JPS62241418A - Sealing device for electronic parts - Google Patents

Abstract

PURPOSE:To prevent electronic parts in a case from breaking down at the time of heating and straining by structuring a sealing device for electronic parts such as a ceramic filter and an oscillator so that bending stress impressed to a terminal led out penetrating a sealing plate is concentrated on part of the terminal covered with resin. CONSTITUTION:Part of the terminal 10 in the sealing resin 3 is reduced in terminal width to allow the terminal 10 to bend when heat is conducted or when stress is impressed. In other two examples, a hole part is formed at part of a terminal 11 and a spring part is constituted at part of a terminal 12 respectively. Thus, the structure wherein the stress is concentrated on part of the terminal embedded in the sealing resin is employed to bend the terminal at the stress-concentrated part when the sealing resin softens owing to the heat or stress to the terminal to move the terminal, so the stress is impressed to none of the electronic parts in the case and they are prevented from breaking down.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a sealing device for electronic components such as ceramic filters and oscillators.

Conventional technology Fig. 6(a) shows a perspective view of a conventional electronic component, and Fig. 6(b) shows a perspective view of a conventional electronic component.
The complete cross-sectional view is shown below. Here, 1 is a resin or metal case having one opening, 2 is a terminal led out from a Geramifuku resonator, which will be described later, housed in the case 1, and 3
#i A sealing resin that covers the opening of the case 1, 4 a resin sealing plate that covers the inside of the opening, 5 a conductive adhesive, solder, welding part, etc., and the ceramic resonator 6 is connected to the terminal 2. mechanically and electrically connected to In this way, in conventional electronic components, after housing the ceramic resonator 6, the terminal 2, and the sealing plate 4 in the case 1, the sealing plate 4 and the case 2 are sealed between the open bottom part of the case 1. It was made by filling resin 3 and drying and curing it.

Problems to be Solved by the Invention Problems encountered when mounting conventional electronic components as described above on a printed circuit board are shown in FIGS. 6 and 7(a).

(b) Explain using t-. First, the two terminal type electronic component T in Figure 6 is mounted on the printed circuit board 8, and the copper foil part 9 is mounted on the printed circuit board 8.
This shows the case where soldering is performed. At this time.

In order to fix the electronic component T during soldering, the terminals 2 of the electronic component 7 are inserted into the holes of the printed circuit board 8 with a wider distance between the terminals. However, when a heated soldering iron is applied to the terminal 2 with stress applied to it in this way, the heat is conducted to the portion of the terminal 2 sealed with the sealing resin 3, and the sealing resin Since the temperature of the three parts exceeds the softening point of the resin, the terminal 2 cannot be fixed, and stress is applied to the ceramic resonators inside the case 1, which may break them. Next, FIGS. 7(-) and (b) show the case where the electronic component has three terminals, and since there are three terminals 2, l! The destruction described above is even more likely to occur.

The object of the present invention is to completely prevent the destruction of electronic components inside the case that occurs when such heat and stress are applied.

Means for Solving the Problems In order to solve the above problems, the present invention has a structure that concentrates stress on a portion of the terminal sealed in the sealing resin.

According to this configuration, by providing a structure that concentrates stress on a portion of the terminal embedded in the sealing resin, when heat and stress are applied to the terminal and the sealing resin softens and the terminal moves, Since the terminal is bent at the stress concentration portion, no stress is applied to the electronic components inside the case, thereby preventing their destruction.

Embodiments FIGS. 1 to 4 show embodiments of the present invention. Here, the same parts as in the conventional example are given the same numbers, and only the main parts are shown. 1. In Fig. 1, the terminal width of a part of the terminal 1o in the sealing resin 3 is reduced, and the four terminals 1o are configured to bend at this part when heat and stress are applied. . Similarly, FIG. 2 shows a structure in which a hole is provided in a part of the terminal 11, and a spring part is formed in a part of the terminal 12 as in FIG. 3 (&) and Φ)Fi. Also,
In FIG. 4(&), Cb), the thickness of a portion of the quadruplets 13 is similarly reduced to provide the same effect as the above-mentioned example 0.

As is clear from the examples above, the present invention has the effect of preventing the electronic component main body inside the case from being destroyed when a high voltage and Z77 are applied to the % terminal.

[Brief explanation of drawings]

FIG. 1 and FIG. 2 #''i are partial side views of gI portions showing embodiments of the electronic component sealing device according to the present invention.FIG. 3(a)
, FIG. 4(a) are sectional views of main parts showing other embodiments of the electronic component sealing device according to the present invention, and FIG. 3(a))
, Fig. 4°C) are 5! as seen from the side direction of the embodiments of Fig. 3(a) and Fig. 4(a), respectively. Partial cause, Fig. 6(a)
, (b) is a perspective view and a cross-sectional view showing a conventional electronic component, and Figure 6 shows a conventional two-terminal type electronic component mounted on a printed circuit board! ! ! Figure 7(a), (
b) is a diagram showing a state in which a conventional three-terminal type electronic component is mounted on a printed circuit board. 1...Case, 3...Sealing A1 resin, 4
...Sealing plate. 6...Ceramic resonator (child component main body), completed...Electronic component, 10, 11. "12.13...
...Terminal. Name of agent: Patent attorney Toshio Nakao and 1 other person/-
--Case, 3-11 inch resin 4-Resistant slope 132 ((L) (b)
(b) Cb)

Claims (5)

[Claims] (1) An electronic component main body is housed in a case, and a sealing plate is provided to cover the opening of the case on the inside of the case opening, and a terminal is led out through the sealing plate, and A plate is coated with a resin to seal the case opening, and a portion of the terminal coated with the resin is further provided with:
An electronic component sealing device characterized by having a structure that concentrates bending stress applied to the terminal. (2) The electronic component sealing device according to claim 1, wherein the structure for concentrating bending stress has a narrow terminal width. (3) The electronic component sealing device according to claim 1, wherein the structure for concentrating bending stress is a structure in which a hole is provided in the terminal. (4) The electronic component sealing device according to claim 1, wherein the structure for concentrating bending stress is a structure in which a spring portion is provided in the terminal. (5) The structure of an electronic component sealing device according to claim 1, wherein the structure for concentrating bending stress has a reduced terminal thickness.