JPS6225754B2 - - Google Patents
Info
- Publication number
- JPS6225754B2 JPS6225754B2 JP21617282A JP21617282A JPS6225754B2 JP S6225754 B2 JPS6225754 B2 JP S6225754B2 JP 21617282 A JP21617282 A JP 21617282A JP 21617282 A JP21617282 A JP 21617282A JP S6225754 B2 JPS6225754 B2 JP S6225754B2
- Authority
- JP
- Japan
- Prior art keywords
- cylinder
- etching
- silicon particles
- weight
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 36
- 239000011856 silicon-based particle Substances 0.000 claims description 36
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 229910052782 aluminium Inorganic materials 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 229910000838 Al alloy Inorganic materials 0.000 claims description 7
- 239000011259 mixed solution Substances 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 23
- 239000000243 solution Substances 0.000 description 15
- 239000010687 lubricating oil Substances 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 229910001018 Cast iron Inorganic materials 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 239000010721 machine oil Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000000866 electrolytic etching Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 241000221561 Ustilaginales Species 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- -1 phosphoric acid Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/32—Alkaline compositions
- C23F1/36—Alkaline compositions for etching aluminium or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Cylinder Crankcases Of Internal Combustion Engines (AREA)
- Pistons, Piston Rings, And Cylinders (AREA)
- ing And Chemical Polishing (AREA)
Description
本発明はアルミニウム合金製シリンダのエツチ
ング方法に関する。
アルミニウム合金製シリンダは、エンジンの軽
量化を図る目的から一般によく使用されている
が、鋳鉄製のシリンダに比べて耐摩耗性が低く、
焼付きも生じ易いという問題がある。そこで、従
来より、アルミニウム合金製シリンダのシリコン
含有量を増し、シリコン粒子をシリンダ内壁面に
露出せしめて耐摩耗性を高める試みがなされてい
る。例えば、特開昭57−101700号公報には、シリ
ンダ内壁面に電解エツチングを施してシリコン粒
子をシリンダ内壁面より浮き出させ、シリコン粒
子によつて耐摩耗性の向上を図るとともに、浮き
出したシリコン粒子間の凹みにより潤滑油の保持
力を向上させる提案が記載されている。
しかしながら、電解エツチングの場合、エツチ
ング量を均一にするためには、シリンダボアに挿
入する電極とシリンダ内壁面との間隔を一定にし
なければならず、この間隔を一定に保つのが難し
いことから、エツチング量が不均一になることが
あり、それによつてシリコン粒子の浮出し量が多
くなりすぎてピストンリングが摺動する際にシリ
コン粒子が脱落したり、あるいはシリコン粒子の
角部が欠落したりする不具合があつた。
また、他のエツチング法として、硫酸や硝酸、
リン酸等の強酸を用いる酸エツチング法や濃度の
高い水酸化ナトリウムを用いるアルカリエツチン
グ法もあるが、酸エツチング法の場合、シリコン
粒子が溶解したり、あるいはシリコン粒子とアル
ミニウム地との境界部分が溶解してシリコン粒子
の脱落や欠落が生じ易くなる憾みがある。一方、
アルカリエツチング法の場合、シリコン粒子を溶
解せずにアルミニウム地を溶解する反面、銅やマ
グネシウム等の金属成分が溶解されにくいため、
これが表面に残り、また、溶けたアルミニウムが
水酸化アルミニウムとなつてアルミニウム地に付
着し、均一なエツチングを阻害するという問題が
ある。
本発明は、かかる点に鑑み、シリンダ内壁面を
まず５〜10重量％NaOHと0.05〜0.35重量％の
H2O2との混合水溶液でエツチングしてシリコン
粒子を浮き出させ、水洗後、３〜７重量％HNO3
水溶液でシリコン粒子の表面を溶解させて平滑に
するというエツチング方法を提供し、アルミニウ
ム地を均一にエツチングすることができ、かつ、
シリコン粒子の脱落や欠落が生じないようにして
耐摩耗性を向上させることを目的とするものであ
る。
以下、本発明の構成を実施例につき図面に基づ
いて説明する。
実施例は６つの工程からなり、第１図は第２工
程、第２図は第３工程、第３図は第５工程を終了
したアルミニウム合金製シリンダ１の内壁状態を
示している。２はアルミニウム地、３はシリコン
粒子である。シリンダ１を構成するアルミニウム
合金鋳物の組成（重量％）は、Si17％、Cu4.5
％、Ni1.5％、Mg1％、P0.05％、残部Alで、Ｐの
添加により初晶シリコン粒子３が微細化してい
る。
第１工程においては、鋳造後のシリンダ１に熱
処理を施す。すなわち、シリンダ１を500℃で５
〜６時間加熱し、水冷（焼入れ）後、180℃で３
〜４時間の焼もどし処理を行なう。
第２工程においては、シリンダ１の内壁面４の
研磨加工を行なう。すなわち、まず、シリンダ１
の内壁面４のホーニング加工を行ない、その後、
砥粒を用いてラツピング加工を行なう。加工後の
状態は第１図に示されており、内壁面４の表面粗
さは1.5μ以下である。
第３工程においては、シリンダ内壁面４のアル
ミニウム地２にエツチング処理を施す。エツチン
グ処理液は、５〜10重量％のNaOHと、0.05〜
0.35重量％のH2O2と、残り水との混合液であ
り、液温は30〜60℃、処理時間は10〜30秒であ
る。エツチング処理の態様は第４図に示されてい
る。同図において、５はガラス繊維などエツチン
グ処理液に対して耐食性を有するもので形成した
フエルトで、支持部材６に取り付けられており、
支持部材６の上部は支持筒７に嵌挿され、フエル
ト５は支持部材６とともに上下動するようになさ
れている。支持筒７はフエルト５および支持部材
６とともに、エツチング処理液を貯留した貯留槽
（図示省略）とシリンダ１との間を往復動するよ
うになされている。
エツチングにあたつては、まず、フエルト５を
貯留槽のエツチング処理液につけて該処理液をフ
エルト５に含浸し、次いでフエルト５をシリンダ
１のボア内で10〜30秒間上下に摺動せしめる。
シリンダ１の内壁面４は、第２図に示す如くア
ルミニウム地２のみがNaOHでエツチングされ、
シリコン粒子３は溶解しない。すなわち、シリコ
ン粒子３の表面は第２工程の研磨加工を施したま
まの凹凸状態にあり、シリコン粒子３の露出面積
はシリンダ内壁面４の20〜30％である。また、
H2O2の酸化力でスマツトおよびスケールの発生
が防止される。アルミニウム地２の腐食量、つま
り、シリコン粒子３の浮出し高さは後述する最終
的な浮出し高さ（1.5〜４μ）よりも若干高くな
るようにする。
本工程において、スマツトおよびスケールの発
生を防止しつつアルミニウム地２のみをエツチン
グするための最適条件は次のとおりである。すな
わち、エツチング処理液は５重量％のNaOHと、
0.06重量％のH2O2と、残り水との混合液であ
り、また、エツチング処理液の温度は50℃、処理
時間は10〜15秒である。
なお、実施例ではエツチングにあたつてフエル
ト５を使用することにより、シリンダ１の内壁面
４にのみエツチング処理を施すことができるよう
にしたが、シリンダ１をエツチング処理液に浸漬
してエツチングする方法を採用してもよい。
次に、第４工程においては、シリンダ１の水洗
を行なう。これは、第３工程においてシリンダ１
の内壁面４に残留しているエツチング処理液を除
去するためである。
第５工程においては、シリンダ１の内壁面４よ
り露出したシリコン粒子３にエツチング処理を施
す。エツチング処理液は３〜７重量％のHNO3と
残り水との混合液であり、液温は30〜60℃、処理
時間は20〜60秒である。エツチング処理は第３工
程と同様の態様で行なう。
シリンダ１の内壁面４は、第３図に示す如くア
ルミニウム地２はそのままでシリコン粒子３のみ
がエツチングされる。すなわち、シリコン粒子３
は、低濃度の硝酸で表面周縁部が溶解するととも
に表面の凹凸がなくなり、平滑になる。そして、
シリコン粒子３のアルミニウム地２表面からの浮
出し高さは1.5〜４μ程度となる。
本工程におけるエツチング処理の最適条件は次
のとおりである。すなわち、エツチング処理液の
HNO3の濃度は3.5重量％であり、液温は50℃、処
理時間は20〜40秒である。
第６工程においては、シリンダ１の水洗を行な
い、エツチング処理液を除去する。
次に、本発明方法にかかるシリンダの耐摩耗性
について試験結果をもとに説明する。
＜試験１＞
本試験は、シリンダ材に対するリング材の摺動
回数とシリンダ材の摩耗体積との関係について、
本発明例と従来例とを比較してみたものである。
試験に供したシリンダ材は次の表に示すとおり
であり、リング材としては鋳鉄にクロムメツキを
施したものを用いた。
The present invention relates to a method for etching aluminum alloy cylinders. Aluminum alloy cylinders are commonly used to reduce the weight of engines, but they have lower wear resistance than cast iron cylinders.
There is also the problem that burn-in is likely to occur. Therefore, attempts have been made to increase the silicon content of aluminum alloy cylinders and expose silicon particles on the inner wall surface of the cylinder to improve wear resistance. For example, in Japanese Patent Application Laid-Open No. 57-101700, electrolytic etching is applied to the inner wall surface of the cylinder to make silicon particles stand out from the inner wall surface of the cylinder, and the silicon particles improve wear resistance. A proposal is described to improve the lubricating oil holding power by using recesses between the two. However, in the case of electrolytic etching, in order to make the amount of etching uniform, the distance between the electrode inserted into the cylinder bore and the inner wall surface of the cylinder must be constant, and it is difficult to maintain this distance constant, so etching The amount may become uneven, and as a result, the amount of silicon particles protruding becomes too large and the silicon particles may fall off when the piston ring slides, or the corners of the silicon particles may be missing. There was a problem. Other etching methods include sulfuric acid, nitric acid,
There are acid etching methods that use strong acids such as phosphoric acid, and alkaline etching methods that use highly concentrated sodium hydroxide. There is a concern that silicon particles may easily fall off or be missing due to dissolution. on the other hand,
In the case of the alkaline etching method, the aluminum base is dissolved without dissolving the silicon particles, but metal components such as copper and magnesium are difficult to dissolve.
There is a problem in that this remains on the surface, and the molten aluminum becomes aluminum hydroxide and adheres to the aluminum base, impeding uniform etching. In view of this, the present invention first prepares the inner wall surface of the cylinder with 5 to 10% by weight NaOH and 0.05 to 0.35% by weight.
Etch with a mixed aqueous solution of H 2 O 2 to bring out the silicon particles, and after washing with water, add 3 to 7% by weight HNO 3
To provide an etching method in which the surface of silicon particles is dissolved and smoothed with an aqueous solution, and an aluminum base can be uniformly etched, and
The purpose is to improve wear resistance by preventing silicon particles from falling off or missing. DESCRIPTION OF THE PREFERRED EMBODIMENTS The configuration of the present invention will be described below based on embodiments with reference to the drawings. The example consists of six steps, and FIG. 1 shows the state of the inner wall of the aluminum alloy cylinder 1 after the second step, FIG. 2 the third step, and FIG. 3 the fifth step. 2 is an aluminum base, and 3 is a silicon particle. The composition (wt%) of the aluminum alloy casting that makes up cylinder 1 is Si17%, Cu4.5
%, Ni 1.5%, Mg 1%, P 0.05%, and the balance Al, and the primary silicon particles 3 are refined by the addition of P. In the first step, the cylinder 1 after casting is subjected to heat treatment. In other words, cylinder 1 is heated to 500℃ for 5
After heating for ~6 hours and water cooling (quenching), heat at 180℃ for 3 hours.
Perform a tempering treatment for ~4 hours. In the second step, the inner wall surface 4 of the cylinder 1 is polished. That is, first, cylinder 1
honing the inner wall surface 4 of the
Wrapping is performed using abrasive grains. The state after processing is shown in FIG. 1, and the surface roughness of the inner wall surface 4 is 1.5μ or less. In the third step, the aluminum base 2 of the cylinder inner wall surface 4 is etched. The etching solution contains 5-10% by weight of NaOH and 0.05-10% by weight of NaOH.
It is a mixed liquid of 0.35% by weight of H 2 O 2 and the remaining water, the liquid temperature is 30 to 60°C, and the processing time is 10 to 30 seconds. The etching process is shown in FIG. In the figure, reference numeral 5 denotes a felt made of glass fiber or other material that is resistant to corrosion against the etching solution, and is attached to a support member 6.
The upper part of the support member 6 is fitted into the support cylinder 7, and the felt 5 is configured to move up and down together with the support member 6. The support cylinder 7, together with the felt 5 and the support member 6, is configured to reciprocate between the cylinder 1 and a storage tank (not shown) storing an etching solution. For etching, first, the felt 5 is immersed in an etching solution in a storage tank to impregnate the felt 5 with the etching solution, and then the felt 5 is slid up and down within the bore of the cylinder 1 for 10 to 30 seconds. As shown in FIG. 2, the inner wall surface 4 of the cylinder 1 has only the aluminum base 2 etched with NaOH.
Silicon particles 3 do not dissolve. That is, the surface of the silicon particles 3 remains uneven as it has been subjected to the polishing process in the second step, and the exposed area of the silicon particles 3 is 20 to 30% of the inner wall surface 4 of the cylinder. Also,
The oxidizing power of H 2 O 2 prevents the formation of smut and scale. The amount of corrosion of the aluminum base 2, that is, the height of the embossment of the silicon particles 3 is set to be slightly higher than the final embossment height (1.5 to 4μ), which will be described later. In this process, the optimum conditions for etching only the aluminum base 2 while preventing the generation of smut and scale are as follows. That is, the etching solution contains 5% by weight of NaOH,
It is a mixed solution of 0.06% by weight of H 2 O 2 and the remaining water, and the temperature of the etching solution is 50° C. and the processing time is 10 to 15 seconds. In the embodiment, by using the felt 5 for etching, it was possible to perform the etching process only on the inner wall surface 4 of the cylinder 1. method may be adopted. Next, in the fourth step, the cylinder 1 is washed with water. This is done in cylinder 1 in the third step.
This is to remove the etching solution remaining on the inner wall surface 4 of. In the fifth step, the silicon particles 3 exposed from the inner wall surface 4 of the cylinder 1 are etched. The etching solution is a mixture of 3 to 7% by weight of HNO 3 and remaining water, the temperature of the solution is 30 to 60°C, and the processing time is 20 to 60 seconds. The etching process is performed in the same manner as the third step. As shown in FIG. 3, on the inner wall surface 4 of the cylinder 1, only the silicon particles 3 are etched, leaving the aluminum base 2 intact. That is, silicon particles 3
As the surface periphery is dissolved by low concentration nitric acid, the surface unevenness disappears and becomes smooth. and,
The height of the silicon particles 3 protruding from the surface of the aluminum base 2 is about 1.5 to 4 μm. The optimum conditions for etching in this step are as follows. In other words, the etching solution
The concentration of HNO3 is 3.5% by weight, the liquid temperature is 50°C, and the processing time is 20-40 seconds. In the sixth step, the cylinder 1 is washed with water to remove the etching solution. Next, the wear resistance of the cylinder according to the method of the present invention will be explained based on test results. <Test 1> This test investigated the relationship between the number of times the ring material slides against the cylinder material and the wear volume of the cylinder material.
This is a comparison between an example of the present invention and a conventional example. The cylinder materials used in the test are shown in the table below, and the ring material used was cast iron with chrome plating.
【表】
上記表において、本発明方法では第３工程およ
び第５工程でいう最適条件のエツチング処理液を
用いた。また、従来方法とは酸エツチング法であ
り、処理液は60重量％のH3PO4と14重量％の
HNO3と26重量％の水との混合液である。液温は
60℃、処理時間は30〜40秒で、エツチング処理後
に水洗した。なお、FCH1はＣ、Si、Mn、Ｐ、
Ｓ、Crを含有する合金鋳鉄である。
第５図には供試材であるシリンダ材８およびリ
ング材９が示されている。シリンダ材８は平板で
ある。リング材９は直方体で、長さｌは10mm、幅
Ｗは１mmである。また、リング材９の往復移動距
離Ｓは10mmである。
試験条件は、リング材９の１分間の往復摺動回
数を700回、また、シリンダ材８とリング材９の
接触面圧を２Kg／mm2とし、潤滑油にはマシン油
＃10を用いた。なお、接触面圧は通常のピストン
リングの面圧（0.1〜１Kg／mm2）より高い。試験
結果を第６図に示す。
同図に示されている如く、本発明例の場合、従
来例１、２のいずれよりも摩耗体積が少なく、耐
摩耗性に優れていることがわかる。
＜試験２＞
本試験は、接触面圧と摩耗体積との関係につい
て本発明例と従来例とを比較してみたものであ
る。
供試材は、シリンダ材が試験１の表に示す本発
明例と従来例１の欄に示すものであり、また、リ
ング材は試験１と同じものである。また、リング
材の摺動回数は30×104回、潤滑油はマシン油
＃10である。試験結果は第７図に示す。
同図に示されている如く、本発明例の場合、摩
耗体積は従来例より低くなつている。同図におい
て×印はシリコン粒子が脱落あるいは欠落したこ
とを示しているが、このシリコン粒子の脱落等を
生じる接触面圧も本発明例の方が高くなつてい
る。従つて、本発明の如く、シリコン粒子の表面
を平滑にした場合、単に耐摩耗性が高くなるだけ
でなく、シリコン粒子の耐久性も高くなることが
わかる。
＜試験３＞
本試験は、本発明にかかるシリコン粒子の浮出
し高さと摩耗量との関係をみたもので試験結果は
第８図に示されている。
供試材は、シリンダ材が試験１の表の本発明例
の欄に示すものであり、リング材は試験１と同じ
ものである。また、接触面圧は1.5Kg／mm2、潤滑
油はマシン油＃10、摺動回数は200×104回であ
る。
第８図に示されている如く、摩耗量はシリコン
粒子の浮出し高さが1.5μと４μとを境としてそ
の両側で浮出し高さの低下あるいは高くなるに従
い急激に多くなつている。すなわち、1.5μ未満
の浮出し高さでは、シリコン粒子間での潤滑油の
保持が悪くなり、またアルミニウム地とリング材
との接触による凝着があるため摩耗量が多くなつ
ている。一方、４μを越える浮出し高さでは、シ
リコン粒子のアルミニウム地に対する埋込み深さ
が浅くなるため、シリコン粒子が脱落し易くな
り、また、シリコン粒子の角部が欠落し易くな
り、摩耗量が多くなつている。従つて、シリコン
粒子の浮出し高さは1.5〜４μの範囲が最も好ま
しい。
以上のように、本発明によれば、アルミニウム
地のエツチング処理液にH2O2を混合したため、
スマツトおよびスケールの発生が防止され、アル
ミニウム地を均一に腐食させることができるとと
もに、HNO3でシリコン粒子にエツチング処理を
施してシリコン粒子の表面を平滑にしたから、耐
摩耗性が従来よりも向上するという優れた効果が
得られる。[Table] In the above table, in the method of the present invention, the etching solution having the optimum conditions in the third step and the fifth step was used. In addition, the conventional method is an acid etching method, and the processing solution is 60% by weight of H 3 PO 4 and 14% by weight.
It is a mixture of HNO3 and 26% water by weight. The liquid temperature is
The etching process was carried out at 60°C for 30 to 40 seconds and then washed with water. In addition, FCH1 is C, Si, Mn, P,
It is an alloyed cast iron containing S and Cr. FIG. 5 shows a cylinder material 8 and a ring material 9 as test materials. The cylinder material 8 is a flat plate. The ring material 9 is a rectangular parallelepiped, and has a length l of 10 mm and a width W of 1 mm. Further, the reciprocating distance S of the ring material 9 is 10 mm. The test conditions were that the ring material 9 was slid back and forth 700 times per minute, the contact surface pressure between the cylinder material 8 and the ring material 9 was 2 kg/ mm2 , and machine oil #10 was used as the lubricating oil. . Note that the contact surface pressure is higher than that of a normal piston ring (0.1 to 1 Kg/mm 2 ). The test results are shown in Figure 6. As shown in the figure, in the case of the example of the present invention, the wear volume is smaller than both of conventional examples 1 and 2, and it can be seen that the example has excellent abrasion resistance. <Test 2> In this test, the example of the present invention and the conventional example were compared with respect to the relationship between contact surface pressure and wear volume. In the test materials, the cylinder materials are those shown in the columns of the invention example and conventional example 1 shown in the table of Test 1, and the ring materials are the same as those in Test 1. The number of times the ring material was slid was 30×10 4 times, and the lubricating oil was machine oil #10. The test results are shown in Figure 7. As shown in the figure, in the case of the example of the present invention, the wear volume is lower than that of the conventional example. In the figure, the x marks indicate that silicon particles have fallen off or are missing, and the contact surface pressure that causes these silicon particles to fall off is also higher in the example of the present invention. Therefore, it can be seen that when the surfaces of silicon particles are made smooth as in the present invention, not only the wear resistance but also the durability of the silicon particles is increased. <Test 3> This test looked at the relationship between the protrusion height of silicon particles according to the present invention and the amount of wear, and the test results are shown in FIG. As for the test materials, the cylinder material was as shown in the column of the invention example in the table of Test 1, and the ring material was the same as in Test 1. In addition, the contact surface pressure was 1.5 Kg/mm 2 , the lubricating oil was machine oil #10, and the number of sliding movements was 200×10 4 times. As shown in Figure 8, the amount of wear increases rapidly on both sides of the boundary between silicon particle embossment heights of 1.5μ and 4μ as the embossment height decreases or increases. . That is, when the protrusion height is less than 1.5μ, lubricating oil is poorly retained between silicon particles, and there is adhesion due to contact between the aluminum base and the ring material, resulting in a large amount of wear. On the other hand, if the height of the embossment exceeds 4μ, the depth of embedding the silicon particles into the aluminum base becomes shallow, making it easy for the silicon particles to fall off, and for the corners of the silicon particles to be easily chipped, resulting in a reduction in the amount of wear. There are more and more. Therefore, the height of the raised silicon particles is most preferably in the range of 1.5 to 4 microns. As described above, according to the present invention, since H 2 O 2 is mixed in the etching solution for aluminum substrate,
Smuts and scales are prevented from forming, and the aluminum base can be corroded uniformly. In addition, the surface of the silicon particles is smoothed by etching them with HNO 3 , which improves wear resistance compared to conventional products. An excellent effect can be obtained.
図面は本発明の実施態様を例示し、第１図乃至
第３図は処理工程の各段階におけるシリンダの内
壁状態をそれぞれ示す断面図、第４図はエツチン
グ処理の態様を示す断面図、第５図は摩耗試験の
態様を示す斜視図、第６図は摺動回数と摩耗体積
との関係を示すグラフ図、第７図は接触面圧と摩
耗体積との関係を示すグラフ図、第８図はシリコ
ン粒子の浮出し高さと摩耗量との関係を示すグラ
フ図である。
１……シリンダ、２……アルミニウム地、３…
…シリコン粒子、４……内壁面。
The drawings illustrate embodiments of the present invention, and FIGS. 1 to 3 are cross-sectional views showing the state of the inner wall of the cylinder at each stage of the processing process, FIG. 4 is a cross-sectional view showing aspects of the etching process, and FIG. The figure is a perspective view showing the aspect of the wear test, Figure 6 is a graph showing the relationship between the number of sliding movements and wear volume, Figure 7 is a graph showing the relationship between contact surface pressure and wear volume, and Figure 8 is a graph showing the relationship between contact surface pressure and wear volume. is a graph diagram showing the relationship between the protrusion height of silicon particles and the amount of wear. 1...Cylinder, 2...Aluminum base, 3...
...Silicon particle, 4...Inner wall surface.
Claims (1)
工した後、該内壁のアルミニウム地に５〜10重量
％のNaOHと0.05〜0.35重量％のH2O2と残部水と
の混合液でエツチングを施し、その後上記内壁を
水洗し、該内壁に露出したシリコン粒子の表面部
に３〜７重量％のHNO3と残り水との混合液でエ
ツチングを施すことを特徴とするアルミニウム合
金製シリンダのエツチング方法。1 After polishing the inner wall of an aluminum alloy cylinder, etching the aluminum base of the inner wall with a mixed solution of 5 to 10% by weight NaOH, 0.05 to 0.35% by weight H2O2 , and the balance water; A method for etching an aluminum alloy cylinder, which comprises washing the inner wall with water and etching the surface of the silicon particles exposed on the inner wall with a mixed solution of 3 to 7% by weight of HNO 3 and remaining water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21617282A JPS59107081A (en) | 1982-12-08 | 1982-12-08 | Method for etching cylinder made of aluminum alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21617282A JPS59107081A (en) | 1982-12-08 | 1982-12-08 | Method for etching cylinder made of aluminum alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59107081A JPS59107081A (en) | 1984-06-21 |
| JPS6225754B2 true JPS6225754B2 (en) | 1987-06-04 |
Family
ID=16684409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21617282A Granted JPS59107081A (en) | 1982-12-08 | 1982-12-08 | Method for etching cylinder made of aluminum alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59107081A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03117779A (en) * | 1989-09-29 | 1991-05-20 | Nissan Motor Co Ltd | Slide member |
| JP4817039B2 (en) * | 2004-11-11 | 2011-11-16 | 大豊工業株式会社 | Sliding device |
-
1982
- 1982-12-08 JP JP21617282A patent/JPS59107081A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59107081A (en) | 1984-06-21 |
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