JPS62252210A - Method and device for producing continuously printed circuit board - Google Patents

Method and device for producing continuously printed circuit board

Info

Publication number
JPS62252210A
JPS62252210A JP9487886A JP9487886A JPS62252210A JP S62252210 A JPS62252210 A JP S62252210A JP 9487886 A JP9487886 A JP 9487886A JP 9487886 A JP9487886 A JP 9487886A JP S62252210 A JPS62252210 A JP S62252210A
Authority
JP
Japan
Prior art keywords
tank
bath
hanger rack
rack
continuous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9487886A
Other languages
Japanese (ja)
Inventor
Mamoru Ogaki
小垣 守
Tadayoshi Hayakawa
早川 忠佳
Toyoki Motai
豊樹 馬渡
Fumio Takemura
武村 文夫
Masaki Imanishi
正樹 今西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUKU KK
Original Assignee
METSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUKU KK filed Critical METSUKU KK
Priority to JP9487886A priority Critical patent/JPS62252210A/en
Publication of JPS62252210A publication Critical patent/JPS62252210A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0085Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor

Landscapes

  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To reduce the installation area of the whole of a device, by constituting a device of a string of consecutive baths arranged in series, suspending a board material to be processed at a hanger rack, and performing the process of the bath one by one in order from one side. CONSTITUTION:A guide rail 2 is provided horizontally at the upper side of a consecutive bath 1, and a hanger rack 3 is moved intermittently in a constant cycle along the guide rail 2. The hanger rack 3 repeats a sequence that it lowers and processes a board material 4 hung at the rack in the bath at every movement, and after that, raises the material, and moves to the next bath. In other words, the device is constituted so that a self-advancing mechanism, and an elevation mechanism are provided in the device, and the board material is moved and raised and elevated cyclically by every unit bath by an appropriate driving control mechanism, for example, the program control of a microcomputer, thereby, a large number of printed circuit boards can be manufactured continuously. The remarkable narrow width of the bath in the arranging direction of each bath is permitted, therefore, the whole length of a string of consecutive baths can be shortened.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント配線基板、特に銅スルーホールプリ
ント配線基板を連続的に製造する方法お工び装置に関す
るものマある。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method and apparatus for continuously manufacturing printed wiring boards, particularly copper through-hole printed wiring boards.

〔従来の技術〕[Conventional technology]

銅スルーホールプリント配線基板は、基板材料に銅箔お
よび一次鋼メツキを施こし、所要部分に錫、ハンダ、ニ
ッケルなどをメッキしていわゆるレジストを設け、次い
!腐食液中を通してエツチングを行ったのち、これらレ
ジスト金属を剥離して鋼スルーホールを仕上げるもので
あって、この鋼スルーホールを有することによりプリン
ト回路が品質的に安定し、かつ精密・ぞターンを得るの
に適するとされている。
Copper through-hole printed wiring boards are made by applying copper foil and primary steel plating to the board material, plating the required areas with tin, solder, nickel, etc. to provide a so-called resist, and then! After etching in a corrosive solution, these resist metals are peeled off to finish the steel through-holes.The steel through-holes ensure that the quality of the printed circuit is stable and that it can be precisely turned. It is said to be suitable for obtaining

従来、エツチング後、レジスト金属を剥離して銅スルー
ホールを得る上記のような従来の方法を用いてプリント
配線基板を連続的に製造するには、例えば、−次鋼めっ
きを施した基板材料を、メッキ槽の上方を一定速度f移
動するラックに吊持して縦列状態!メッキ槽中を通し、
二次鋼メッキおよびメタルレジストメッキを行ったのち
、この基板材料をラックからはずし、水平に保持しなが
ら移動して次に銅エツチング工程を行っている。このエ
ツチング工程は上下から腐食液をスプレーするもの11
次いで水洗、乾燥ののち、メタ)v v )ストメッキ
部分を剥離する。こ牡らの操作には中間に投入機、受取
機、連結コンベヤ等の装置が用いらnている。
Conventionally, after etching, the resist metal is peeled off to obtain copper through holes. In order to continuously manufacture printed wiring boards using the above-mentioned conventional method, for example, a board material with -2 steel plating is used. , suspended from a rack that moves at a constant speed f above the plating tank and arranged in tandem! Pass through the plating tank,
After performing secondary steel plating and metal resist plating, the substrate material is removed from the rack and moved while being held horizontally, followed by a copper etching process. This etching process involves spraying a corrosive liquid from above and below11.
After washing with water and drying, the plated portion is peeled off. Intermediate devices such as a feeding machine, a receiving machine, and a connecting conveyor are used to operate these machines.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

しかし、上記したような従来の方法においては、二次鋼
メッキおよびメタルレジストメッキを行う装置、鋼エツ
チング装置、メタルレジストメッキ部分の剥離装置なら
びにこれら装置に付随する水洗装置等を個別に設けろた
め、こnらを連絡する搬送機構や作業人員が必要であり
、かつ処理時間が増大する欠点があり、さらにこのよう
なメッキ装置↑は基板材料をその表裏面が進行方向に沿
う工うに一列に並べて一定速度↑移動させる形式!ある
ため、メッキ槽の長さが着るしく長大となって設備面積
に無駄が多いなどの不利がある。
However, in the conventional method as described above, a device for performing secondary steel plating and metal resist plating, a steel etching device, a device for stripping the metal resist plated portion, and a water washing device accompanying these devices are required to be installed separately. A transport mechanism and workers are required to communicate between these devices, and the processing time increases.Furthermore, such plating equipment has the disadvantage that the front and back surfaces of the substrates are lined up in a row along the direction of travel. A format that moves at a constant speed ↑! Therefore, there are disadvantages such as the length of the plating tank becoming unnecessarily long and the area of the equipment being wasted.

〔問題点を解決するための手段〕 このためには、上記各装置を直列に並べた一連の連続槽
゛に形底するとともに、処理すべき基板材料をハンガー
ラックvcFd持して、これを一方から各槽体に順次処
理して行けばよく、しかも、この場合基板材料を槽体の
配列方向に対して直交する方向に保持して各処理を行え
ば、各槽体の配列方向に対する槽幅は極めて狭い巾!よ
く、したがって一連の連続槽の全長を短かくすることが
1きる。
[Means for solving the problem] For this purpose, each of the above-mentioned devices is arranged in series in a series of continuous tanks, and the substrate material to be processed is held on a hanger rack vcFd. It is sufficient to sequentially process each tank body from is extremely narrow! Therefore, it is possible to shorten the total length of a series of continuous tanks.

本発明は上記の点に着目して開発したもの!あって、本
発明を実施する装置の一例を図面について以下に説明す
る。
The present invention was developed focusing on the above points! An example of an apparatus for implementing the present invention will be described below with reference to the drawings.

〔発明の実施例〕[Embodiments of the invention]

第1図において、1は連続槽″′1%あって、多数の槽
a・・・、b・・・、C・・・、d・・・等を一列に並
べた連続槽として集成されている。この場合、槽a群は
図の左方りり脱脂、水洗、酸洗などの前処理を行う槽1
あり、槽す群は二次鋼メッキ槽、槽C群は水洗、酸洗な
どの前処理槽、槽d群はメタルレジストメッキ槽、以下
前処理槽、エツチング槽など一連の工@を行うべき各種
が配置されている。この場合、第2図に明らかなように
槽a、Cなどは連続槽1の長手方向に沿う長さが横方向
の長さに比べて短かい矩形状横断面を有しているが、槽
b・dなどはほば正方形状横断面を有している。こnは
基板材料を各槽f順次処理して行く際、槽す。
In Figure 1, 1 is a continuous tank ''1%, which is assembled as a continuous tank in which a large number of tanks a..., b..., C..., d..., etc. are arranged in a row. In this case, tank a group is tank 1, which performs pretreatment such as degreasing, water washing, and pickling, from the left side of the figure.
Yes, the tank group is a secondary steel plating tank, the tank C group is a pre-treatment tank such as water washing and pickling, and the tank D group is a metal resist plating tank.A series of processes such as pre-treatment tank and etching tank should be performed below. Various types are arranged. In this case, as is clear from FIG. 2, tanks a, C, etc. have rectangular cross sections whose length along the longitudinal direction of the continuous tank 1 is shorter than the length in the lateral direction. B, d, etc. have a nearly square cross section. This is done when the substrate material is sequentially processed in each tank.

d−1’は%に処理時間を長く取るため1あって、この
槽fは基板材料は槽ah  C工りも長時間にわたり必
要な処理を受ける工うになっている。
d-1' is 1 in order to take a longer processing time, and in this tank f, the substrate material is subjected to the necessary treatment for a longer time than in tank ah C.

連続槽1の上方には案内レール2が水平に設けらn、こ
の案内レール2に沿ってハンガーラック3が一定周期マ
間欠的に移動するようになっている。このハンガーラッ
ク3は、移動するたびにこnに吊持されている基板材料
4を槽内に下降して処理し、次いで引き上げて次の槽に
移動するという順序を繰り返すLうになっている。つま
り自走機構と昇降機構を備え、適宜の駆動制御機構、例
tld’マイクロコンピュータ−によるプログラム制御
により基板材料を各単位槽毎に周期的に移動かつ昇降さ
せて、多数のプリント配線板を連続的に製造することが
1きる。
A guide rail 2 is provided horizontally above the continuous tank 1, and a hanger rack 3 is moved intermittently at a constant period along this guide rail 2. Each time the hanger rack 3 is moved, the suspended substrate material 4 is lowered into the tank for processing, and then lifted up and moved to the next tank, repeating the sequence. In other words, it is equipped with a self-propelled mechanism and an elevating mechanism, and is capable of periodically moving and elevating the substrate material in each unit tank under program control by an appropriate drive control mechanism, such as a tld' microcomputer, to continuously fabricate a large number of printed wiring boards. It is possible to manufacture the product in a specific manner.

なおwc4図は、上記実施例における連続槽1の前記エ
ツチング槽およびメタルレジスト剥離槽の内部を示して
いる。すなわち、この槽の上方に来た基板材料4はノ・
ンガーラツクの昇降機構を介して、この槽内マ処理され
るのであるが、槽内には多数の小孔を黒膜した箱型Jネ
ル5.5が対設され、槽内のエツチング液あるいは剥離
液がポンプ6を介して、この小孔から噴射循環されろよ
うになってbる。その結果基板材料4は表裏両面より処
理液の噴射を受けるの1、ムラのない確実なエツチング
あるいは剥離が行われる。
Note that FIG. wc4 shows the inside of the etching tank and metal resist stripping tank of the continuous tank 1 in the above embodiment. In other words, the substrate material 4 that has come above this tank is
The machining inside this tank is carried out via the lift mechanism of the nail rack. Inside the tank, there is a box-shaped J channel 5.5 with a black coating with many small holes installed, and the etching solution or peeling inside the tank is installed. Liquid is then injected and circulated through this small hole via the pump 6. As a result, the substrate material 4 is sprayed with the processing liquid from both the front and back surfaces, and is etched or peeled evenly and reliably.

次に、第5図は第1図の実施例の他の一例を示すもの1
ある。すなわち第5図において、連続槽IKついては第
1図と同様1あるが、その上方に設けられた案内レール
2は連続槽1を越えて前後に延長して設けられており、
この案内レールに係合して間欠的に移動する多数のハン
ガーラック3は、共働して一連の長い棒体3′を昇降す
るようになっており、この棹体6′には各種の配列ピッ
チと等しい一定のぎフチ1多数の基板材料4が吊下げ取
付けらnている。また、槽すは複数個の槽aを連設し、
基板材料は各単位槽aを通過し、その結果槽すでの処理
に必要な処理時間が得られるようになっている。
Next, FIG. 5 shows another example of the embodiment shown in FIG. 1.
be. That is, in FIG. 5, there is one continuous tank IK as in FIG. 1, but the guide rail 2 provided above it extends back and forth beyond the continuous tank 1.
A large number of hanger racks 3 that engage with this guide rail and move intermittently work together to raise and lower a series of long rods 3', and these rods 6' have various arrangements. A number of substrate materials 4 are suspended from a fixed gap 1 equal to the pitch. In addition, the tank is a series of multiple tanks a,
The substrate material passes through each unit tank a, so that the processing time required for processing in the tank is obtained.

この結果、第5図に示す装置1は、ハンガーラック3の
作動にエリ、連続槽1の各槽中には同時に多数の基板材
料4が処理され、こnら各基板材料4は、対応する槽内
↑それぞれ所要の作用を施されつつ、順次隣りの槽に移
動して行くのfあり。
As a result, the apparatus 1 shown in FIG. Inside the tank ↑, each one is given the required action and then moved to the next tank one after another.

こうしてハンガーラック301回の昇降ごとに、完成さ
れた基板が連続的に得られる。
In this way, completed substrates are continuously obtained every time the hanger rack 301 is raised and lowered.

〔作用効果〕[Effect]

本発明は以上の構成よりなるものであって、所要の工程
を一連の槽群結合体として形成した連続槽1に、処理す
べき基体材料4を昇降しつつ間欠的に移動するハンガー
ラック6に連続槽1の長手方向に対し直交方向に保持さ
せて、順次、各処理槽を通過させるもの1あるから、従
来の装置のような中間的作業が全く不要となり、しかも
装置全体の設置面積が減少し、その上、ノ・ンガーラツ
ク3に対するメッキ液や剥離液の付着は取扱う基板材料
4と同様に行われるの1、たとえI・ンガーラツクにメ
ッキ液が付着しても以下の工程!メッキの剥離が行わn
、ることになり、最後は元の状態となり、従来のように
、各工程におけるハンガーラックの付着物を絶えず除去
する等の手間が不必要fあるなど、多くの利点がある。
The present invention has the above-mentioned configuration, and the necessary processes are carried out in a continuous tank 1 formed as a series of combined tank groups, and in a hanger rack 6 that moves intermittently while raising and lowering the substrate material 4 to be treated. Since there is one device that is held perpendicular to the longitudinal direction of the continuous tank 1 and passes through each treatment tank in sequence, there is no need for any intermediate work like in conventional equipment, and the installation area of the entire equipment is reduced. Moreover, the plating solution and stripping solution are attached to the coating rack 3 in the same way as the substrate material 4 to be handled. The plating is peeled off.
As a result, the hanger rack returns to its original state at the end, and there are many advantages, such as eliminating the need to constantly remove deposits from the hanger rack at each step, as in the conventional method.

【図面の簡単な説明】[Brief explanation of drawings]

図面は、本発明における装置の実施例を示し、第1図は
側面図、第2図は正面図、第3図は槽体群の平面図、第
4図は槽体群の中の槽体の内部の一例を示す斜面図、第
5図は@1図の他の一例を示す側面図″t’ある。 1・・・連続槽、2・・・案内レール、6・・・ハンガ
ーラック、3′・・・棒体、4・・・基板材料。 (ほか2名)  −
The drawings show an embodiment of the apparatus according to the present invention; FIG. 1 is a side view, FIG. 2 is a front view, FIG. 3 is a plan view of a tank group, and FIG. 4 is a tank in the tank group. Fig. 5 is a side view "t' showing another example of the interior of Fig. 1. 1... Continuous tank, 2... Guide rail, 6... Hanger rack, 3'...rod, 4...substrate material. (2 other people) -

Claims (1)

【特許請求の範囲】 1、一定周期で間欠的に移動して昇降するハンガーラッ
クに処理すべき基板材料を吊持し、この基板材料を上記
周期に対応して分割された多数の処理槽よりなる槽群結
合体の各槽内で順次処理することを特徴とするプリント
配線基板の連続製造方法。 2、一定周期に対応して分割され一連の工程に対応して
配列された多数の槽からなる連続槽、および基板材料の
前面を連続槽の長手方向に直交して吊持しかつ該連続槽
の上方に設けられた案内レールに係合して前記周期で間
欠的に移動するハンガーラックを備えたことを特徴とす
るプリント配線基板の連続製造装置。
[Claims] 1. The substrate material to be processed is suspended on a hanger rack that moves up and down intermittently at a constant cycle, and the substrate material is transferred from a number of processing tanks divided according to the above-mentioned cycle. 1. A continuous manufacturing method for printed wiring boards, characterized in that processing is carried out sequentially in each tank of a combination of tank groups. 2. A continuous tank consisting of a large number of tanks divided in accordance with a certain period and arranged corresponding to a series of processes, and a continuous tank in which the front surface of the substrate material is suspended orthogonally to the longitudinal direction of the continuous tank. 1. A continuous manufacturing apparatus for printed wiring boards, comprising a hanger rack that engages with a guide rail provided above and moves intermittently at the above-described period.
JP9487886A 1986-04-25 1986-04-25 Method and device for producing continuously printed circuit board Pending JPS62252210A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9487886A JPS62252210A (en) 1986-04-25 1986-04-25 Method and device for producing continuously printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9487886A JPS62252210A (en) 1986-04-25 1986-04-25 Method and device for producing continuously printed circuit board

Publications (1)

Publication Number Publication Date
JPS62252210A true JPS62252210A (en) 1987-11-04

Family

ID=14122309

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9487886A Pending JPS62252210A (en) 1986-04-25 1986-04-25 Method and device for producing continuously printed circuit board

Country Status (1)

Country Link
JP (1) JPS62252210A (en)

Similar Documents

Publication Publication Date Title
US4371422A (en) Continuous processing of printed circuit boards
US4534843A (en) Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
DE3543286A1 (en) METHOD FOR METALLIZING SURFACES OF FLAT OBJECTS
EP0376222B1 (en) Process and apparatus for electrophoretically painting small bulk objects
DE102007026633A1 (en) Apparatus and method for the electrolytic treatment of plate-shaped goods
CA2250020A1 (en) Method and device for the electrochemical treatment with treatment liquid of an item to be treated
EP0622125B1 (en) Fluid treatment apparatus
US4378281A (en) High speed plating of flat planar workpieces
JPS63305590A (en) Manufacturing device of substrate used for printed wiring plate
KR970073249A (en) MANUFACTURING LINE FOR MULTI-LAYERED PRINTED CIRCUIT BOARD
JPS62252210A (en) Method and device for producing continuously printed circuit board
CN206970715U (en) A kind of chemical nickel and gold production line
EP0216086A2 (en) Automatic conveying and handling device for articles, especially printed circuit boards
US4511448A (en) Plating apparatus
JPH0433880B2 (en)
US4394241A (en) High speed plating of flat planar workpieces
US2820754A (en) Method of plating
ITPD970054A1 (en) DEVICE FOR TRANSFER OF PIECES FOR A SURFACE TREATMENT PLANT
DE2610032C3 (en) Device for cleaning the surface of copper-clad layers of printed circuit boards
KR102057507B1 (en) Plating system
JPH01120888A (en) Manufacture of substrate for printed wiring board
ATE42972T1 (en) DEVICE AND METHOD FOR ELECTRICAL METAL PLATING.
US4378282A (en) High speed plating of flat planar workpieces
KR20220002013U (en) Continuous electroplating process chamber system
KR930006496B1 (en) Plating apparatus of conveyer type with used copper sulfate