JPS62267319A - Epoxy resin curing agent composition - Google Patents
Epoxy resin curing agent compositionInfo
- Publication number
- JPS62267319A JPS62267319A JP11118786A JP11118786A JPS62267319A JP S62267319 A JPS62267319 A JP S62267319A JP 11118786 A JP11118786 A JP 11118786A JP 11118786 A JP11118786 A JP 11118786A JP S62267319 A JPS62267319 A JP S62267319A
- Authority
- JP
- Japan
- Prior art keywords
- anhydride
- epoxy resin
- curing agent
- agent composition
- carboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- 239000003822 epoxy resin Substances 0.000 title claims description 20
- 229920000647 polyepoxide Polymers 0.000 title claims description 20
- 239000003795 chemical substances by application Substances 0.000 title claims description 13
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims abstract description 20
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims abstract description 13
- -1 phosphine compound Chemical class 0.000 claims abstract description 11
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims abstract description 10
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 5
- 150000001875 compounds Chemical class 0.000 claims description 5
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 abstract description 8
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 abstract description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 abstract description 2
- LWMIDUUVMLBKQF-UHFFFAOYSA-N 4-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound CC1CC=CC2C(=O)OC(=O)C12 LWMIDUUVMLBKQF-UHFFFAOYSA-N 0.000 abstract description 2
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 abstract description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 12
- 229910002092 carbon dioxide Inorganic materials 0.000 description 6
- 239000001569 carbon dioxide Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 150000003512 tertiary amines Chemical class 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical group C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 125000003944 tolyl group Chemical group 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- XGCDBGRZEKYHNV-UHFFFAOYSA-N 1,1-bis(diphenylphosphino)methane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CP(C=1C=CC=CC=1)C1=CC=CC=C1 XGCDBGRZEKYHNV-UHFFFAOYSA-N 0.000 description 1
- QFMZQPDHXULLKC-UHFFFAOYSA-N 1,2-bis(diphenylphosphino)ethane Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)CCP(C=1C=CC=CC=1)C1=CC=CC=C1 QFMZQPDHXULLKC-UHFFFAOYSA-N 0.000 description 1
- QXBYUPMEYVDXIQ-UHFFFAOYSA-N 4-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound CC1CCCC2C(=O)OC(=O)C12 QXBYUPMEYVDXIQ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- JDBDDNFATWXGQZ-UHFFFAOYSA-N 5-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1=CC(C)CC2C(=O)OC(=O)C12 JDBDDNFATWXGQZ-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- PVWYTIFUYYJMQO-UHFFFAOYSA-N butyl(phenyl)phosphane Chemical compound CCCCPC1=CC=CC=C1 PVWYTIFUYYJMQO-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- UJNZOIKQAUQOCN-UHFFFAOYSA-N methyl(diphenyl)phosphane Chemical compound C=1C=CC=CC=1P(C)C1=CC=CC=C1 UJNZOIKQAUQOCN-UHFFFAOYSA-N 0.000 description 1
- YWFWDNVOPHGWMX-UHFFFAOYSA-N n,n-dimethyldodecan-1-amine Chemical compound CCCCCCCCCCCCN(C)C YWFWDNVOPHGWMX-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- SWMBQMGPRYJSCI-UHFFFAOYSA-N octylphosphane Chemical compound CCCCCCCCP SWMBQMGPRYJSCI-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- WLPUWLXVBWGYMZ-UHFFFAOYSA-N tricyclohexylphosphine Chemical compound C1CCCCC1P(C1CCCCC1)C1CCCCC1 WLPUWLXVBWGYMZ-UHFFFAOYSA-N 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野1
本発明は、有数ホスフィン化合物を硬化促進剤として含
有することを特徴とする貯蔵安定性に優れたカルボン酸
無水物基エポキシ樹脂硬化剤組成物に関する。Detailed Description of the Invention [Industrial Application Field 1] The present invention provides a carboxylic anhydride-based epoxy resin curing agent composition with excellent storage stability, which is characterized by containing a leading phosphine compound as a curing accelerator. Regarding.
[従来Q技術]
エポキシ制能の硬化剤としては、従来ポリアミド、ポリ
アミン、カルボン酸無水物等が知られている。一般にエ
ポキシ樹脂とカルボン酸無水物との反応速度は遅く、硬
化促進剤として三級アミンが汎用されているのが現状で
おる。[Conventional Q Technology] Polyamides, polyamines, carboxylic acid anhydrides, and the like are conventionally known as curing agents for epoxy control. Generally, the reaction rate between epoxy resins and carboxylic acid anhydrides is slow, and tertiary amines are currently widely used as curing accelerators.
三級アミンは通常エポキシ樹脂100重量部、カルボン
酸無水物50−130重量部に対して0゜2〜7重聞部
程度添加されるが、三級アミンは全体の多くても3%程
度以下であり、必らかじめ酸無水物に混合しておく方が
計量や混合時間が短縮されて作業が容易である。Tertiary amine is usually added in an amount of about 0.2 to 7 parts per 100 parts by weight of epoxy resin and 50 to 130 parts by weight of carboxylic acid anhydride, but the amount of tertiary amine is about 3% or less of the total. Therefore, it is better to mix it with the acid anhydride in advance because the measuring and mixing time will be shortened and the work will be easier.
[発明が解決しようとする問題点]
しかしながら、混合後辺時間で使用する場合には問題は
ないが、長時間保存する場合にはカルボン酸無水物の粘
度が上昇し、炭酸ガスの発生により容器かふくらみ、極
端な場合は容器の破裂を生じる等、貯蔵安定性に欠ける
ことが大きな問題となっていた。[Problems to be Solved by the Invention] However, there is no problem when used for a while after mixing, but when stored for a long time, the viscosity of the carboxylic acid anhydride increases and carbon dioxide gas is generated, causing the container to dry. Lack of storage stability has been a major problem, such as swelling and, in extreme cases, the container bursting.
このため、特に炭酸ガスの発生じやすい成分としての無
水マレイン酸の含有量を極度に下げるような検討が報告
されている(特公昭54−20240号、特開昭53−
52600号)。For this reason, studies have been reported to extremely reduce the content of maleic anhydride, which is a component that is particularly likely to generate carbon dioxide gas (Japanese Patent Publication No. 54-20240, Japanese Patent Application Laid-Open No. 53-1982).
No. 52600).
しかしながら、本発明者らは、無水マレイン酸を全く含
まないカルボン酸無水物(例えば水素添加により製造さ
れた脂環型酸無水物)でも三綴アミンを硬化促進剤とし
て混合し長時間貯蔵すると、粘度が経時的に上昇し、炭
酸ガスが発生する事実を認めており、アミン系硬化促進
剤を含有するカルボン酸無水物系硬化剤組成物は、基本
的に不安定な組合せである。However, the present inventors have found that even when a carboxylic acid anhydride containing no maleic anhydride (for example, an alicyclic acid anhydride produced by hydrogenation) is mixed with a three-pointed amine as a curing accelerator and stored for a long time, It is recognized that the viscosity increases over time and carbon dioxide gas is generated, and a carboxylic acid anhydride curing agent composition containing an amine curing accelerator is basically an unstable combination.
このため硬化促進剤を混合した状態で何ら経時変化のな
い組成物を創出することが強く求められていた。Therefore, there has been a strong demand for creating a composition that does not change over time when mixed with a curing accelerator.
[問題点を解決するための手段]
本発明者らは、係る問題点を扱本的に解決し、貯蔵安定
性を向上し、かつ硬化促進剤としての充分な性能を持つ
化合物について種々検討の結果、三扱アミンに代えて有
はホスフィン化合物をカルボン酸無水物に混合すること
により所期の目的が達成され、しかも1qられる硬化物
の特性も充分実用性のめることを見出し、この知見に基
いて本発明を完成した。[Means for Solving the Problems] The present inventors have solved these problems in a fundamental way, and have carried out various studies on compounds that improve storage stability and have sufficient performance as a curing accelerator. As a result, we discovered that by mixing a phosphine compound with a carboxylic acid anhydride instead of a amine, the desired objective could be achieved, and the properties of the cured product obtained by 1q were sufficient for practical use.Based on this knowledge, we The present invention was completed.
即ち本発明は、カルボン酸無水物に有機ホスフィン化合
物を含有せしめることを特徴とする貯蔵安定性に優れた
fr規なエポキシ樹脂硬化剤組成物を提供することを目
的とする。That is, an object of the present invention is to provide a standard epoxy resin curing agent composition with excellent storage stability, which is characterized by containing an organic phosphine compound in a carboxylic acid anhydride.
本発明におけるカルボン酸無水物とは、3−メチルテト
ラヒドロ無水フタル酸、4−メチルテトラヒドロ無水フ
タル酸、3−メチルへキサヒドロ無水フタル酸、4−メ
チルへキサヒドロ無水フタル酸、メチルナジック酸無水
物、ドデセニル無水コハク酸及びそれらの構造異性体若
しくは幾何異性体をはじめ、ヘキサヒドロ無水フタル酸
、テトラヒドロ無水フタル酸、フタル酸無水物、トリメ
リットlfi水物、ベンゾフェノンテトラカルボン酸無
水物のような室温で固体の酸無水物と混合変性して液状
化したものが例示される。ここで、原料の一種である無
水マレイン酸の残存量は、可及的に低減されていること
が奏効上望ましく、特に杓0.1重量%以下でおること
が好ましい。The carboxylic anhydride in the present invention includes 3-methyltetrahydrophthalic anhydride, 4-methyltetrahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methylnadic anhydride, Solid at room temperature, such as dodecenyl succinic anhydride and their structural or geometric isomers, as well as hexahydrophthalic anhydride, tetrahydrophthalic anhydride, phthalic anhydride, trimellitic lfi hydrate, and benzophenonetetracarboxylic anhydride. An example is one obtained by mixing and modifying with an acid anhydride to liquefy. Here, it is desirable for the residual amount of maleic anhydride, which is a type of raw material, to be reduced as much as possible, and in particular, it is preferably 0.1% by weight or less.
又、有機ホスフィン化合物とは、一般式[1][式中、
R、R及びR3は、水素原子、アルキル基、フェニル基
、トリル基等のアリール基、シクロヘキシル基等のシク
ロアルキル基等で示される塁を表わし、同一でも異なっ
ていてもよい。In addition, the organic phosphine compound is represented by the general formula [1] [wherein,
R, R and R3 represent a hydrogen atom, an alkyl group, an aryl group such as a phenyl group, a tolyl group, a cycloalkyl group such as a cyclohexyl group, and may be the same or different.
又、次式
(式中、Rはアルカンを表わし、R′及びRLLは、水
素原子、アルキル塁、フェニル基、トリル基等のアリー
ル基、シクロヘキシル基等のシクロアルキル基を表わし
、同一でも異なっていてもよい。In addition, the following formula (wherein R represents an alkane, R' and RLL represent a hydrogen atom, an alkyl group, an aryl group such as a phenyl group or a tolyl group, or a cycloalkyl group such as a cyclohexyl group, and may be the same or different) It's okay.
10し、R′及びRHが水素原子の場合を除く〉で示さ
れる塁のように有機ホスフィンを含む有機基であっても
よい。但し、R1,R2及びR3が全て水素原子である
場合を除く。]
で示されるものである。具体的には、トリフェニルホス
フィン、トリブチルホスフィン、トリシクロヘキシルホ
スフィン、メチルジフェニルホスフィン等の第3ホスフ
ィン化合物、ブチルフェニルホスフィン、ジフェニルホ
スフィン等の第2ホスフィン化合物、フェニルホスフィ
ン、オクチルホスフィン等の第1ホスフィン化合物、及
びビス(ジフェニルホスフィノ)メタン、1,2−ビス
(ジフェニルホスフィノ)エタン等の第3ビスホスフィ
ン化合物が例示され、これらから成る群より選ばれる1
種若しくは2種以上のものが使用される。これらの中で
も、アリールホスフィン化合物を使用することが好まし
く、とりわけ、トリフェニルホスフィン等のトリアリー
ルホスフィンが好ましい。10, and may be an organic group containing an organic phosphine, such as in the case where R' and RH are hydrogen atoms. However, this excludes the case where R1, R2 and R3 are all hydrogen atoms. ]. Specifically, tertiary phosphine compounds such as triphenylphosphine, tributylphosphine, tricyclohexylphosphine, and methyldiphenylphosphine, secondary phosphine compounds such as butylphenylphosphine and diphenylphosphine, and primary phosphine compounds such as phenylphosphine and octylphosphine. , and tertiary bisphosphine compounds such as bis(diphenylphosphino)methane and 1,2-bis(diphenylphosphino)ethane, and 1 selected from the group consisting of these.
A species or two or more species may be used. Among these, it is preferable to use arylphosphine compounds, and triarylphosphines such as triphenylphosphine are particularly preferable.
係る有機ホスフィン化合物は、カルボン酸無水物に対し
てO,,01〜10重足%で混合することが好ましく、
特に好ましくは0.1・〜5重量%でおる。この範囲よ
り少なければ所定の効果が得られにくく、多くても効果
上顕著な有意差はなく、経済的に不利でおる。The organic phosphine compound is preferably mixed in an amount of 0.01 to 10% by weight relative to the carboxylic anhydride,
Particularly preferably, it is 0.1-5% by weight. If the amount is less than this range, it is difficult to obtain the desired effect, and even if it is more than this, there is no significant difference in effectiveness, which is economically disadvantageous.
有機ボスフィン化合物のカルボン酸無水物への混合は、
空温からカルボン酸無水物の沸点の範囲内、好ましくは
25〜120’Cで10分乃至2時間で常法に従って加
熱t!ずに若しくは加熱下で混合することにより容易に
行うことが出来る。The mixing of organic bosphine compounds into carboxylic acid anhydrides is
Heating in the range from air temperature to the boiling point of the carboxylic acid anhydride, preferably at 25 to 120'C, for 10 minutes to 2 hours according to a conventional method. This can be easily done by mixing without stirring or under heating.
なお本発明に係る硬化剤が適用し得るエポキシ樹脂は、
特に限定されることなく公知のものでおって、例えばビ
スフェノール△型エポキシ樹脂、ビスフェノールF型エ
ポキシ樹脂、ノボラック型エポキシ樹脂等のグリシジル
エーテル型エポキシ樹脂、グリシジルニスデル型エポキ
シ樹脂、グリシジルアミン型エポキシ樹脂、環式脂肪族
エポキシ樹脂、複素環式エポキシ樹脂、ハロゲン化エポ
キシ樹脂等のエポキシ樹脂が掲げられる。The epoxy resins to which the curing agent according to the present invention can be applied include:
Not limited in particular, known ones, such as glycidyl ether type epoxy resins such as bisphenol △ type epoxy resin, bisphenol F type epoxy resin, novolak type epoxy resin, glycidyl Nisdel type epoxy resin, glycidylamine type epoxy resin. , cycloaliphatic epoxy resins, heterocyclic epoxy resins, halogenated epoxy resins, and other epoxy resins.
本発明に係るエポキシ樹脂硬化剤組成物には、必要に応
じて充填剤、顔料、希釈剤や可撓性付与剤等各種の添加
剤を加えることが出来る。Various additives such as fillers, pigments, diluents, and flexibility-imparting agents can be added to the epoxy resin curing agent composition according to the present invention, if necessary.
[実施例]
以下に、実施例及び比較例を掲げ、本発明の詳細な説明
する。[Example] Below, the present invention will be described in detail with reference to Examples and Comparative Examples.
実施例1
メチルへキサヒドロ無水フタルl(Me−Hl−IPA
)100重足部とトリフェニルホスフィン5手量部とを
40°Cで30分間撹拌しなから混合し、冷五〇後25
°Cに保存し、1ケ月後の粘度及び次間ガスの発生量を
測定した。得られた結果を表に示す。Example 1 Methylhexahydrophthalanhydride (Me-Hl-IPA
) 100 parts by weight and 5 parts by weight of triphenylphosphine were mixed at 40°C for 30 minutes, then cooled for 25 minutes.
It was stored at °C, and the viscosity and amount of gas generated after one month were measured. The results obtained are shown in the table.
粘度は25°Cの温度条件下においてB型粘度計により
測定し、炭酸ガスの発生量は、JIS K−2301
に準じて測定した。The viscosity was measured using a B-type viscometer at a temperature of 25°C, and the amount of carbon dioxide gas generated was determined according to JIS K-2301.
Measured according to.
実施例2〜6
カルボン酸無水物及び有機ボスフィン類の種類、配合量
を変化させ実施例1と同様にして組成物を調製し、粘度
及び炭酸ガスの発生量を測定した。Examples 2 to 6 Compositions were prepared in the same manner as in Example 1 by changing the types and amounts of carboxylic acid anhydrides and organic bosphines, and the viscosity and amount of carbon dioxide gas generated were measured.
19られた結果を表に示す。The results are shown in the table.
比較例1
メチルへキサヒドロ無水フタル芯100重量部とUca
t−3A102 fl、8−ジアザ−ビシクロ(5,4
,○〉ウンデセン−7・2エヂルヘキシル芯塩:サンア
プロ((3)装]2重量部を空温で10分間混合し、実
施例1と同様の試験を行った。Comparative Example 1 100 parts by weight of methylhexahydrophthalic anhydride core and Uca
t-3A102 fl, 8-diaza-bicyclo(5,4
,○〉Undecene-7.2 ethylhexyl core salt: 2 parts by weight of SunApro (packaged in (3)) were mixed at air temperature for 10 minutes, and the same test as in Example 1 was conducted.
1qられた結果を表に示す。The results obtained are shown in the table.
比較例2
メヂルヘキサビドロ無水フタル酸100重但部と2−エ
チル−4−メチルイミダゾール3重足部を40°Cて3
0分間混合し、実施例1と同様の試験を行った。1qら
れた結果を表に示す。Comparative Example 2 100 parts of methylhexahydrophthalic anhydride and 3 parts of 2-ethyl-4-methylimidazole were mixed at 40°C.
After mixing for 0 minutes, the same test as in Example 1 was conducted. The results obtained are shown in the table.
比較例3
比較例1におりるUcat−3A102.2重量部をラ
ウリルジメチルアミン3重量部に変えて試別を作成し、
実施例1と同様の試験を行った。Comparative Example 3 A trial was prepared by replacing 2.2 parts by weight of Ucat-3A10 in Comparative Example 1 with 3 parts by weight of lauryldimethylamine.
A test similar to Example 1 was conducted.
得られた結果を表に示す。The results obtained are shown in the table.
比13≧1シI14
メチルテトラヒドロ無水フタルmm100ff1部と2
エチル−4−メチルイミダゾールの3重量部を空温で3
0分間混合し、実施例1と同様の試験を行った。17ら
れた結果を表に示す。Ratio 13≧1 I14 Methyltetrahydrophthalanhydride mm100ff1 part and 2
3 parts by weight of ethyl-4-methylimidazole at air temperature
After mixing for 0 minutes, the same test as in Example 1 was conducted. The results are shown in the table.
[発明の効果1
本発明に係るエポキシ樹脂硬化剤組成物は、従来の三汲
アミンを硬化促准剤とする組成物に比べて系の粘度の経
時変化が少なく、かつ炭酸カスの発生がなく、顕著に貯
蔵安定1生の擾れた組成物でおる。[Effect of the invention 1] The epoxy resin curing agent composition according to the present invention shows less change in system viscosity over time than conventional compositions using Sankumi amine as a curing accelerator, and does not generate carbon dioxide scum. The composition is remarkably shelf-stable.
手続補正書(自発)
昭和61年8月29日
特許庁長官 黒 1)明 雄 j2
1、事件の表示 昭和61年 特許願 第1”11
187号壽ハ2、発明の名称 エポキシ樹脂硬化剤組
成物3、補正をする者
事件との関係 特許出願人
4、?+I正により増加する発明の数 なし5
、補正命令の日付 自 発
6、補正の対象 明細書の「発明の詳細な説明」の
潤7、補正の内容
(1)明細書第5真下から7行目の「アルカン」を「ア
ルキレン」と訂正する。Procedural amendment (voluntary) August 29, 1985 Commissioner of the Patent Office Kuro 1) Aki Yu j2 1, Indication of the case 1986 Patent application No. 1”11
No. 187 Juha 2, Title of the invention: Epoxy resin curing agent composition 3, Relationship with the case of the person making the amendment: Patent applicant 4, ? Number of inventions increased by +I positive None 5
, Date of amendment order Vol. 6, Subject of amendment Jun 7 of the "Detailed Description of the Invention" in the specification, Contents of the amendment (1) Replacement of "alkane" in line 7 from the bottom of No. 5 of the specification with "alkylene". correct.
(2)明細書第6頁下から4〜1行目の「カルボン酸無
水物に対して0.01〜10重量%で混合するこ、とが
好ましく、特に好ましくは0.1〜5重量%である。」
を「カルボン酸無水物1〜5重量%に対して0.01〜
10ffi♀部で混合することが好ましく、特に好まし
くは0.1〜5重量部でおる。」と訂正する。(2) "It is preferable to mix with the carboxylic acid anhydride in an amount of 0.01 to 10% by weight, particularly preferably 0.1 to 5% by weight," in lines 4 to 1 from the bottom of page 6 of the specification. It is.”
0.01 to 5% by weight of carboxylic anhydride
It is preferable to mix in an amount of 10 parts by weight, particularly preferably 0.1 to 5 parts by weight. ” he corrected.
Claims (3)
してなることを特徴とするエポキシ樹脂硬化剤組成物。(1) An epoxy resin curing agent composition comprising a carboxylic acid anhydride and an organic phosphine compound.
合物であることを特徴とする特許請求の範囲第(1)項
記載のエポキシ樹脂硬化剤組成物。(2) The epoxy resin curing agent composition according to claim (1), wherein the organic phosphine compound is an arylphosphine compound.
0.1重量%以下であることを特徴とする特許請求の範
囲第(1)項記載のエポキシ樹脂硬化剤組成物。(3) The epoxy resin curing agent composition according to claim (1), wherein the content of maleic anhydride in the carboxylic anhydride is 0.1% by weight or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11118786A JPS62267319A (en) | 1986-05-14 | 1986-05-14 | Epoxy resin curing agent composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11118786A JPS62267319A (en) | 1986-05-14 | 1986-05-14 | Epoxy resin curing agent composition |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62267319A true JPS62267319A (en) | 1987-11-20 |
Family
ID=14554698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11118786A Pending JPS62267319A (en) | 1986-05-14 | 1986-05-14 | Epoxy resin curing agent composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62267319A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6069131A (en) * | 1983-09-27 | 1985-04-19 | Toshiba Corp | Epoxy resin composition |
JPS60202118A (en) * | 1984-03-26 | 1985-10-12 | Toshiba Corp | Sealing epoxy resin composition and semiconductor device sealed therewith |
-
1986
- 1986-05-14 JP JP11118786A patent/JPS62267319A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6069131A (en) * | 1983-09-27 | 1985-04-19 | Toshiba Corp | Epoxy resin composition |
JPS60202118A (en) * | 1984-03-26 | 1985-10-12 | Toshiba Corp | Sealing epoxy resin composition and semiconductor device sealed therewith |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0784509B2 (en) | Method for producing phosphorus-containing epoxy resin | |
JP4535214B2 (en) | Flame retardant liquid epoxy resin composition | |
JPS62267319A (en) | Epoxy resin curing agent composition | |
JPH0315654B2 (en) | ||
US3240751A (en) | Stabilization of phosphites and epoxy resins containing phosphites by alkaline earthmetal oxides | |
EP0761709B1 (en) | 1-Imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins | |
JPH01275621A (en) | Epoxy resin composition | |
JPS63152615A (en) | Liquid epoxy resin composition | |
JP2004217780A (en) | Epoxy resin composition | |
JP3729470B2 (en) | Curing accelerator for thermosetting resin and thermosetting resin composition containing the same | |
JPS6361016A (en) | Curing agent composition for epoxy resin | |
JPS63304018A (en) | Epoxy resin curing agent composition | |
TWI300417B (en) | ||
JPH0143770B2 (en) | ||
US4297459A (en) | Curable epoxy resins | |
JPS63132926A (en) | Epoxy resin composition | |
JPS6032820A (en) | Acid anhydride hardener composition | |
JPS6045211B2 (en) | One-component epoxy resin composition | |
JPH0386752A (en) | Method for preventing thickening of epoxy resin | |
JPH02308809A (en) | Epoxy resin composition | |
JPH0218445A (en) | Epoxy resin composition for casting | |
JPH08183834A (en) | Self-curing epoxy resin composition | |
JPS604520A (en) | Epoxy resin composition | |
JPH0472320A (en) | Production of epoxy resin and epoxy resin composition | |
JPS6295315A (en) | One-pack type curable epoxy resin composition |