JPS62260067A - Electroless plating method for fine resin powder - Google Patents
Electroless plating method for fine resin powderInfo
- Publication number
- JPS62260067A JPS62260067A JP10251286A JP10251286A JPS62260067A JP S62260067 A JPS62260067 A JP S62260067A JP 10251286 A JP10251286 A JP 10251286A JP 10251286 A JP10251286 A JP 10251286A JP S62260067 A JPS62260067 A JP S62260067A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- electroless plating
- fine resin
- resin
- resin powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 28
- 239000011347 resin Substances 0.000 title claims abstract description 25
- 229920005989 resin Polymers 0.000 title claims abstract description 25
- 238000007772 electroless plating Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 title claims description 13
- 239000003960 organic solvent Substances 0.000 claims description 6
- 238000000967 suction filtration Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 4
- 230000002195 synergetic effect Effects 0.000 abstract description 2
- 239000002904 solvent Substances 0.000 abstract 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 235000019441 ethanol Nutrition 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920002472 Starch Polymers 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005194 fractionation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Chemically Coating (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
不発明は各種産業に利用される樹脂微粉、さらに詳しく
は１μｍ−数ｍｍの直任を有する樹脂微粉の無電ｍメッ
キ方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for electroless plating of fine resin powder used in various industries, more specifically, a fine resin powder having a diameter of 1 μm to several mm.
従来、形状の大きな面脂型成品を無電解メッキする場合
、処理槽に浸漬することにより容易に金属メッキを行う
ことができた。しかし、樹脂型成品の大きさが１ｍｍ以
下になってくると従来の浸漬方法による無電解メッキは
非常に困難であり、現実的には不可能に近かった。また
、処理槽に単に超晋波をかけただけでは樹脂微粉は充分
に分散しなかった。Conventionally, when applying electroless plating to a large-sized surface resin molded product, metal plating could be easily performed by immersing the product in a treatment bath. However, when the size of the resin molded product becomes 1 mm or less, electroless plating using the conventional immersion method is extremely difficult and practically impossible. In addition, the resin fine powder was not sufficiently dispersed simply by applying ultra-high-temperature waves to the treatment tank.
前述のように従来の方法では、直ｕ７ｍｍ以下の樹脂微
粉の表面に均一な膜厚の金属メッキを行うことは困難で
あった。As described above, with the conventional method, it is difficult to perform metal plating with a uniform thickness on the surface of fine resin powder with a diameter of 7 mm or less.
そこで、本発明は上記欠点を除去するためになされたも
のであり、その目的とするところは、ｍｍ単位〜μｍ単
位の樹、指微粉を容易に金属メッキすることにおる。Therefore, the present invention has been made to eliminate the above-mentioned drawbacks, and its purpose is to easily metal plate fine wood and finger powder on the order of millimeters to micrometers.
本発明の樹脂微粉の無電解メッキ方法は、上記目的を解
決するために、樹脂微粉を焦直解メノキする方法におい
て微粉を分散させるために水溶性の有機溶媒と超音波を
用い、さらに微粉を分取するために、吸引濾過装置を用
いたことを特徴とする。In order to solve the above object, the electroless plating method for fine resin powder of the present invention uses a water-soluble organic solvent and ultrasonic waves to disperse the fine powder in the method of melting the fine resin powder, and furthermore, the method uses a water-soluble organic solvent and ultrasound to disperse the fine powder. It is characterized in that a suction filtration device is used for fractionation.
本発明は、樹脂微粉をまず充分に分散させるために、水
溶性有機溶媒を用いて餞粉表面のぬれ性を良くシ、さら
にこれに相乗効果を与えるために超音波を用いる。無電
解メッキの処理液は水系であるが、上記水溶性有機溶媒
中で分散された樹脂微粉の表面ではメッキ処理液が円滑
に置換される。In the present invention, in order to sufficiently disperse the fine resin powder, a water-soluble organic solvent is used to improve the wettability of the surface of the starch powder, and ultrasonic waves are used to provide a synergistic effect. Although the treatment liquid for electroless plating is aqueous, the plating treatment liquid is smoothly replaced on the surface of the fine resin powder dispersed in the water-soluble organic solvent.
また、浸漬方法のできなかった微粉は、各処理ごとに吸
引濾過することにより浸漬方法と同様な効果が得られる
。In addition, the same effect as the immersion method can be obtained by suction-filtering fine powder that cannot be processed by the immersion method after each treatment.
〈実施例１〉
直径７μｍの樹脂ボール１０ｇを５０ｍＡ’のエチルア
ルコール中に投入し、３分間超音波をかけた後、エチル
アルコールと伴に２００ｍ１のＫＯＨ水溶液中に加え、
さらに５分間超音波をかけてから５μｍ用濾紙を用いて
吸引濾過し、樹脂ボー〜を分取した。この樹脂ボールを
再び５０ｍ１のエチルアルコールに投入し、上述と同様
な方法により、センシタイジング、アクチベイションを
行い、さらに同様な方法によりＮｉメッキ処理すること
により膜厚が均一なＮｉメッキ付樹脂ポールを得ること
ができた。尚、樹脂に対するメッキ化は樹脂表面の微小
凹凸への投錨効果でちシ、樹脂成分に開法なくメッキす
ることができた。<Example 1> 10 g of resin balls with a diameter of 7 μm were placed in 50 mA' ethyl alcohol, subjected to ultrasonic waves for 3 minutes, and then added to 200 ml of KOH aqueous solution together with ethyl alcohol.
After applying ultrasonic waves for an additional 5 minutes, suction filtration was performed using a 5 μm filter paper to separate the resin particles. This resin ball is again placed in 50ml of ethyl alcohol, sensitized and activated using the same method as above, and then Ni-plated using the same method to create a uniform Ni-plated resin film. I was able to get Paul. It should be noted that the plating of the resin had an anchoring effect on the minute irregularities on the resin surface, and the resin component could be plated without any trouble.
く実施例２〉
実施例１において、エチルアルコールの変ワリにアセト
ン、メチルアルコール又はＩＰＡをｆｆｉいることによ
り同様な効果が得られた。Example 2 In Example 1, the same effect was obtained by adding acetone, methyl alcohol, or IPA to the ethyl alcohol solution.
〈実施例６〉
実施例１において、Ｎｉメッキ処理液の変わりにＣｕメ
ッキ処理液を用いることにより、膜厚の均一な銅メツキ
樹脂ポールが得られた。Example 6 In Example 1, a copper-plated resin pole with a uniform film thickness was obtained by using a Cu plating solution instead of the Ni plating solution.
以上述べた：うに本発明によれば、ｍｍ単位〜・μｍ単
位の樹脂微粉に膜厚が均一な無電解メッキを行うことが
でき、また各処理ごとに吸引濾過することにより非常に
容易に樹脂微粉を無電解メッキできるようになった。As stated above, according to the present invention, it is possible to perform electroless plating with a uniform film thickness on resin fine powder of mm units to μm units, and it is possible to perform electroless plating with a uniform film thickness after each treatment. Electroless plating of fine powder is now possible.
以上 出願人 セイコーエプソン株式会社 ど−・ 代理人弁理士 最 上 務 他穫名 ゛−／′that's all Applicant: Seiko Epson Corporation What? Representative Patent Attorney, Mogami, and other names ゛-／′
Claims (1)
粉を分散させるために有機溶媒と超音波を用い、該微粉
を分取するために吸引瀘過装置を用いたことを特徴とす
る樹脂微粉の無電解メッキ方法。 ２）水溶性である有機溶媒を使用することを特徴とする
特許請求の範囲第一項記載の樹脂微粉の無電解メッキ方
法。[Claims] 1) In a method of electroless plating of resin fine powder, an organic solvent and ultrasonic waves are used to disperse the fine powder, and a suction filtration device is used to separate the fine powder. An electroless plating method for fine resin powder, characterized by: 2) The method for electroless plating of resin fine powder according to claim 1, characterized in that a water-soluble organic solvent is used.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251286A JPS62260067A (en) | 1986-05-02 | 1986-05-02 | Electroless plating method for fine resin powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10251286A JPS62260067A (en) | 1986-05-02 | 1986-05-02 | Electroless plating method for fine resin powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62260067A true JPS62260067A (en) | 1987-11-12 |
Family
ID=14329429
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10251286A Pending JPS62260067A (en) | 1986-05-02 | 1986-05-02 | Electroless plating method for fine resin powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62260067A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474869A (en) * | 1990-07-18 | 1992-03-10 | Agency Of Ind Science & Technol | Production of metal coated composite powder |
-
1986
- 1986-05-02 JP JP10251286A patent/JPS62260067A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0474869A (en) * | 1990-07-18 | 1992-03-10 | Agency Of Ind Science & Technol | Production of metal coated composite powder |
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