JPS6224501U - - Google Patents
Info
- Publication number
- JPS6224501U JPS6224501U JP1986114466U JP11446686U JPS6224501U JP S6224501 U JPS6224501 U JP S6224501U JP 1986114466 U JP1986114466 U JP 1986114466U JP 11446686 U JP11446686 U JP 11446686U JP S6224501 U JPS6224501 U JP S6224501U
- Authority
- JP
- Japan
- Prior art keywords
- microcircuit
- substrate
- shielding means
- enclosure
- coefficient
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W44/00—Electrical arrangements for controlling or matching impedance
- H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Waveguide Connection Structure (AREA)
- Non-Reversible Transmitting Devices (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US75952785A | 1985-07-25 | 1985-07-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6224501U true JPS6224501U (en:Method) | 1987-02-14 |
Family
ID=25055989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986114466U Pending JPS6224501U (en:Method) | 1985-07-25 | 1986-07-25 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP0209642A3 (en:Method) |
| JP (1) | JPS6224501U (en:Method) |
| CA (1) | CA1240409A (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4899118A (en) * | 1988-12-27 | 1990-02-06 | Hughes Aircraft Company | Low temperature cofired ceramic packages for microwave and millimeter wave gallium arsenide integrated circuits |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4810904B1 (en:Method) * | 1969-03-12 | 1973-04-09 | ||
| US3946428A (en) * | 1973-09-19 | 1976-03-23 | Nippon Electric Company, Limited | Encapsulation package for a semiconductor element |
| US4242157A (en) * | 1979-04-20 | 1980-12-30 | Rockwell International Corporation | Method of assembly of microwave integrated circuits having a structurally continuous ground plane |
| US4276558A (en) * | 1979-06-15 | 1981-06-30 | Ford Aerospace & Communications Corp. | Hermetically sealed active microwave integrated circuit |
| FR2538618B1 (fr) * | 1982-12-28 | 1986-03-07 | Inf Milit Spatiale Aeronaut | Boitier pour composant electronique comportant un element fixant l'humidite |
| JPS607741A (ja) * | 1983-06-27 | 1985-01-16 | Nec Corp | 混成集積回路装置 |
-
1986
- 1986-04-15 EP EP86105160A patent/EP0209642A3/en not_active Withdrawn
- 1986-05-13 CA CA000509029A patent/CA1240409A/en not_active Expired
- 1986-07-25 JP JP1986114466U patent/JPS6224501U/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP0209642A3 (en) | 1987-04-15 |
| CA1240409A (en) | 1988-08-09 |
| EP0209642A2 (en) | 1987-01-28 |