearance checking device 24. A rotating member 29 is provided so that the chip component 4 attracted to the magnet 20 is rotated about its central axis in the appearance checking section by the appearance checking device 24.

このチップ部品4の回転下において外観チェック装置2
4による外観チェックが行われるのであり、そして、不
良品のチップ部品4が検出されるとソレノイド25が励
磁されて、当該チップ部品4が不良品回収シュート30
に向けて打ち落され、ボックス31に回収されると共に
、良品のみがそのまま移送され、かつ、該良品のチップ
部品4は、移送経路を斜めに横断するシュート32に当
接してボックス33に回収されるようになっている。
Appearance check device 2 under rotation of this chip component 4
4, and when a defective chip component 4 is detected, the solenoid 25 is energized, and the chip component 4 is transferred to the defective product collection chute 30.
The chip parts 4 are shot down towards the target and collected in the box 31, and only the good parts are transferred as they are, and the good chip parts 4 come into contact with the chute 32 diagonally crossing the transfer path and are collected in the box 33. It has become so.

発明の効果 以」二説明したように本発明によるチップ部品の移送装
置によれば、千ノブ部品端部の磁性体を有効に利用して
、これの単−個を磁力吸着して移送させるものであるか
ら、チップ部品を空間に浮かせた状態で移送可能であり
、移送時にチップ部品の周面の他物との摺接による摩損
が全くないので、装置の耐用年数が極めて長くなり、特
に、かかる移送装置を捺印工程の移送に用いる場合は、
捺印消えの発生を防止できて好適である。
Effects of the Invention As described above, the chip component transfer device according to the present invention effectively utilizes the magnetic material at the end of the 1000-knob component to magnetically attract and transfer a single chip component. Therefore, the chip parts can be transported while floating in space, and there is no wear and tear caused by the sliding contact of the peripheral surface of the chip parts with other objects during transport, so the service life of the device is extremely long, and in particular, When such a transfer device is used for transfer in the stamping process,
This is preferable because it can prevent the stamp from disappearing.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は捺印処理設備の概略断面図、第2図はチップ部
品の断面図、第3図は捺印設備の説明図、第4図は外観
ヂエソク設備の概略側面図、第5図は外観チェンク設備
の要部の断面図である。第6図は従来のチップ部品移送
装置の一部の断面図である。 4・・・チップ部品、9・・・磁石、 10・・・移動体(ターンテーブル)、17・・・移動
体(エンドレスのヘル1−)、20・・・磁石。
Fig. 1 is a schematic cross-sectional view of the stamping processing equipment, Fig. 2 is a cross-sectional view of the chip parts, Fig. 3 is an explanatory diagram of the stamping equipment, Fig. 4 is a schematic side view of the external appearance check equipment, and Fig. 5 is an external view change. FIG. 3 is a cross-sectional view of the main parts of the equipment. FIG. 6 is a sectional view of a part of a conventional chip component transfer device. 4... Chip parts, 9... Magnet, 10... Moving body (turntable), 17... Moving body (Endless Hell 1-), 20... Magnet.

Claims (1)

【特許請求の範囲】[Claims] 端部まで導出している磁性体の口金電極を有する円柱形
チップ部品の1個を吸着する磁石を、移動体に所定間隔
おきに設けて成るチップ部品の移送装置。
A chip component transfer device comprising magnets provided at predetermined intervals on a moving body to attract one of the cylindrical chip components having a magnetic base electrode extending to the end.
JP11779586A 1986-05-22 1986-05-22 Conveying device for chip parts Pending JPS62275921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11779586A JPS62275921A (en) 1986-05-22 1986-05-22 Conveying device for chip parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11779586A JPS62275921A (en) 1986-05-22 1986-05-22 Conveying device for chip parts

Publications (1)

Publication Number Publication Date
JPS62275921A true JPS62275921A (en) 1987-11-30

Family

ID=14720478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11779586A Pending JPS62275921A (en) 1986-05-22 1986-05-22 Conveying device for chip parts

Country Status (1)

Country Link
JP (1) JPS62275921A (en)

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