JPS6226483Y2 - - Google Patents
Info
- Publication number
- JPS6226483Y2 JPS6226483Y2 JP1980051156U JP5115680U JPS6226483Y2 JP S6226483 Y2 JPS6226483 Y2 JP S6226483Y2 JP 1980051156 U JP1980051156 U JP 1980051156U JP 5115680 U JP5115680 U JP 5115680U JP S6226483 Y2 JPS6226483 Y2 JP S6226483Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat insulating
- insulating base
- foam
- synthetic resin
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000006260 foam Substances 0.000 claims description 22
- 239000000758 substrate Substances 0.000 claims description 9
- 229920003002 synthetic resin Polymers 0.000 claims description 8
- 239000000057 synthetic resin Substances 0.000 claims description 8
- 239000011810 insulating material Substances 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 239000003365 glass fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 229920006327 polystyrene foam Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229920002396 Polyurea Polymers 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910021538 borax Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011490 mineral wool Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910001562 pearlite Inorganic materials 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000582 polyisocyanurate Polymers 0.000 description 1
- 239000011495 polyisocyanurate Substances 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000004328 sodium tetraborate Substances 0.000 description 1
- 235000010339 sodium tetraborate Nutrition 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Landscapes
- Building Environments (AREA)
Description
【考案の詳細な説明】
本考案は、屋根下地あるいは外壁の下地板とし
て施工性と断熱性に富む断熱下地構造に関するも
のである。[Detailed Description of the Invention] The present invention relates to a heat insulating base structure that has excellent workability and heat insulation properties as a base plate for a roof base or an outer wall.
建築、構築物においては、主柱、間柱、胴縁間
に断熱材を充填した断熱壁構造が普及している。
しかしながら、この種断熱材例えばガラス繊維は
自立性（保形性）に劣り、施工が容易でない欠点
があつた。またシージングボードを直接装着し、
断熱壁を形成する場合は、断熱材自体の熱伝導率
が0.045kcal／ｍ・ｈ・℃であり、とても断熱材
の主体となり得ない。その上、胴縁、貫間柱間
は、単なる空気層としてのみ機能し、結露発生個
所（空気の流通がないため）となる不利があつ
た。さらに最近は、合板と合成樹脂発泡体の複合
板、あるいはポリスチレンフオーム板をシージン
グボードと同様に装着した壁構造も拡大の一途を
辿つている。しかし、この場合は、従来の工法か
らしてサツシ部分の「おさまり」その他の部分で
別異の工法を付加しなければならない等の繁雑
な、かつ特殊部材等の製作を要する欠点があつ
た。また胴縁、間柱間の空気は滞留の状態であ
り、終局的には結露の発生源となる不利があつ
た。 BACKGROUND ART In buildings and structures, insulating wall structures in which insulation material is filled between main pillars, studs, and rims are widespread.
However, this type of heat insulating material, such as glass fiber, has the disadvantage that it has poor self-supporting properties (shape retention) and is not easy to install. Also, attach the sheathing board directly,
When forming an insulating wall, the thermal conductivity of the insulating material itself is 0.045 kcal/m・h・℃, so it cannot be the main body of the insulating material. Moreover, the rim and the space between the studs functioned merely as an air layer, and were disadvantageous in that they became places where condensation occurred (because there was no air circulation). Furthermore, recently, wall structures in which composite boards of plywood and synthetic resin foam, or polystyrene foam boards are attached in the same way as sheathing boards, have been expanding. However, in this case, there were drawbacks that compared to the conventional construction method, different construction methods had to be added for the "settling" of the sash section and other parts, which was complicated and required the manufacture of special parts. In addition, the air between the rim and the studs was in a stagnation state, which was disadvantageous as it eventually became a source of condensation.
本考案は、このような欠点を除去すると共に断
熱性と施工性を大幅に改善した断熱下地構造を提
案するものである。 The present invention proposes a heat insulating base structure that eliminates these drawbacks and significantly improves heat insulation properties and workability.
以下に、図面を用いて、本考案に係る断熱下地
構造の一実施例を説明する。第１図は上記断熱下
地構造を示す平面図であり、１は柱、２はハリ、
３は貫、４は筋違、５は断熱下地板で、真壁作り
とした断熱下地構造である。さらに説明すると断
熱下地板５は第２図ａ，ｂに示すように、硬質基
板６と合成樹脂発泡体（以下、単にフオームとい
う）７から形成したものである。すなわち硬質基
板６は下地板として必要な剛性、強度を有する例
えば、合板、パーチクルボード、シージングボー
ド、石膏ボード、木毛セメント板、木片セメント
板、ロツクウール板等からなる。その大きさは、
900×1800mmを標準とし、板厚が約３〜25mm程度
である。またフオーム７は硬質基板６と現場発泡
的にフオーム７の形成時の自己接着性を利用して
一体に形成し、主に断熱材および製造時の接着剤
として機能する。またフオーム７は、軽量にして
低い熱伝導率で、しかもある程度の脆性を具備す
るもので、例えばポリウレタンフオーム、ポリイ
ソシアヌレートフオーム、ポリウレアフオーム、
ポリスチレンフオーム、フエノールフオーム、塩
化ビニルフオーム、ポリエチレンフオーム等から
なる。なおフオーム７として接着性に欠ける素材
を用いる場合は成形体を所定大きさに形成し、こ
れを接着剤を用いて硬質基板６と一体化する。こ
のフオーム７の大きさは、硬質基板６と同じかそ
れより10〜60mmだけ狭く、その厚さは10〜105mm
程度である。もちろん、フオーム７は耐水性、耐
候性、耐湿性、耐腐食性に富むものである。さら
に、フオーム７には縦、横方向等に切目８，９を
設ける。この切目８，９は、例えば第２図ａに示
すように硬質基板６の端縁６ａと平行に、あるい
はｂに示すように傾斜した状態で平行に設ける。
換言すれば、切目８，９はフオーム７を正方形状
（ａ図）、ひし形状（ｂ図）、あるいは図示しない
が長方形等の複数のブロツク７ａに分割し、柱
１、ハリ２、筋違４等に合わせて、フオーム７を
断熱下地板５からブロツク７ａ単位で除去し、断
熱下地板５の「おさまり」をよくするためのもの
である。なお、切目８，９のピッチP1，P2は目的
により一定間隔、ランダム間隔等任意である。さ
らに切目８，９の深さはフオーム７の全厚みと同
じ深さであり、ブロツク７ａを除去しやすくす
る。 An embodiment of the heat insulating base structure according to the present invention will be described below with reference to the drawings. Figure 1 is a plan view showing the above-mentioned heat insulating base structure, where 1 is a column, 2 is a stiffener,
3 is a through hole, 4 is a brace, and 5 is a heat insulating base plate, which is a heat insulating base structure made of solid walls. To explain further, the heat insulating base plate 5 is formed from a hard substrate 6 and a synthetic resin foam (hereinafter simply referred to as foam) 7, as shown in FIGS. 2a and 2b. That is, the hard substrate 6 is made of, for example, plywood, particle board, sheathing board, gypsum board, wood wool cement board, wood chip cement board, rock wool board, etc., which have the necessary rigidity and strength as a base board. Its size is
The standard size is 900 x 1800 mm, and the plate thickness is approximately 3 to 25 mm. Further, the foam 7 is formed integrally with the hard substrate 6 by foaming in-situ using the self-adhesive properties of the foam 7 during formation, and mainly functions as a heat insulating material and an adhesive during manufacturing. The foam 7 is lightweight, has low thermal conductivity, and has some degree of brittleness, such as polyurethane foam, polyisocyanurate foam, polyurea foam,
Consists of polystyrene foam, phenol foam, vinyl chloride foam, polyethylene foam, etc. Note that when a material lacking adhesiveness is used as the form 7, a molded body is formed to a predetermined size, and this is integrated with the hard substrate 6 using an adhesive. The size of this form 7 is the same as that of the hard substrate 6 or 10 to 60 mm narrower than that, and the thickness is 10 to 105 mm.
That's about it. Of course, the foam 7 is highly water resistant, weather resistant, moisture resistant, and corrosion resistant. Furthermore, cuts 8 and 9 are provided in the form 7 in the vertical and horizontal directions. The cuts 8 and 9 are provided, for example, in parallel with the edge 6a of the hard substrate 6 as shown in FIG. 2a, or in an inclined state in parallel as shown in FIG. 2b.
In other words, the cuts 8 and 9 divide the form 7 into a plurality of blocks 7a, such as a square (Figure a), a rhombus (Figure B), or a rectangle (not shown).
1. The foam 7 is removed in units of blocks 7a from the heat insulating base plate 5 in accordance with the stiffness 2, braces 4, etc., so that the heat insulating base plate 5 will settle down better. Note that the pitches P 1 and P 2 of the cuts 8 and 9 are arbitrary, such as constant intervals or random intervals, depending on the purpose. Furthermore, the depth of the cuts 8, 9 is the same as the total thickness of the foam 7, making it easier to remove the block 7a.
次に、施工例につき簡単に説明する。 Next, a construction example will be briefly explained.
いま、第２図ａに示す断熱下地板５を用い、第
１図に示すような真壁作りの断熱下地を形成する
と仮定する。まず、柱１、ハリ２、貫３、筋違４
を組み合わせて枠体を形成する。次に、断熱下地
板５のフオーム７において、枠体に対面するブロ
ツク７ａを除去（ハツチングで示した部分）し、
釘で図のように装着する。これによつて真壁は、
断熱性等を具備した下地構造が容易に形成でき
る。 Now, it is assumed that the heat insulating base plate 5 shown in FIG. 2a is used to form a heat insulating base made of solid walls as shown in FIG. First, pillar 1 , hari 2, kan 3, brace 4
are combined to form a frame. Next, in the form 7 of the heat insulating base plate 5, the block 7a facing the frame is removed (the hatched part),
Attach with nails as shown. With this, Makabe
A base structure with heat insulation properties etc. can be easily formed.
以上、説明したのは、本考案に係る断熱下地構
造の一実施例にすぎず、第３図ａ〜ｃに示すよう
な断熱下地板５を用いることもできる。すなわち
ａ図はフオーム７の露出面に防水シート１０を設
けた断熱下地板５であり、ｂ図は防水シート１０
を設けると共にその表面を小さな波状に形成し、
波トタン等にマツチするように形成した断熱下地
板５である。またｃ図は、硬質基板６の適宜位置
に複数個の通気孔１１を穿設し、空気の流通を図
り、かつ通気孔部分に防水膜１２を設けた断熱下
地板５である。その他図示しないが、フオーム７
にパーライト粒、硼砂、ガラス繊維等を添加した
フオーム７もこの考案に含むものである。さら
に、切目８，９は、曲線状に形成することもでき
る。 What has been described above is only one embodiment of the heat insulating base structure according to the present invention, and a heat insulating base plate 5 as shown in FIGS. 3a to 3c may also be used. That is, figure a shows the heat insulating base plate 5 with the waterproof sheet 10 provided on the exposed surface of the foam 7, and figure b shows the waterproof sheet 10.
At the same time as forming the surface into a small wave shape,
This is a heat insulating base plate 5 formed to match corrugated iron or the like. Fig. c shows a heat insulating base plate 5 in which a plurality of ventilation holes 11 are bored at appropriate positions on a hard substrate 6 to allow air circulation, and a waterproof film 12 is provided in the ventilation hole portions. Others not shown, form 7
This invention also includes Form 7 in which pearlite grains, borax, glass fiber, etc. are added to the foam. Furthermore, the cuts 8 and 9 can also be formed in a curved shape.
上述したように、本考案に係る断熱下地構造に
よれば、断熱材付の下地板をおさまりよく、容易
に施工できる特徴がある。また、本考案に係る断
熱下地構造に用いる断熱下地板の合成樹脂発泡体
は切目を縦横に設けると共に合成樹脂発泡体の全
厚みと同じ深さとした複数のブロツク材としたた
め、ブロツクの除去が非常に容易で、壁構造とし
た際の断熱性の低下割合を最小限とした特徴があ
る。さらに、断熱下地板のブロツクを除去した部
分がガイドとなるため、施工が容易となる。等の
特徴がある。 As described above, the heat insulating base structure according to the present invention has the feature that the base board with the heat insulating material can be easily installed. In addition, the synthetic resin foam for the heat insulating base plate used in the heat insulating base structure of the present invention is made of multiple block materials with vertical and horizontal cuts and the same depth as the total thickness of the synthetic resin foam, making it extremely difficult to remove the blocks. It is easy to install, and has the characteristics of minimizing the rate of decrease in insulation properties when used as a wall structure. Furthermore, the removed portion of the heat insulating base plate serves as a guide, making installation easier. It has the following characteristics.
第１図は本考案に係る断熱下地構造の一実施例
を示す説明図、第２図ａ，ｂは構成材の１つであ
る断熱下地板を示す斜視図、第３図ａ〜ｃは断熱
下地板の変形例を示す説明図である。
１……柱、２……ハリ、３……貫、４……筋
違、５……断熱下地板、６……硬質基板、７……
合成樹脂発泡体、８，９……切目。
Fig. 1 is an explanatory diagram showing one embodiment of the heat insulating base structure according to the present invention, Figs. 2 a and b are perspective views showing a heat insulating base plate which is one of the constituent materials, and Figs. 3 a to c are heat insulating base plates. It is an explanatory view showing a modification of a base plate. 1 ... Column, 2... Harness, 3... Through, 4... Bracing, 5... Heat insulation base plate, 6... Hard substrate, 7...
Synthetic resin foam, 8, 9... cuts.
Claims (1)
成し、該合成樹脂発泡体に対し合成樹脂発泡体の
全厚みと同じ深さの縦横の切目を設けた断熱下地
板の合成樹脂発泡体の切目によつて区分されたブ
ロツクを、主柱、間柱、胴縁、貫、ハリ、筋違に
沿つて除去して装着したことを特徴とする断熱下
地構造。 A synthetic resin foam is integrally formed on one surface of a hard substrate, and vertical and horizontal cuts are made in the synthetic resin foam with the same depth as the total thickness of the synthetic resin foam. A heat insulating base structure characterized in that blocks divided by cuts are removed and installed along main pillars, studs, body edges, through holes, tensions, and braces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980051156U JPS6226483Y2 (en) | 1980-04-14 | 1980-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980051156U JPS6226483Y2 (en) | 1980-04-14 | 1980-04-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56151414U JPS56151414U (en) | 1981-11-13 |
| JPS6226483Y2 true JPS6226483Y2 (en) | 1987-07-07 |
Family
ID=29646069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980051156U Expired JPS6226483Y2 (en) | 1980-04-14 | 1980-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6226483Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000314193A (en) * | 1999-04-30 | 2000-11-14 | Fuji House Kk | Thermal insulating panel and method for setting the same |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5375905U (en) * | 1976-11-29 | 1978-06-24 | ||
| JPS5386912U (en) * | 1976-12-20 | 1978-07-17 |
-
1980
- 1980-04-14 JP JP1980051156U patent/JPS6226483Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56151414U (en) | 1981-11-13 |
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