JPS62250163A - Method for plating copper-base member with noble metal by means of laser - Google Patents
Method for plating copper-base member with noble metal by means of laserInfo
- Publication number
- JPS62250163A JPS62250163A JP9512186A JP9512186A JPS62250163A JP S62250163 A JPS62250163 A JP S62250163A JP 9512186 A JP9512186 A JP 9512186A JP 9512186 A JP9512186 A JP 9512186A JP S62250163 A JPS62250163 A JP S62250163A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- copper
- noble metal
- laser
- based member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000510 noble metal Inorganic materials 0.000 title claims abstract description 15
- 238000007747 plating Methods 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 30
- 239000007789 gas Substances 0.000 claims abstract description 20
- 239000000843 powder Substances 0.000 claims abstract description 14
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 239000011261 inert gas Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 39
- 229910052802 copper Inorganic materials 0.000 claims description 39
- 239000010949 copper Substances 0.000 claims description 39
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 19
- 239000010970 precious metal Substances 0.000 claims description 15
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 abstract description 4
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000011247 coating layer Substances 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 description 11
- 239000004332 silver Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- 230000000873 masking effect Effects 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- -1 and furthermore Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C24/00—Coating starting from inorganic powder
- C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
- C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
- C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
- C23C24/106—Coating with metal alloys or metal elements only
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、レーザを用いて銅系部材の表面に例えば銀
などの貴金属をプレーティングする方法に関するもので
ある。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method of plating a noble metal such as silver on the surface of a copper-based member using a laser.
銅系部材の表面に貴金属９例えば銀をル−ティングする
方法として、従来は電気めっきなどの電気化学反応によ
る方法が行なわれていた。この電気めっき法では、めっ
きする部材が複雑な形状をしていたり、大きな部材の一
部に小面積のめっきを施す場合には、めっきを必要とす
る部分以外にめっき防止用のマスクを施す必要があった
うこのマスクを施す作業をマスキングと呼ぶが、めっき
工程前にマスキングを行い、めっきが終了した後このマ
スクを取り除く作業が必要となる。これによって工程が
煩雑になるばかりでなく、人手がかかるため、製造コス
トがかさみ、改善が望まれていた。Conventionally, as a method for routing a noble metal 9 such as silver onto the surface of a copper-based member, a method using an electrochemical reaction such as electroplating has been used. With this electroplating method, if the part to be plated has a complex shape or if a small area is to be plated on a part of a large part, it is necessary to apply a mask to prevent plating on areas other than those that require plating. Masking is the process of applying a mask to the area where the metal is present, but it is necessary to perform masking before the plating process and to remove this mask after plating is complete. This not only complicates the process but also requires labor, which increases manufacturing costs, and improvements have been desired.
また、鉄系材料にＮｉやＯｒなどの金属をプレーティン
グする方法として、レーザを用いたものが特開昭５７−
１５５３６３号公報に記載されているつところが、銅系
部材は酸化しやすく、銅、銀、金などの貴金属のレーザ
ビーム吸収率は鉄系材料に比べて著１−＜低く、さらに
銅系部材は高い熱伝導率を有する。このため、レーザを
用いた従来の方法では、銅系部材のプレーティング部に
酸化皮膜が形成され２均一な貴金属皮膜によるプレーテ
ィングができない。In addition, as a method for plating metals such as Ni and Or on iron-based materials, a method using a laser was published in JP-A-57-
As stated in Publication No. 155363, copper-based members are easily oxidized, and the laser beam absorption rate of precious metals such as copper, silver, and gold is significantly lower than that of iron-based materials, and furthermore, copper-based members are Has high thermal conductivity. For this reason, in the conventional method using a laser, an oxide film is formed on the plating portion of the copper-based member, making it impossible to plate with a uniform precious metal film.
従来の銅系部材の貴金属プレーティング方法は以とのよ
うに構成されているので、工程が煩雑であるという問題
点があった。また、レーザによるプレーティング方法で
は均一に貴金属プレーティングできないという問題点が
あった０
この発明は上記のような問題点を解消するためになされ
たもので、マスキングの工程を必要とせず工程を簡略化
でき、さらに均一な貴金属グレーティングかでさるレー
ザによる銅系部材の貴金属プレーティング方法を得るこ
とを目的とするう〔問題点を解決するための手段〕
この発明に係るレーザによる銅系部材の貴金属プレーテ
ィング方法は、銅系部材のプレーティング部に還元性雰
囲気ガスを吹きりはてプレーティング部の酸化皮膜を除
去する工程、プレーティング部に貴金属粉体を供給する
工程、及び貴金属粉体が供給されたプレーティング部に
レーザビームを照射（−て銅系部材にプレーティングを
行う工程を施すものである。The conventional noble metal plating method for copper-based members is configured as described below, and therefore has a problem in that the process is complicated. In addition, the laser plating method had the problem that precious metal plating could not be done uniformly. This invention was made to solve the above problems, and it simplifies the process without requiring a masking process. It is an object of the present invention to provide a method for plating a copper-based member with a precious metal using a laser, which enables the formation of a more uniform precious metal grating. The plating method includes a step of blowing a reducing atmosphere gas onto the plating portion of a copper-based member to remove the oxide film on the plating portion, a step of supplying noble metal powder to the plating portion, and a step of supplying noble metal powder to the plating portion. This process involves irradiating the supplied plating portion with a laser beam to plate the copper-based member.
この発明における還元性雰囲気ガスは、銅系部材のプレ
ーティング部の酸化皮膜を除去し、これと共に賞金用粉
体を供給し、レーザを照射Ｉ２てグレーティングを行う
。The reducing atmosphere gas in this invention removes the oxide film on the plating part of the copper-based member, supplies the prize powder together with it, and performs grating by irradiating the laser I2.
この発明によるレーザによる銅系部材の貴金属プレーテ
ィング方法の一実施例を図について説明する。第１図（
ａ）はこの発明の一実施例に係るプレーティング部の構
成図であり、第１図（ｂ）はプレーティング部の表面図
である。図において、（１）は銅系部材で、例えば銅部
材、）２）は銅部材（１１を加熱するヒータ、（３１は
貴金属粉体で５例えば銀粉体、（４）はレーザビーム、
（５）は銀プレーティング層＆（６）は還元性雰囲気ガ
ス、例えば水素あるいは水素を含む不活性ガス６１１を
鋼部材（１）のプレーティング部に供給する還元性雰囲
気ガス供給装置であろうまた、第２図（ａ） 、 （ｂ
） 、 （Ｃ）はグレーティング部の断面を示す説明図
であり、図において、αＤは鋼部材（１）に形成されて
いる酸化皮膜、α２は酸化皮膜Ｏυが除去された酸化皮
膜除去部である、また、Ｓ１１は銅部材（１１丘の酸化
度ｌＩｘ、ｑＩＩと銀プレーティング層（５）とのオ°
−バーラップ部である。An embodiment of the noble metal plating method for a copper-based member using a laser according to the present invention will be described with reference to the drawings. Figure 1 (
1(a) is a configuration diagram of a plating section according to an embodiment of the present invention, and FIG. 1(b) is a surface diagram of the plating section. In the figure, (1) is a copper-based member, for example, a copper member, 2) is a heater that heats a copper member (11), (31 is a noble metal powder 5, for example, silver powder, (4) is a laser beam,
(5) is a silver plating layer & (6) is a reducing atmosphere gas supply device that supplies a reducing atmosphere gas, for example, hydrogen or an inert gas containing hydrogen 611 to the plating part of the steel member (1). In addition, Fig. 2 (a), (b
) and (C) are explanatory diagrams showing the cross section of the grating part, and in the figure, αD is the oxide film formed on the steel member (1), and α2 is the oxide film removal part where the oxide film Oυ has been removed. , S11 is the copper member (the oxidation degree lIx, qII of the 11th hill and the oxidation degree of the silver plating layer (5)).
-It is a burlap part.
第１図（ａ）に示すように、銅部材（１）はあらかじめ
ヒータ（２）などにより、３００℃〜５００℃程度のグ
レーティング温度を下まわる温度に予熱１．ておく。こ
れは銀の銅部材（１）へのなじみを容易に良好にするた
めである。この状帽で、還元性雰囲気ガス供給装置（６
）に、【す還元性雰囲気ガス（６℃を鋼部材（１）のプ
レーティング部に吹きつけるっこれと同時に銀粉体（３
）を供給装置（図示せず）によりグレーティング部に供
給する。このグレーティング部にレーザビーム（４）を
照射すると、銀粉体１３）及び銅部材（１）はレーザビ
ーム（４）によって１０００℃程度に加熱されて溶融１
２．銅部材（１１表面ＶＣｇｋプレーティング層（５）
が形成される。この時還元性雰囲気ガス−によす鋼部材
（１）の表面に形成される酸化皮膜（１１）は除去され
ているう銅部材（１）の表面が酸化していると、第２図
（ａ）、（ｂ）にそれぞれ示すように、 ｆｌ、１１部
材（１）の表面の酸化皮膜（ＩＤが銅部材（１１と銀プ
レーティング層（５１との間に介在し、銅部材（１）へ
のなじみを阻害し、オーバ−２ツブ部Ｌ５１）を形成す
ることになる。この部分は銅部材（１）と銀プレーティ
ング層（５）とが酸化皮膜＋１１）を介し″″ＣＣ接触
いるだけで。As shown in FIG. 1(a), the copper member (1) is preheated to a temperature below the grating temperature of about 300°C to 500°C using a heater (2) or the like. I'll keep it. This is to easily improve the adhesion of silver to the copper member (1). With this cap, the reducing atmosphere gas supply device (6
), a reducing atmosphere gas (6°C) is blown onto the plating part of the steel member (1), and at the same time silver powder (3
) is supplied to the grating section by a supply device (not shown). When this grating part is irradiated with a laser beam (4), the silver powder 13) and the copper member (1) are heated to about 1000°C by the laser beam (4) and melted.
2. Copper member (11 surface VCgk plating layer (5)
is formed. At this time, the oxide film (11) formed on the surface of the steel member (1) exposed to reducing atmospheric gas has been removed. As shown in a) and (b), the oxide film (ID) on the surface of the fl, 11 member (1) is interposed between the copper member (11 and the silver plating layer (51), and the copper member (1) This prevents the adhesion of the copper member (1) to the silver plating layer (5) and forms an over-two protrusion (L51). In this part, the copper member (1) and the silver plating layer (5) are in CC contact via the oxide film +11). Just by itself.
外見上接合されているかの如く見られるが、全く接合強
度を受持たない部分で、いわゆる欠陥である。、Ｊ：配
−実施例では、この酸化皮膜ｕＤの除去のために還元ｇ
雰囲気ガス供給装濫（６）を通じて水素あるいは水素を
含む不活性ガス（６１１、即ち水素とちつ素の混合ガス
や水素とアルゴンの混合ガスなどを局部的に流ｌ−て、
第２図（Ｃ）に示すように酸化皮膜除去部α４を形成し
、この部分に銀粉体（３１を供給するので、１）−ザピ
ーム（４）の照射により酸化皮膜Ｉｌｌを介在せずに銅
部材（１１に直接部分的な銀プレーティング層（５）を
形成でき、均一で極めて良好な銀プレーティング廟（５
）が得られる。また、プレーティング部のガスの吹きつ
け面積を調整することにより、プレーティング部位を制
御することもできるつと記混合ガス中の水素の虹は１〜
１０％程度が適切でめるっ
なお、と記−実施例では還元性雰囲気ガス口と銀粉体（
３）とを別系統で供給しτいるが、銀粉体（３１と還元
性雰囲気ガス口）とを混合させて供給し、ブレーナ１°
ングと同時に酸化皮膜ａυを除去するようにしても上記
実施例と同様の効果が得られる。Although it looks like it has been joined, it is a so-called defect because it has no joint strength at all. , J: In the example, reducing g was used to remove this oxide film uD.
Hydrogen or an inert gas containing hydrogen (611, that is, a mixed gas of hydrogen and nitrogen, a mixed gas of hydrogen and argon, etc.) is locally flowed through the atmospheric gas supply system (6),
As shown in FIG. 2(C), the oxide film removed part α4 is formed, and the silver powder (31) is supplied to this part, so that the oxide film Ill is not interposed by the irradiation with 1)-zapem (4). A partial silver plating layer (5) can be formed directly on the copper member (11), resulting in a uniform and extremely good silver plating layer (5).
) is obtained. In addition, by adjusting the gas blowing area of the plating part, the plating part can be controlled.
Note that about 10% is appropriate.In the example, the reducing atmosphere gas port and the silver powder (
3) is supplied in a separate system, but the silver powder (31 and reducing atmosphere gas port) is supplied in a mixed manner.
Even if the oxide film aυ is removed at the same time as the cleaning, the same effect as in the above embodiment can be obtained.
また、銅部材（１）の予熱手段は、に記英施例に限るも
のではなく、加熱手段であればどのようなものでもよい
つ
また、貴金属粉体として銀粉体を用いたものを示したが
、池の貴金属粉体の場合にも適用できる。Furthermore, the means for preheating the copper member (1) is not limited to the example described in 2, but any heating means may be used. However, it can also be applied to the case of precious metal powders in ponds.
また、銅部材に限らず、銅合金のような銅系部材にも適
用できろう
〔発明の効果〕
以と述べたように、この発明によれは、銅系部材のプレ
ーティング部に還元性雰囲気ガスを吹きつけてプレーテ
ィング部の酸化皮膜を除去する工程、プレーティング部
に貴金属粉体を供給する工程、及び貴金属粉体が供給さ
れたプレーティング部にレーザビームを照射して銅系部
材にグレーティングを行う工程を施すことにより、工程
が簡略化でき、比較的均一で良好な貴金属グレーテイン
グ層を形成することができるレーザによる銅系部材の貴
金属プレーティング方法を提供できる効果がある。Furthermore, the present invention can be applied not only to copper members but also to copper-based members such as copper alloys. [Effects of the Invention] As described above, the present invention allows the plating part of the copper-based member to be exposed to a reducing atmosphere. A process of blowing gas to remove the oxide film on the plating part, a process of supplying precious metal powder to the plating part, and a process of irradiating the plating part supplied with the precious metal powder with a laser beam to form a copper-based member. By performing the step of grating, it is possible to simplify the process and provide a method for plating a copper-based member with a noble metal using a laser, which can form a relatively uniform and good noble metal grating layer.
第１図（ａ）はこの発明の一実施例によるレーザによる
銅系部材の貴会攬プレーティング方法に係るプレーティ
ング部を示す構成図、第１図中）は同じくプレーティン
グ部を示す表面図、第２図（ａ） 、 （ｂ）（Ｃ）は
それぞれ貴金属プレーティング工程におけるプレーティ
ング部の断面を示す説明図でめるっ（１）・・・銅系部
材、（３）・・・貴金属粉１ｆ−ｉ４１・・・レーザビ
ーム、（５）・・・貴金属プレーティング層、（６ト・
・還元性雰囲気ガス。
なお、図中、同一符号は同一、又は相当部分を示す。
代 理 人 大 岩 増 雄第１図
（り
第２ＷＩFIG. 1(a) is a block diagram showing a plating part according to a laser plating method for copper-based members according to an embodiment of the present invention, and FIG. 1(a) is a surface diagram showing the plating part. , Figures 2 (a), (b), and (C) are explanatory diagrams showing the cross sections of the plating parts in the precious metal plating process, respectively. Precious metal powder 1f-i41...Laser beam, (5)...Precious metal plating layer, (6t.
・Reducing atmospheric gas. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Masuo Oiwa 1st WI (2nd WI)
Claims (4)
を吹きつけて上記プレーティング部の酸化皮膜を除去す
る工程、上記プレーティング部に貴金属粉体を供給する
工程、及び上記貴金属粉体が供給されたプレーティング
部にレーザビームを照射して上記銅系部材にプレーティ
ングを行うレーザによる銅系部材の貴金属プレーティン
グ方法。(1) A step of blowing a reducing atmospheric gas onto the plating portion of the copper-based member to remove the oxide film on the plating portion, a step of supplying noble metal powder to the plating portion, and a step of supplying the noble metal powder to the plating portion. A method for plating a copper-based member with a precious metal using a laser, in which the supplied plating portion is irradiated with a laser beam to plate the copper-based member.
請求の範囲第１項記載のレーザによる銅系部材の貴金属
プレーティング方法。(2) A method of plating a copper-based member with a precious metal using a laser according to claim 1, wherein the precious metal powder is silver powder.
材のプレーティング部に供給することを特徴とする特許
請求の範囲第１項又は第２項記載のレーザによる銅系部
材の貴金属プレーティング方法。(3) The noble metal of the copper-based member by the laser according to claim 1 or 2, characterized in that the reducing atmosphere gas and the noble metal powder are mixed and supplied to the plating part of the copper-based member. Plating method.
活性ガスであることを特徴とする特許請求の範囲第１項
ないし第３項のいずれかに記載のレーザによる銅系部材
の貴金属プレーティング方法。(4) Precious metal plating of a copper-based member by laser according to any one of claims 1 to 3, wherein the reducing atmospheric gas is hydrogen or an inert gas containing hydrogen. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9512186A JPS62250163A (en) | 1986-04-22 | 1986-04-22 | Method for plating copper-base member with noble metal by means of laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9512186A JPS62250163A (en) | 1986-04-22 | 1986-04-22 | Method for plating copper-base member with noble metal by means of laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62250163A true JPS62250163A (en) | 1987-10-31 |
Family
ID=14128999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9512186A Pending JPS62250163A (en) | 1986-04-22 | 1986-04-22 | Method for plating copper-base member with noble metal by means of laser |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62250163A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102019505A (en) * | 2009-09-17 | 2011-04-20 | 沈阳大陆激光技术有限公司 | Method for laser cladding by using laser cladding welding wire |
| CN109183026A (en) * | 2018-10-11 | 2019-01-11 | 西安科技大学 | A kind of laser melting coating system for protecting and forge function with substrate preheating, argon gas |
-
1986
- 1986-04-22 JP JP9512186A patent/JPS62250163A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102019505A (en) * | 2009-09-17 | 2011-04-20 | 沈阳大陆激光技术有限公司 | Method for laser cladding by using laser cladding welding wire |
| CN109183026A (en) * | 2018-10-11 | 2019-01-11 | 西安科技大学 | A kind of laser melting coating system for protecting and forge function with substrate preheating, argon gas |
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