JPS6225685B2 - - Google Patents
Info
- Publication number
- JPS6225685B2 JPS6225685B2 JP58193176A JP19317683A JPS6225685B2 JP S6225685 B2 JPS6225685 B2 JP S6225685B2 JP 58193176 A JP58193176 A JP 58193176A JP 19317683 A JP19317683 A JP 19317683A JP S6225685 B2 JPS6225685 B2 JP S6225685B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- acid
- weight
- meth
- bromine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 24
- 239000002253 acid Substances 0.000 claims description 23
- 239000011342 resin composition Substances 0.000 claims description 23
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 21
- 229910052794 bromium Inorganic materials 0.000 claims description 21
- 239000003822 epoxy resin Substances 0.000 claims description 15
- 229920000647 polyepoxide Polymers 0.000 claims description 15
- 239000004593 Epoxy Substances 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 9
- 229920000193 polymethacrylate Polymers 0.000 claims description 9
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 6
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 claims description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000178 monomer Substances 0.000 claims description 4
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 26
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000011521 glass Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000004744 fabric Substances 0.000 description 10
- 239000003063 flame retardant Substances 0.000 description 9
- -1 3,5-dibromo-4-hydroxyphenyl Chemical group 0.000 description 8
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 8
- 230000007797 corrosion Effects 0.000 description 8
- 229920000728 polyester Polymers 0.000 description 8
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 229920006305 unsaturated polyester Polymers 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- 239000004342 Benzoyl peroxide Substances 0.000 description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 5
- 238000009413 insulation Methods 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- 229920006337 unsaturated polyester resin Polymers 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000001530 fumaric acid Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 2
- BSWWXRFVMJHFBN-UHFFFAOYSA-N 2,4,6-tribromophenol Chemical compound OC1=C(Br)C=C(Br)C=C1Br BSWWXRFVMJHFBN-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 239000004641 Diallyl-phthalate Substances 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 125000004018 acid anhydride group Chemical group 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 150000003014 phosphoric acid esters Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 235000013824 polyphenols Nutrition 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- TYQWYQKXBGUHCS-UHFFFAOYSA-N 1,2,3,4-tetrabromo-5-(tribromomethyl)benzene Chemical compound BrC=1C(=C(C(=C(C(Br)(Br)Br)C=1)Br)Br)Br TYQWYQKXBGUHCS-UHFFFAOYSA-N 0.000 description 1
- DEIGXXQKDWULML-UHFFFAOYSA-N 1,2,5,6,9,10-hexabromocyclododecane Chemical compound BrC1CCC(Br)C(Br)CCC(Br)C(Br)CCC1Br DEIGXXQKDWULML-UHFFFAOYSA-N 0.000 description 1
- YAOMHRRYSRRRKP-UHFFFAOYSA-N 1,2-dichloropropyl 2,3-dichloropropyl 3,3-dichloropropyl phosphate Chemical compound ClC(Cl)CCOP(=O)(OC(Cl)C(Cl)C)OCC(Cl)CCl YAOMHRRYSRRRKP-UHFFFAOYSA-N 0.000 description 1
- LXIZRZRTWSDLKK-UHFFFAOYSA-N 1,3-dibromo-5-[2-[3,5-dibromo-4-(2,3-dibromopropoxy)phenyl]propan-2-yl]-2-(2,3-dibromopropoxy)benzene Chemical compound C=1C(Br)=C(OCC(Br)CBr)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(OCC(Br)CBr)C(Br)=C1 LXIZRZRTWSDLKK-UHFFFAOYSA-N 0.000 description 1
- QVHNPERSEFABEH-UHFFFAOYSA-N 2,2-dibromopropanoic acid Chemical compound CC(Br)(Br)C(O)=O QVHNPERSEFABEH-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- YEVQZPWSVWZAOB-UHFFFAOYSA-N 2-(bromomethyl)-1-iodo-4-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=CC=C(I)C(CBr)=C1 YEVQZPWSVWZAOB-UHFFFAOYSA-N 0.000 description 1
- NXJGWHGJPITYOJ-UHFFFAOYSA-N 2-[(2,4,6-tribromophenoxy)methyl]oxirane Chemical compound BrC1=CC(Br)=CC(Br)=C1OCC1OC1 NXJGWHGJPITYOJ-UHFFFAOYSA-N 0.000 description 1
- XRXMNWGCKISMOH-UHFFFAOYSA-N 2-bromobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1Br XRXMNWGCKISMOH-UHFFFAOYSA-N 0.000 description 1
- IKCLCGXPQILATA-UHFFFAOYSA-N 2-chlorobenzoic acid Chemical class OC(=O)C1=CC=CC=C1Cl IKCLCGXPQILATA-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- BKFXSOCDAQACQM-UHFFFAOYSA-N 3-chlorophthalic acid Chemical compound OC(=O)C1=CC=CC(Cl)=C1C(O)=O BKFXSOCDAQACQM-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- WOURXYYHORRGQO-UHFFFAOYSA-N Tri(3-chloropropyl) phosphate Chemical compound ClCCCOP(=O)(OCCCCl)OCCCCl WOURXYYHORRGQO-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- VKWIPDOYQDHBSK-UHFFFAOYSA-N [11-chloro-8-(3-chloropropyl)undecyl] dihydrogen phosphate Chemical compound OP(O)(=O)OCCCCCCCC(CCCCl)CCCCl VKWIPDOYQDHBSK-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- RAYIMXZLSRHMTK-UHFFFAOYSA-N bis(2,3-dibromopropyl) 2,3-dichloropropyl phosphate Chemical compound ClCC(Cl)COP(=O)(OCC(Br)CBr)OCC(Br)CBr RAYIMXZLSRHMTK-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- LMGZGXSXHCMSAA-UHFFFAOYSA-N cyclodecane Chemical compound C1CCCCCCCCC1 LMGZGXSXHCMSAA-UHFFFAOYSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000008049 diazo compounds Chemical class 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- JYGXADMDTFJGBT-VWUMJDOOSA-N hydrocortisone Chemical compound O=C1CC[C@]2(C)[C@H]3[C@@H](O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 JYGXADMDTFJGBT-VWUMJDOOSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- VIJMMQUAJQEELS-UHFFFAOYSA-N n,n-bis(ethenyl)ethenamine Chemical compound C=CN(C=C)C=C VIJMMQUAJQEELS-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- YAFOVCNAQTZDQB-UHFFFAOYSA-N octyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCCCCCC)OC1=CC=CC=C1 YAFOVCNAQTZDQB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- WPZJSWWEEJJSIZ-UHFFFAOYSA-N tetrabromobisphenol-F Natural products C1=C(Br)C(O)=C(Br)C=C1CC1=CC(Br)=C(O)C(Br)=C1 WPZJSWWEEJJSIZ-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 description 1
- DQWPFSLDHJDLRL-UHFFFAOYSA-N triethyl phosphate Chemical compound CCOP(=O)(OCC)OCC DQWPFSLDHJDLRL-UHFFFAOYSA-N 0.000 description 1
- WVLBCYQITXONBZ-UHFFFAOYSA-N trimethyl phosphate Chemical compound COP(=O)(OC)OC WVLBCYQITXONBZ-UHFFFAOYSA-N 0.000 description 1
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 1
- LENZDBCJOHFCAS-UHFFFAOYSA-N tris Chemical compound OCC(N)(CO)CO LENZDBCJOHFCAS-UHFFFAOYSA-N 0.000 description 1
- WTLBZVNBAKMVDP-UHFFFAOYSA-N tris(2-butoxyethyl) phosphate Chemical compound CCCCOCCOP(=O)(OCCOCCCC)OCCOCCCC WTLBZVNBAKMVDP-UHFFFAOYSA-N 0.000 description 1
- HQUQLFOMPYWACS-UHFFFAOYSA-N tris(2-chloroethyl) phosphate Chemical compound ClCCOP(=O)(OCCCl)OCCCl HQUQLFOMPYWACS-UHFFFAOYSA-N 0.000 description 1
- XHGIFBQQEGRTPB-UHFFFAOYSA-N tris(prop-2-enyl) phosphate Chemical compound C=CCOP(=O)(OCC=C)OCC=C XHGIFBQQEGRTPB-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Graft Or Block Polymers (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
〔技術分野〕
この発明は、難燃性に優れた耐蝕・耐熱性樹脂
組成物に関するものである。
〔背景技術〕
熱硬化性樹脂、特に不飽和ポリエステル樹脂に
代表されるラジカル重合型熱硬化性樹脂は成形時
の作業性、硬化性、さらには硬化物の特性のバラ
ンスが良く、各種分野において活発に利用されて
いるのは衆知の通りである。特に、ガラス繊維等
の補強材と組合せてFRPとした場合、強度、耐
蝕性、絶縁性等に優れ、錆びないためにレーダー
ドー、タンク、パイプ、ダクト、堰、絶縁板、ケ
ーブルパイプ等に拡く利用されている。しかしな
がら、有機的なるがゆえに燃焼に対しては極めて
抵抗力が弱く、最近、安全性の面から、難燃性へ
の要求が強くなるにしたがつて、その利用が制限
される傾向にあるのは否めない。そこで、これま
でも、ハロゲン原子の該樹脂骨格への導入や各種
難燃剤の添加等により、該樹脂の難燃性の改良が
多々試みられているが、現在のところ、十分な難
燃性を付与しようとすると、例えば、耐蝕性、耐
熱性、絶縁性等の他の特性の低下を惹起し、必ず
しも満足し得るものではない。
〔発明の目的〕
このような事情に鑑み、この発明は、上記特性
を低下させることなく難燃性を付与し得た樹脂組
成物を提供することを目的とする。
〔発明の開示〕
発明者等は、上記目的を達成するべく鋭意研究
した結果、特定の樹脂組成とすることにより難燃
性、耐蝕性、耐熱性、絶縁性等を兼ね備えた樹脂
組成物とすることを可能ならしめ、この発明を完
成さたのである。
すなわち、この発明は、ブロム含有エポキシ樹
脂と(メタ)アクリル酸を主成分とすると酸成分
とを反応させて得られるブロム含有エポキシポリ
(メタ)アクリレート(a)、下記の一般式(A)で示さ
れる化合物()を少なくも50モル%含有してな
るアルコール成分(イ)とα,β―不飽和ジカルボン
酸および/またはその無水物()を少なくとも
50モル%含有してなる酸成分(ロ)とを反応させて得
られる不飽和ポリエステル(b)、重合性不飽和単量
体(c)、および必要により用いられる難燃添加剤(d)
からなり、(a),(b),(c)および(d)がそれぞれ100重
量部、20〜120重量部、30〜150重量部および0〜
50重量部の比率であり、全ブロム含有量が15〜30
重量%でしかもその内の8〜16重量%はブロム含
有エポキシポリ(メタ)アクリレート(a)に基づく
ものであることを特徴とする樹脂組成物をその要
旨とするものである。
一般式(A)
〔ただし、m,nはれぞれ独立して1〜4の整
数でかつ2≦n+m≦5の式を満すものであり、
R1,R2はそれぞれ独立して炭素数2〜3のアル
キレン基でかつ括弧で示された繰返し単位ごとに
異つていてもよい。〕
ここに、ブロム含有エポキシ樹脂とは、1分子
中に少なくとも1個のエポキシ基を有し、ブロム
含有量が少なくとも15重量%好ましくは35重量%
以上であるエポキシ樹脂を指す。このようなブロ
ム含有エポキシ樹脂の例としては、テトラブロム
ビスフエノールA、テトラブロムビスフフエノー
ルF、ブロム化ノボラツク樹脂、1,1,3―ト
リス(3,5―ジブロモ―4―ヒドロキシフエニ
ル)プロパン等のブロム含有多価フエノールとエ
ピクロルヒドリンとの重縮合によつて得られるエ
ポキシ樹脂がある。また、これらのブロム含有エ
ポキシ樹脂としは市販のものを有効に利用するこ
とができ、例えば大日本インキ化学工業株式会社
製のエピクロン152,1120,153―60M:シエル化
学工業株式会社製のエピコートDX―248―B―
80,DX―245:住友化学工業株式会社製のスミエ
ポキシESB―340,ESB―400,ESB―500,ESB
―700,ESB―715等を挙げることができる。
ブロム含有エポキシ樹脂の中でも、エポキシ当
量が600以下のものを用いると、この発明の樹脂
組成物を積層板とした時の物性のバランスが良
く、特に好ましいもである。
ブロム含有エポキシポリ(メタ)アクリレート
(a)は、ブロム含有エポキシ樹脂と(メタ)アクリ
ル酸を主成分とする酸成分とを反応させて得られ
るものである。この時の該エポキシ樹脂と酸成分
との使用割合は、エポキシ基1個当りにカルボキ
シル基(酸成分が酸無水物基を含む場合は、酸無
水物基1個をカルボキシル基2個とみなす。)0.7
〜1.5個である。酸成分は少なくとも60モル%の
(メタ)アクリル酸を含有し、必要によりその他
のカルボン酸および/またはカルボン酸無水物を
含有する。それらのカルボン酸、カルボン酸無水
物の好ましい例としてはフタル酸、マレイン酸、
フマル酸、コハク酸、アジピン酸、ブロムフタル
酸、クロルフタル酸、ヘツト酸、テトラヒドロフ
タル酸、3,6―エンドメチレンテトラヒドロフ
タル酸、酢酸、プロピオン酸、ジブロモプロピオ
ン酸、安息香酸、ブロム安息香酸、クロル安息香
酸もしくはそれらの酸無水物等である。ブロム含
有エポキシ樹脂と(メタ)アクリル酸を主成分と
する酸成分とは、種々の方法で反応させることが
できる。この中で最も一般的な方法は、該エポキ
シ樹脂と該酸成分とをトリエチルアミン、トリメ
チルベンジルアンモニウムクロライド、塩化リチ
ウム等の反応触媒:ハイドロキノン、カテコー
ル、ピクリン酸、分子状酸素等の安定剤:および
必要によりトルエン、スチレン、酢酸エチル等の
溶剤の存在下に、70〜150℃の温度範囲で反応さ
せる方法である。この際、溶剤にスチレンを用い
る方法は反応生成物であるブロム含有エポキシポ
リ(メタ)アクリレート(a)を使用するに当つて溶
剤を除去する必要がなく、特に好ましい方法であ
る。
不飽和ポリエステル(b)は上記の一般式(A)で示さ
れる化合物()を少なくとも50モル%含有して
なるアルコール成分(イ)とα,β―不飽和ジカルボ
ン酸および/またはその無水物()を少なくと
も50モル%含有してなる酸成分(ロ)との反応生成物
であり、通常、その分子量は500〜10000の範囲の
ものが好ましい。化合物()やα,β―不飽和
ジカルボン酸および/またはその無水物()の
使用量が上記範囲をはずれた場合は、耐熱性、耐
蝕性が低下し、この発明の目的を達成することが
できず好ましくない。
α,β―不飽和ジカルボン酸および/またはそ
の無水物()としては、無水マレイン酸、フマ
ル酸、イタコン酸、シトラコン酸等を挙げること
ができる。
アルコール成分(イ)として用いられる化合物
()以外の化合物や、酸成分(ロ)として用いられ
るα,β―不飽和ジカルボン酸および/またはそ
の無水物()以外の化合物としては、不飽和ポ
リエステル樹脂業界で公知のものを任意に選択し
て使用することができる〔例えば、日刊工業新聞
社発行(昭和55年8月30日第9版)、滝山栄一郎
著「ポリエステル樹脂」第25頁、表2・1(a)記載
の酸や、同第26頁、表2.1(b)記載のアルコール類
等である〕。
不飽和ポリエステル(b)は当該業界で公知の方法
に従つて製造することができる。例えば、上記の
ごとくして選定されたアルコール成分(イ)と酸成分
(ロ)とを150〜250℃の温度範囲で触媒の存在下もし
くは不存在下に、窒素ガスや炭酸ガス等の不活性
ガス雰囲気下に脱水縮合する方法である。
重合性不飽和単量体(c)とは、1分子中に少なく
とも1個のビニル性不飽和基を有する常温では液
体の化合物とさし、例えばスチレン、ビニルトル
エン、ジビニルベンゼン、α―メチルスチレン、
クロルスチレン等の芳香族ビニル化合物類:酢酸
ビニル、アジピン酸ジビニルエステル等のビニル
エステル類:ジアリルフタレート:メチル(メ
タ)アクリレート、オチル(メタ)アクリレー
ト、オクチル(メタ)アクリレート、ジ(メタ)
アクリロオキシエチル等の(メタ)アクリル酸エ
ステル類等を挙げることができ、これらの化合物
の1種もしくは2種以上を用いることができる。
その中でも、スチレンはその溶剤性能、重合反応
性等が特に良く好ましいものである。
この発明を実施するに当つて、必要に応じて難
燃添加剤(d)を用いることができる。難燃添加剤(d)
としては公知の種々の難燃添加剤を用いることが
でき、その代表的な例としては、例えばヘキサブ
ロモシクロドデカン、ヘキサブロモベンゼン、ポ
リ臭化ビフエニルエーテル、ヘプタブロモトルエ
ン、2,2―ビス〔4―(2,3ジブロモプロポ
キシ)3,5―ジブロモフエニル〕プロパン、
2,4,6―トリブロモフエノール(メタ)アリ
レート、2,4,6―トリブロモフエノールグリ
シジルエーテル、前記のごときブロム化エポキシ
樹脂、テトラブロモフタル酸、テトラクロロフル
酸、ヘツト酸、パークロロペンタシクロデカン等
のハロゲン系難燃剤:トリメチルホスフエート、
トリエチルフオスフエート、トリブチルフオスフ
エート、トリオクチルフオスフエート、トリブト
キシエチルフオスフエート、トリフエニルフオス
フエート、トリクレジルフオスフエート、クレジ
ルフエニルフオスフエート、オクチルジフエニル
フオスフエート、トリス(クロロエチル)フオス
フエート、トリス(ジクロロプロピル)フオスフ
エート、トリス(クロロプロピル)フオスフエー
ト、ビス(2,3―ジブロモプロピル)2,3―
ジクロロプロピルフオスフエート、トリス(2,
3―ジブロモプロピル)フオスフエート、ビス
(クロロプロピル)オクチルフオスフエート、ト
リアリルフオスフエート等のリン酸エステル類:
三酸化アンチモン等である。この中でも、ブロム
含有エポキシポリ(メタ)アクリレート(a)、不飽
和ポリエステル(b)および重合性不飽和重合体(c)よ
りなる樹脂液に溶解性を有する芳香族系ハロゲン
化合物、芳香族系リン酸エステル、ラジカル重合
性ハロゲン化合物、ラジカル重合性リン酸エステ
ルは、それより導かれた樹脂組成物の難燃性、耐
熱性、耐水性等のバランスが良く、特に好ましい
ものである。
この発明にかかる樹脂組成物は、ブロム含有エ
ポキシポリ(メタ)アクリレート(a)100重量部当
りに不飽和ポリエステル(b)20〜120重量部、重合
性不飽和単量体(c)30〜150重量部、および必要に
より難燃添加剤(d)0〜50重量部よりなる樹脂組成
物であつて、全ブロム含有量が15〜30重量%でし
かもそのうち8〜16重量%はブロム含有エポキシ
(メタ)アクリレート(a)に基づくものである。(a)
〜(d)の各成分の配合比率、およびブロム含有量が
上記範囲をはずれた場合は、それより導かれた樹
脂組成物の諸物性のバランスがくずれ、目的とす
る諸物性の良好な樹脂組成物を得ることができ
ず、望ましくない。
この発明にかかる樹脂組成物は、通常の不飽和
ポリエステル樹脂と同様にして硬化させることが
でき、不飽和ポリエステル樹脂業界で公知の硬化
手段をそのまま利用できるものである。たとえ
ば、有機過酸化物やジアゾ化合物等の硬化剤の存
在下に加熱する方法、有機過酸化物と金属石鹸類
やアミン化合物等の促進剤とを配合する方法、感
光剤の存在下に赤外線、紫外線、電子線等の電磁
波を照射する方法等により硬化させることができ
る。
以下、例を挙げてこの発明を更に詳しく説明す
る。なお、例示中「部」とあるのは原則として
「重量部」を示すものとする。
(参考例 1)
温度計、撹拌装置、温度調節装置、ガス導入管
およびコンデンサーを備えた四ツ口フラスコにエ
ピクロン153(大日本インキ化学工業株式会社
製、ブロム化エポキシ樹脂、エポキシ当量395、
ブロム含有量49.1重量%)395部、ハイドロキノ
ン0.1部、トリエチレアミン2,0部、スチレン
200部およびアクリル酸72部を仕込み、空気を導
入しながら90〜100℃の温度範囲で11時間反応さ
せて酸価4.2のブロム含有エポキシポリアクリレ
ート70重量%およびスチレン30重量%よりなる樹
脂液(以下、樹脂(1)と記す。)を得た。
(参考例 2)
参考例1において、アクリル酸72部に代えてメ
タクリル酸86部、およびスチレン200部に代えて
スチレン206部を用いるようにした以外は参考例
1と同様にして、酸価3.8のブロム含有エポキシ
ポリメタクリレート70重量%およびスチレン30重
量%よりなる樹脂液(以下樹脂(2)と記す。)を得
た。
(参考例 3)
温度計、撹拌装置、温度調節装置、ガス導入管
およびパーシヤルコンデンサーを備えた四ツ口フ
ラスコにビスフエノールA1モルとプロピレンオ
キサイド2.1モルの反応生成物(残存フエノール
性水酸基濃度120ppm、アルコール性水酸基濃度
5.7当量/Kg)(以下BPA―2.1POと記す。)360部
および無水マレイン酸98部を投入し、窒素気流
下、200℃で酸価38となるまで反応させ、ポリエ
ステル(1)を得た。
(参考例 4)
参考例3において、BPA―2.1PO360部に代え
てBPA―2.1PO245部およびネオペンチルグリコ
ール36部を用いるようにした以外は参考例3と同
様にして、酸価33のポリエステル(2)を得た。
(参考例 5)
ジエチレングリコール111部、イソフタル酸
66.4部、アジピン酸29.2部およびフマル酸46.4部
を用いて参考例3と同様にして酸価21の不飽和ポ
リエステル(以下、ポリエステル(3)と記す。)217
部を得た。
(実施例 1)
下記の樹脂組成物
樹脂(1) 100 部
ポリエステル(1) 50 部
スチレン 20 部
ベンゾイルパーオキサイド 1.7部
三酸化アンチモン 2 部
を、ガラス布(日東紡株式会社製 WE―18K―
BS)に含浸し、この含浸したガラス布を8枚重
ね合わせ、さらに、この両面に厚みが18μmであ
る電解銅箔をそれぞれ重ねてクリアランスが1.60
mmのロール間を通過させ、ついで90℃で15分、さ
らに120℃で1時間の条件で硬化させた。得られ
た銅張積層板の厚みは約1.6mmであつた。
(実施例 2)
下記の樹脂組成物
樹脂(1) 100 部
ポリエステル(2) 50 部
ジアリルフタレート 40 部
ベンゾイルパーオキサイド 1.9部
トリクレジルフオスフエート 2 部
を、ガラス布(日東紡株式会社製 WE―18K―
BS)に含浸し、厚みが35μmである電解銅箔の
上に設置し、ついで、この上に樹脂組成物を含浸
したガラス不織布(日本バイリーン株式会社製
Ep―4050NV)3枚を重ね合わせ、さらに樹脂組
成物を含浸した上記ガラス布を重ね合わせ、その
上に厚みが35μmである電解銅箔を重ね、ついで
クリアランスが1.65mmに設定されたロール間を通
過させた後、100℃で60分間、10Kg/cm2の加熱加
圧条牛で形成し、厚みが1.6mmである銅張積層板
をた。
(実施例 3)
下記の樹脂組成物
樹脂(2) 100 部
ポリエステル(1) 50 部
スチレン 30 部
ベンゾイルパーオキサイド 1.8部
トリクレジルフオスフエート 2 部
を、実施例1で用いたものと同じガラス布に含浸
し、この含浸したガラス布を8枚重ね合わせ、さ
らに、この両面に厚みが18μmである電解銅箔を
それぞれ重ね、クリアランスが1.60mmのロール間
を通過させた後、90℃で30分間、5Kg/cm2の加熱
加圧条件で成形し、ついで、150℃で15分間加熱
し、厚みが1.6mmの銅張積層板を得た。
(実施例 4)
下記の樹脂組成物
樹脂(2) 100 部
ポリエステル(2) 40 部
スチレン 20 部
ベンゾイルパーオキサイド 1.6部
三酸化アンチモン 2 部
を、実施例1で用いたものと同じガラス布に含浸
し、厚みが100μmであるポリエステルフイルム
(東レ株式会社製 ルミラー)の上の設置し、つ
いで、この上に実施例2で用いたと同じガラス不
織布に樹脂組成物を含浸したもの2枚を重ね合わ
せ、さらに樹脂組成物を含浸した上記ガラス布を
重ね合わせた。ついで、厚さが35μmである電解
銅箔を重ねた後、クリアランスが1.70mmに設定さ
れたロール間を通過させた後、110℃で10分間、
さらに130℃で1時間の条件で硬化させ、片面の
ポリエステルフイルムを剥離し、厚みが1.6mmで
ある銅張積層板を得た。
(比較例 1)
下記の樹脂組成物
樹脂(1) 100 部
ポリエステル(3) 50 部
スチレン 20 部
ベンゾイルパーオキサイド 1.7部
三酸化アンチモン 2 部
を、実施例1で用いたものと同じガラス布に含浸
させ、実施例1と同等の方法で、銅張積層板を得
た。厚みは約1.6mmであつた。
これら実施例および比較例の特性評価結果を第
1表に示す。
[Technical Field] This invention relates to a corrosion-resistant and heat-resistant resin composition with excellent flame retardancy. [Background technology] Thermosetting resins, especially radically polymerizable thermosetting resins such as unsaturated polyester resins, have a good balance in workability during molding, curability, and properties of cured products, and are active in various fields. As is widely known, it is used for In particular, when combined with reinforcing materials such as glass fiber to make FRP, it has excellent strength, corrosion resistance, and insulation properties, and because it does not rust, it is widely used in radar doors, tanks, pipes, ducts, weirs, insulating plates, cable pipes, etc. It is widely used. However, because it is organic, it has extremely low resistance to combustion, and as the demand for flame retardancy has grown stronger recently, its use has tended to be restricted from the standpoint of safety. I can't deny it. Therefore, many attempts have been made to improve the flame retardancy of the resin by introducing halogen atoms into the resin skeleton or adding various flame retardants, but at present, sufficient flame retardancy has not been achieved. If an attempt is made to impart such properties, for example, other properties such as corrosion resistance, heat resistance, and insulation properties may deteriorate, which is not necessarily satisfactory. [Object of the Invention] In view of the above circumstances, an object of the present invention is to provide a resin composition that can be imparted with flame retardancy without reducing the above-mentioned properties. [Disclosure of the Invention] As a result of intensive research to achieve the above object, the inventors have developed a resin composition that has flame retardancy, corrosion resistance, heat resistance, insulation, etc. by using a specific resin composition. He made this possible and completed this invention. That is, the present invention provides a bromine-containing epoxy poly(meth)acrylate (a) obtained by reacting a bromine-containing epoxy resin with an acid component containing (meth)acrylic acid as a main component, and having the following general formula (A). An alcohol component (a) containing at least 50 mol% of the compound () shown above and at least an α,β-unsaturated dicarboxylic acid and/or its anhydride ().
An unsaturated polyester (b) obtained by reacting an acid component (b) containing 50 mol%, a polymerizable unsaturated monomer (c), and a flame retardant additive (d) used as necessary.
(a), (b), (c) and (d) are respectively 100 parts by weight, 20-120 parts by weight, 30-150 parts by weight and 0-150 parts by weight.
50 parts by weight ratio, total bromine content 15-30
The gist of the resin composition is that 8 to 16% by weight of the resin composition is based on bromine-containing epoxy poly(meth)acrylate (a). General formula (A) [However, m and n are each independently an integer of 1 to 4 and satisfy the formula 2≦n+m≦5,
R 1 and R 2 are each independently an alkylene group having 2 to 3 carbon atoms, and may be different for each repeating unit shown in parentheses. ] Here, the bromine-containing epoxy resin has at least one epoxy group in one molecule, and the brome content is at least 15% by weight, preferably 35% by weight.
Refers to epoxy resins that are the above. Examples of such bromine-containing epoxy resins include tetrabromobisphenol A, tetrabromobisphenol F, brominated novolac resins, 1,1,3-tris(3,5-dibromo-4-hydroxyphenyl) There is an epoxy resin obtained by polycondensation of a bromine-containing polyphenol such as propane and epichlorohydrin. In addition, commercially available epoxy resins can be effectively used as these bromine-containing epoxy resins, such as Epiclon 152, 1120, 153-60M manufactured by Dainippon Ink and Chemicals Co., Ltd.; Epicort DX manufactured by Ciel Chemical Industry Co., Ltd. -248-B-
80, DX-245: Sumiepoxy ESB-340, ESB-400, ESB-500, ESB manufactured by Sumitomo Chemical Co., Ltd.
-700, ESB-715, etc. Among the bromine-containing epoxy resins, those having an epoxy equivalent of 600 or less are particularly preferred because they provide a good balance of physical properties when the resin composition of the present invention is used as a laminate. Brome-containing epoxy poly(meth)acrylate
(a) is obtained by reacting a bromine-containing epoxy resin with an acid component whose main component is (meth)acrylic acid. At this time, the ratio of the epoxy resin and acid component used is one carboxyl group per epoxy group (if the acid component contains an acid anhydride group, one acid anhydride group is considered to be two carboxyl groups). )0.7
~1.5 pieces. The acid component contains at least 60 mol% (meth)acrylic acid and optionally other carboxylic acids and/or carboxylic acid anhydrides. Preferred examples of these carboxylic acids and carboxylic acid anhydrides include phthalic acid, maleic acid,
Fumaric acid, succinic acid, adipic acid, bromphthalic acid, chlorphthalic acid, hectic acid, tetrahydrophthalic acid, 3,6-endomethylenetetrahydrophthalic acid, acetic acid, propionic acid, dibromopropionic acid, benzoic acid, bromobenzoic acid, chlorbenzoic acid Acids or their acid anhydrides. The bromine-containing epoxy resin and the acid component containing (meth)acrylic acid as a main component can be reacted in various ways. The most common method among these is to react the epoxy resin and the acid component with a catalyst such as triethylamine, trimethylbenzylammonium chloride, lithium chloride, etc., a stabilizer such as hydroquinone, catechol, picric acid, molecular oxygen, etc., and the necessary This is a method in which the reaction is carried out in the presence of a solvent such as toluene, styrene, or ethyl acetate at a temperature range of 70 to 150°C. In this case, the method of using styrene as a solvent is a particularly preferred method since it is not necessary to remove the solvent when using the bromine-containing epoxy poly(meth)acrylate (a) as a reaction product. The unsaturated polyester (b) consists of an alcohol component (a) containing at least 50 mol% of the compound () represented by the above general formula (A), and an α,β-unsaturated dicarboxylic acid and/or its anhydride ( ) is a reaction product with an acid component (b) containing at least 50 mol % of the acid component (b), and its molecular weight is usually preferably in the range of 500 to 10,000. If the amount of the compound () or α,β-unsaturated dicarboxylic acid and/or its anhydride () used is outside the above range, heat resistance and corrosion resistance will decrease, making it impossible to achieve the objectives of the present invention. I can't do it and I don't like it. Examples of the α,β-unsaturated dicarboxylic acid and/or its anhydride include maleic anhydride, fumaric acid, itaconic acid, and citraconic acid. Compounds other than the compound () used as the alcohol component (a) and compounds other than the α,β-unsaturated dicarboxylic acid and/or its anhydride () used as the acid component (b) include unsaturated polyester resins. Those known in the industry can be arbitrarily selected and used [for example, "Polyester Resin" by Eiichiro Takiyama, published by Nikkan Kogyo Shimbun (August 30, 1980, 9th edition), page 25, Table 2・Acids listed in 1(a) and alcohols listed in Table 2.1(b) on page 26 of the same). Unsaturated polyester (b) can be produced according to methods known in the art. For example, alcohol component (a) and acid component selected as above
This is a method in which (b) is subjected to dehydration condensation in a temperature range of 150 to 250°C in the presence or absence of a catalyst in an atmosphere of an inert gas such as nitrogen gas or carbon dioxide gas. Polymerizable unsaturated monomer (c) refers to a compound that is liquid at room temperature and has at least one vinyl unsaturated group in one molecule, such as styrene, vinyltoluene, divinylbenzene, α-methylstyrene, etc. ,
Aromatic vinyl compounds such as chlorostyrene: Vinyl acetate, vinyl esters such as divinyl adipate: Diallyl phthalate: Methyl (meth)acrylate, octyl (meth)acrylate, octyl (meth)acrylate, di(meth)acrylate
Examples include (meth)acrylic esters such as acryloxyethyl, and one or more of these compounds can be used.
Among these, styrene is particularly preferred because of its solvent performance, polymerization reactivity, and the like. In carrying out this invention, a flame retardant additive (d) can be used if necessary. Flame retardant additive (d)
Various known flame retardant additives can be used as the flame retardant additive, and representative examples include hexabromocyclododecane, hexabromobenzene, polybrominated biphenyl ether, heptabromotoluene, 2,2-bis [4-(2,3-dibromopropoxy)3,5-dibromophenyl]propane,
2,4,6-tribromophenol (meth)arylate, 2,4,6-tribromophenol glycidyl ether, brominated epoxy resin as mentioned above, tetrabromophthalic acid, tetrachlorofuric acid, hettic acid, perchloropenta Halogen flame retardants such as cyclodecane: trimethyl phosphate,
Triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, triphenyl phosphate, tricresyl phosphate, cresyl phenyl phosphate, octyl diphenyl phosphate, Tris (chloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (chloropropyl) phosphate, bis (2,3-dibromopropyl) 2,3-
Dichloropropyl phosphate, Tris(2,
Phosphate esters such as 3-dibromopropyl) phosphate, bis(chloropropyl)octyl phosphate, and triallylphosphate:
Antimony trioxide, etc. Among these, aromatic halogen compounds and aromatic phosphorus compounds that are soluble in resin liquids made of bromine-containing epoxy poly(meth)acrylate (a), unsaturated polyester (b), and polymerizable unsaturated polymer (c) are used. Acid esters, radically polymerizable halogen compounds, and radically polymerizable phosphoric acid esters are particularly preferable because the resin composition derived therefrom has a good balance of flame retardancy, heat resistance, water resistance, etc. The resin composition according to the present invention contains 20 to 120 parts by weight of unsaturated polyester (b) and 30 to 150 parts by weight of polymerizable unsaturated monomer (c) per 100 parts by weight of bromine-containing epoxy poly(meth)acrylate (a). parts by weight and, if necessary, a flame retardant additive (d). It is based on meth)acrylate(a). (a)
If the blending ratio of each component in ~(d) and the bromine content are out of the above range, the resulting balance of physical properties of the resin composition will be lost, and the resin composition will not have the desired physical properties. Unobtainable and undesirable. The resin composition according to the present invention can be cured in the same manner as ordinary unsaturated polyester resins, and curing means known in the unsaturated polyester resin industry can be used as is. For example, a method of heating in the presence of a curing agent such as an organic peroxide or a diazo compound, a method of blending an organic peroxide with an accelerator such as a metal soap or an amine compound, a method of heating in the presence of a photosensitive agent, It can be cured by a method of irradiating electromagnetic waves such as ultraviolet rays and electron beams. Hereinafter, the present invention will be explained in more detail by giving examples. In addition, "parts" in the examples generally indicate "parts by weight." (Reference Example 1) Epiclon 153 (manufactured by Dainippon Ink & Chemicals Co., Ltd., brominated epoxy resin, epoxy equivalent: 395,
Bromine content 49.1% by weight) 395 parts, hydroquinone 0.1 part, triethyleneamine 2.0 parts, styrene
200 parts of acrylic acid and 72 parts of acrylic acid were charged and reacted for 11 hours at a temperature range of 90 to 100°C while introducing air to obtain a resin liquid (by weight) consisting of 70% by weight of bromine-containing epoxy polyacrylate with an acid value of 4.2 and 30% by weight of styrene. (hereinafter referred to as resin (1)) was obtained. (Reference Example 2) The same procedure was used as in Reference Example 1, except that 86 parts of methacrylic acid was used instead of 72 parts of acrylic acid, and 206 parts of styrene was used instead of 200 parts of styrene. A resin liquid (hereinafter referred to as resin (2)) consisting of 70% by weight of bromine-containing epoxy polymethacrylate and 30% by weight of styrene was obtained. (Reference Example 3) A reaction product of 1 mol of bisphenol A and 2.1 mol of propylene oxide (residual phenolic hydroxyl group concentration 120 ppm , alcoholic hydroxyl group concentration
5.7 equivalents/Kg) (hereinafter referred to as BPA-2.1PO) and 98 parts of maleic anhydride were added and reacted under a nitrogen stream at 200°C until the acid value reached 38 to obtain polyester (1). . (Reference Example 4) Polyester with an acid value of 33 ( 2) was obtained. (Reference example 5) 111 parts of diethylene glycol, isophthalic acid
An unsaturated polyester with an acid value of 21 (hereinafter referred to as polyester (3)) 217 was prepared in the same manner as in Reference Example 3 using 66.4 parts of adipic acid, 29.2 parts of adipic acid, and 46.4 parts of fumaric acid.
I got the department. (Example 1) The following resin composition Resin (1) 100 parts Polyester (1) 50 parts Styrene 20 parts Benzoyl peroxide 1.7 parts Antimony trioxide 2 parts was mixed with glass cloth (WE-18K manufactured by Nittobo Co., Ltd.)
BS), and stacked 8 sheets of impregnated glass cloth, and then layered electrolytic copper foil with a thickness of 18 μm on both sides to obtain a clearance of 1.60.
The film was passed between rolls of 1.5 mm in diameter, and then cured at 90°C for 15 minutes and then at 120°C for 1 hour. The thickness of the obtained copper-clad laminate was approximately 1.6 mm. (Example 2) The following resin composition resin (1) 100 parts polyester (2) 50 parts diallyl phthalate 40 parts benzoyl peroxide 1.9 parts tricresyl phosphate 2 parts was mixed with glass cloth (Nittobo Co., Ltd. WE). ―18K―
A glass nonwoven fabric impregnated with a resin composition (manufactured by Nippon Vilene Co., Ltd.) was placed on an electrolytic copper foil with a thickness of 35 μm.
Ep-4050NV) are stacked together, the above-mentioned glass cloth impregnated with the resin composition is stacked, and an electrolytic copper foil with a thickness of 35 μm is stacked on top of that, and then between the rolls with a clearance of 1.65 mm, After passing through, a copper clad laminate with a thickness of 1.6 mm was formed by heating and pressing at 10 kg/cm 2 at 100° C. for 60 minutes. (Example 3) The following resin composition Resin (2) 100 parts Polyester (1) 50 parts Styrene 30 parts Benzoyl peroxide 1.8 parts Tricresyl phosphate 2 parts were added to the same glass as used in Example 1. A cloth was impregnated, 8 sheets of the impregnated glass cloth were layered, and electrolytic copper foil with a thickness of 18 μm was layered on both sides of the cloth, passed between rolls with a clearance of 1.60 mm, and then heated at 90℃ for 30 minutes. The molding was carried out under heat and pressure conditions of 5 kg/cm 2 for 1 minute, and then heated at 150° C. for 15 minutes to obtain a copper-clad laminate having a thickness of 1.6 mm. (Example 4) The same glass cloth used in Example 1 was impregnated with the following resin composition Resin (2) 100 parts Polyester (2) 40 parts Styrene 20 parts Benzoyl peroxide 1.6 parts Antimony trioxide 2 parts Then, it was placed on a polyester film (Lumirror, manufactured by Toray Industries, Inc.) with a thickness of 100 μm, and then two sheets of the same glass nonwoven fabric impregnated with a resin composition as used in Example 2 were superimposed on this. Furthermore, the above-mentioned glass cloth impregnated with the resin composition was laminated on top of each other. Next, after layering electrolytic copper foil with a thickness of 35 μm, it was passed between rolls with a clearance of 1.70 mm, and then heated at 110°C for 10 minutes.
It was further cured at 130° C. for 1 hour, and the polyester film on one side was peeled off to obtain a copper-clad laminate with a thickness of 1.6 mm. (Comparative Example 1) The same glass cloth used in Example 1 was impregnated with the following resin composition Resin (1) 100 parts Polyester (3) 50 parts Styrene 20 parts Benzoyl peroxide 1.7 parts Antimony trioxide 2 parts A copper-clad laminate was obtained in the same manner as in Example 1. The thickness was approximately 1.6 mm. Table 1 shows the characteristics evaluation results of these Examples and Comparative Examples.
【表】【table】
この発明にかかる樹脂組成物は、難燃性で、し
かも耐蝕性、耐熱性、絶縁性等に優れているた
め、種々の用途において有効に利用することがで
きる。特に、タンク、パイプ、ダクト等において
は難燃性、耐蝕性および耐熱性が有効に作用し、
ケーブルパイプ、スイツチボツクス、絶縁板等に
おいては難燃性、耐蝕性、耐熱性および絶縁性等
が極めて有効に作用するので、これらは特に好ま
しい使用形態である。
The resin composition according to the present invention is flame retardant and has excellent corrosion resistance, heat resistance, insulation properties, etc., and therefore can be effectively used in various applications. In particular, flame retardancy, corrosion resistance, and heat resistance are effective for tanks, pipes, ducts, etc.
Cable pipes, switchboxes, insulating plates, etc. have particularly effective flame retardancy, corrosion resistance, heat resistance, insulation properties, etc., and are therefore particularly preferred forms of use.
Claims (1)
酸を主成分とする酸成分とを反応させて得られる
ブロム含有エポキシポリ(メタ)アクリレート
(a)、下記の一般式(A)で示される化合物()を少
なくとも50モル%含有してなるアルコール成分(イ)
とα,β―不飽和ジカルボン酸および/またはそ
の無水物()を少なくとも50モル%含有してな
る酸成分(ロ)とを反応させて得られる不飽和ポリエ
ステル(b)、重合性不飽和単量体(c)、および必要に
より用いられる難燃添加剤(d)からなり、(a),(b),
(c)および(d)がそれぞれ100重量部、20〜120重量
部、30〜150重量部および0〜50重量部の比率で
あり、全ブロム含有量が15〜30重量%でしかもそ
の内の8〜16重量%はブロム含有エポキシポリ
(メタ)アクリレート(a)に基づくものであること
を特徴とする樹脂組成物。 ―記― 一般式(A) 〔ただし、m,nはそれぞれ独立して1〜4の
整数でかつ2≦n+m≦5の式を満すものであ
り、R1,R2はそれぞれ独立して炭素数2〜3の
アルキレン基でかつ括弧で示された繰返し単位ご
とに異つていてもよい。〕[Claims] 1. Brome-containing epoxy poly(meth)acrylate obtained by reacting a bromine-containing epoxy resin with an acid component containing (meth)acrylic acid as a main component.
(a), an alcohol component (a) containing at least 50 mol% of the compound () represented by the following general formula (A);
and an acid component (b) containing at least 50 mol% of α,β-unsaturated dicarboxylic acid and/or its anhydride (b), a polymerizable unsaturated monomer (a), (b),
(c) and (d) are in proportions of 100 parts by weight, 20 to 120 parts by weight, 30 to 150 parts by weight, and 0 to 50 parts by weight, respectively, and the total bromine content is 15 to 30 parts by weight, and A resin composition characterized in that 8 to 16% by weight is based on bromine-containing epoxy poly(meth)acrylate (a). -Note- General formula (A) [However, m and n are each independently an integer of 1 to 4 and satisfy the formula 2≦n+m≦5, and R 1 and R 2 are each independently an alkylene group having 2 to 3 carbon atoms. and may be different for each repeating unit indicated in parentheses. ]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19317683A JPS6084350A (en) | 1983-10-14 | 1983-10-14 | Resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19317683A JPS6084350A (en) | 1983-10-14 | 1983-10-14 | Resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6084350A JPS6084350A (en) | 1985-05-13 |
JPS6225685B2 true JPS6225685B2 (en) | 1987-06-04 |
Family
ID=16303563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19317683A Granted JPS6084350A (en) | 1983-10-14 | 1983-10-14 | Resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6084350A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6274913A (en) * | 1985-09-27 | 1987-04-06 | Kanegafuchi Chem Ind Co Ltd | Curable resin composition |
DE68925745T2 (en) * | 1988-04-04 | 1996-10-02 | Hitachi Chemical Co Ltd | Electrical laminate made by using special thermosetting resin compositions |
US5238730A (en) * | 1988-04-04 | 1993-08-24 | Hitachi Chemical Company, Ltd. | Electrical laminate with dibasic acid-modified epoxy (meth)acrylate |
AU2001243244A1 (en) * | 2000-03-15 | 2001-09-24 | Cpfilms, Inc. | Flame retardant optical films |
CN109401260A (en) * | 2018-09-30 | 2019-03-01 | 濮阳市盛源石油化工(集团)有限公司 | A kind of corrosion-resistant halogen-free flameproof unsaturated polyester resin and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4931787A (en) * | 1972-05-25 | 1974-03-22 | ||
JPS53136083A (en) * | 1977-05-04 | 1978-11-28 | Toyobo Co Ltd | Production of flame-retardant metallized laminate |
JPS5486A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Chem Co Ltd | Manufacture of copper-clad laminate |
-
1983
- 1983-10-14 JP JP19317683A patent/JPS6084350A/en active Granted
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4931787A (en) * | 1972-05-25 | 1974-03-22 | ||
JPS53136083A (en) * | 1977-05-04 | 1978-11-28 | Toyobo Co Ltd | Production of flame-retardant metallized laminate |
JPS5486A (en) * | 1977-06-03 | 1979-01-05 | Hitachi Chem Co Ltd | Manufacture of copper-clad laminate |
Also Published As
Publication number | Publication date |
---|---|
JPS6084350A (en) | 1985-05-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4954304A (en) | Process for producing prepreg and laminated sheet | |
KR920009903B1 (en) | Curable resin composition with a thiuram and a copper compound as storage stabilizer | |
JP3288143B2 (en) | Thermosetting resin molding material and artificial marble comprising the molding material | |
JPS6225685B2 (en) | ||
AU595422B2 (en) | Improved resin for marine applications | |
JP4253092B2 (en) | Method for producing radically polymerizable resin composition | |
KR101685499B1 (en) | Unsaturated polyester resin having high elongation and rigidity modulus and the method of manufacturing the same | |
JPH0414691B2 (en) | ||
CN111995755A (en) | Vinyl ester flame-retardant resin containing polyester structure and preparation method thereof | |
GB2038856A (en) | Low viscosity unsaturated polyester resins | |
JP2003040954A (en) | Radical-polymerizable resin composition | |
EP1132429B1 (en) | Unsaturated polyester resin compositions | |
JP4768161B2 (en) | Radical polymerizable resin composition | |
JPH0236218A (en) | Thermosetting resin composition and laminated sheet for electric use | |
JP3321078B2 (en) | Resin composition and cured resin | |
JP3157944B2 (en) | Metal foil-clad laminate for electricity | |
JPS60161414A (en) | Preparation of unsaturated epoxy resin composition having improved shelf stability | |
JPS61275347A (en) | Unsaturated polyester resin composition and laminated sheet | |
JPH0615662B2 (en) | Flame-retardant unsaturated polyester resin composition | |
JP2001354737A (en) | Curable resin composition and cured article | |
JP2000297138A (en) | Flame-retardant resin composition and laminated sheet using same | |
JP2000309697A (en) | Flame-retardant unsaturated polyester, resin containing the same, and cured product thereof | |
JP2000344846A (en) | Radical-curing flame-retardant resin composition | |
JPH0228212A (en) | Thermosetting resin composition and electrical laminate sheet | |
JPH0529548B2 (en) |