JPS622411B2 - - Google Patents
Info
- Publication number
- JPS622411B2 JPS622411B2 JP9437778A JP9437778A JPS622411B2 JP S622411 B2 JPS622411 B2 JP S622411B2 JP 9437778 A JP9437778 A JP 9437778A JP 9437778 A JP9437778 A JP 9437778A JP S622411 B2 JPS622411 B2 JP S622411B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical contact
- contact
- cadmium
- oxide
- zinc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 33
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 10
- 239000000956 alloy Substances 0.000 claims description 10
- 239000002344 surface layer Substances 0.000 claims description 9
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 8
- 229910052793 cadmium Inorganic materials 0.000 claims description 8
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052725 zinc Inorganic materials 0.000 claims description 8
- 239000011701 zinc Substances 0.000 claims description 8
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 239000010953 base metal Substances 0.000 description 15
- 229910000510 noble metal Inorganic materials 0.000 description 9
- 229910001316 Ag alloy Inorganic materials 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical class 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- QBOFZWHHAMJUSL-UHFFFAOYSA-N [Cd].[Ag].[Au] Chemical compound [Cd].[Ag].[Au] QBOFZWHHAMJUSL-UHFFFAOYSA-N 0.000 description 1
- WTNCAWIDMWEIDV-UHFFFAOYSA-N [Zn].[Ag].[Au] Chemical compound [Zn].[Ag].[Au] WTNCAWIDMWEIDV-UHFFFAOYSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000010303 mechanochemical reaction Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Landscapes
- Solid-Phase Diffusion Into Metallic Material Surfaces (AREA)
- Contacts (AREA)
Description
【発明の詳細な説明】
本発明は、電気接点材料、特に小型電子部品等
の低電流用として好適な電気接点材料に関するも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical contact material, particularly an electrical contact material suitable for low current applications such as small electronic components.
従来、電子部品の小型化に伴う低電流、低接触
力、低開離力の接点では、その接点金属に金、
銀、パラジウム、白金又はこれらの合金が主に使
用されてきた。 Traditionally, contacts with low current, low contact force, and low opening force have been developed as electronic components become smaller.
Silver, palladium, platinum or alloys thereof have mainly been used.
然し乍ら、この種の接点金属の表面は、化学的
に安定しているので接触抵抗が低く安定したもの
であるが、表面が清浄な為に低開離力の接点では
開閉初期において粘着（接触面が溶融または機械
的にからみ合うことなく、開離困難となる現象）
による開離不能障害を生じる欠点があつた。 However, since the surface of this type of contact metal is chemically stable, the contact resistance is low and stable, but because the surface is clean, contacts with low opening force tend to stick (contact surface) at the initial stage of opening and closing. (a phenomenon in which it becomes difficult to separate without melting or becoming mechanically entangled)
It had the disadvantage of causing non-separation failure.
一方、この開離不能障害を改善する為に、貴金
属に卑金属を添加する方法があるが、このような
接点金属全体に卑金属を含有した合金では、一般
に接点金属中の卑金属に比べ貴金属の消耗が多く
しかも開閉動作と共に、接点表面が活性化され、
接触表面に卑金属酸化物の表面被膜が異常に生成
され、低接触力では接触抵抗が増大する欠点を有
する。 On the other hand, in order to improve this non-separable failure, there is a method of adding a base metal to the noble metal, but in such alloys where the entire contact metal contains base metal, the wear of the noble metal is generally lower than that of the base metal in the contact metal. In addition, the contact surface is activated with the opening and closing operation.
This has the disadvantage that a surface film of base metal oxide is abnormally formed on the contact surface, and contact resistance increases at low contact force.
本発明は、上記欠点を解消すべくなされたもの
であり、接触抵抗が低く安定し且つ耐粘着性に優
れた電気接点材料を提供せんとするものである。 The present invention has been made in order to eliminate the above-mentioned drawbacks, and aims to provide an electrical contact material that has low and stable contact resistance and excellent adhesive resistance.
本発明の電気接点材料は、金、銀、パラジウ
ム、白金又はこれらの合金から成る電気接点材料
の少なくとも接点表面に於いて、厚さ0.1〜８μ
ｍの表面層に、亜鉛、カドミウム、酸化亜鉛、酸
化カドミウムのいずれかを３〜35w／ｏ合金化又
は分散されていることを特徴とするものである。 The electrical contact material of the present invention is made of gold, silver, palladium, platinum, or an alloy thereof, and has a thickness of 0.1 to 8 μm at least on the contact surface.
It is characterized in that 3 to 35 w/o of zinc, cadmium, zinc oxide, or cadmium oxide is alloyed or dispersed in the surface layer of m.
粘着による開離不能障害を無くする為に、ただ
単に貴金属に卑金属を添加すると、大気中に於け
る耐粘着性は改善されるが、普通卑金属を添加し
た合金接点を大気中で開閉動作した場合、接点表
面が活性化され（メカノケミカル反応）、開閉動
作が多くなると、その接点表面には卑金属酸化物
が増えて、やがてその卑金属酸化物の表面被膜が
生成され、接触抵抗が急激に増大するが、本発明
の電気接点材料の如く亜鉛、カドミウム、酸化亜
鉛、酸化カドミウムのいずれかを、接点表面に於
いて厚さ0.1〜８μｍの表面層に合金化又は分散
した場合には、大気中で接点を開閉動作しても殆
んど接点表面が変化せず、低く安定した接触抵抗
が得られる。これは卑金属又はその酸化物を含ん
だ合金層が極めて薄いので、初期においては消耗
と共に表面の貴金属に対する卑金属元素の割合が
増大するものの長続きはせず、結局接点表面にで
きる卑金属酸化物の絶対量が少ないので卑金属酸
化物粒子が接点表面に分散された状態となり、表
面被膜が生成されないからである。 Simply adding a base metal to a noble metal in order to eliminate the failure to open due to adhesion improves the adhesion resistance in the atmosphere, but when an alloy contact with a base metal added is opened and closed in the atmosphere. When the contact surface is activated (mechanochemical reaction) and the number of opening/closing operations increases, base metal oxide increases on the contact surface, and eventually a surface film of the base metal oxide is formed, causing a rapid increase in contact resistance. However, when zinc, cadmium, zinc oxide, or cadmium oxide is alloyed or dispersed in a surface layer with a thickness of 0.1 to 8 μm on the contact surface, as in the electrical contact material of the present invention, Even when the contact is opened and closed, the contact surface hardly changes, resulting in low and stable contact resistance. This is because the alloy layer containing the base metal or its oxide is extremely thin, so although the ratio of the base metal element to the noble metal on the surface increases as it wears out at the beginning, it does not last long, and eventually the absolute amount of base metal oxide that forms on the contact surface increases. This is because the base metal oxide particles are dispersed on the contact surface and no surface film is formed.
本発明の電気接点材料に於いて、その接点表面
層に合金化又は分散する材料を、亜鉛、カドミウ
ム、酸化亜鉛、酸化カドミウムのいずれかと限定
したのは、それが接点開閉時に酸化物粒子となつ
て接点表面に分散し易いからである。またその表
面層の厚さを0.1〜８μｍに限定した理由は、0.1
μｍ未満では接点開閉時に接点表面に分散した酸
化物粒子が消耗により貴金属の下地が露出して開
閉初期に於ける粘着力が増大するからであり、８
μｍを超えると開閉回数が多くなるにつれて接点
表面に酸化物被膜が生成されて接触抵抗が高くな
るからである。 In the electrical contact material of the present invention, the material alloyed or dispersed in the contact surface layer is limited to zinc, cadmium, zinc oxide, or cadmium oxide because the material becomes oxide particles when the contact is opened and closed. This is because it is easy to disperse on the contact surface. Also, the reason why the thickness of the surface layer was limited to 0.1 to 8 μm is 0.1 μm.
If it is less than 8 μm, the oxide particles dispersed on the contact surface will be worn out when the contact opens and closes, exposing the noble metal base and increasing the adhesive force at the initial stage of opening and closing.
This is because if it exceeds .mu.m, as the number of times of opening and closing increases, an oxide film will be formed on the contact surface and the contact resistance will increase.
さらに亜鉛、カドミウム、酸化亜鉛、酸化カド
ミウムのいずれかを３〜35w／ｏの範囲にした理
由は、3w／ｏ未満では耐粘着性が十分得られ
ず、35w／ｏを超えると接触抵抗が増大するから
である。 Furthermore, the reason why zinc, cadmium, zinc oxide, or cadmium oxide was set in the range of 3 to 35 w/o is that if it is less than 3 w/o, sufficient adhesion resistance cannot be obtained, and if it exceeds 35 w/o, the contact resistance increases. Because it does.
次に本発明による電気接点材料の具体的な実施
例及び従来例について述べる。 Next, specific examples and conventional examples of the electrical contact material according to the present invention will be described.
実施例 １
金−10w／ｏ銀合金より成る電気接点材料の接
点表面に於いて、亜鉛を蒸着・拡散し、亜鉛
10w／ｏを含む金−銀−亜鉛の表面層を２μｍ形
成した。Example 1 Zinc was vapor-deposited and diffused on the contact surface of an electrical contact material made of gold-10w/o silver alloy.
A 2 μm thick gold-silver-zinc surface layer containing 10 w/o was formed.
実施例 ２
金−10w／ｏ銀合金より成る電気接点材料の接
点表面に於いて、カドミウムを蒸着・拡散し、カ
ドミウム15w／ｏを含む金−銀−カドミウムの表
面層を0.5μｍ形成した。Example 2 Cadmium was deposited and diffused on the contact surface of an electrical contact material made of a gold-10 w/o silver alloy to form a 0.5 μm thick gold-silver-cadmium surface layer containing 15 w/o cadmium.
実施例 ３
パラジウム−40w／ｏ銀合金より成る電気接点
材料の接点表面に於いて、亜鉛を蒸着・拡散し、
亜鉛35w／ｏを含むパラジウム−銀−亜鉛の表面
層を１μｍ形成した。Example 3 Zinc was evaporated and diffused on the contact surface of an electrical contact material made of palladium-40w/o silver alloy,
A 1 μm thick palladium-silver-zinc surface layer containing 35 w/o of zinc was formed.
実施例 ４
パラジウム−50w／ｏ銀合金より成る電気接点
材料の接点表面に於いて、カドミウムを蒸着・拡
散し、さらに酸化して、酸化カドミウム3w／ｏ
を含むパラジウム−銀−酸化カドミウムの表面層
を6.5μｍ形成した。Example 4 Cadmium was evaporated and diffused on the contact surface of an electrical contact material made of palladium-50 w/o silver alloy, and further oxidized to form 3 w/o cadmium oxide.
A 6.5 μm thick surface layer of palladium-silver-cadmium oxide was formed.
従来例 １ 金−10w／ｏ銀合金より成る電気接点材料。Conventional example 1 Electrical contact material made of gold-10w/o silver alloy.
従来例 ２
パラジウム−40w／ｏ銀合金より成る電気接点
材料。Conventional Example 2 Electrical contact material made of palladium-40w/o silver alloy.
従来例 ３
パラジウム−銀合金に卑金属である銅を添加し
たパラジウム−40w／ｏ銀−10w／ｏ銅より成る
電気接点材料。Conventional Example 3 Electrical contact material made of palladium-40w/o silver-10w/o copper, which is a palladium-silver alloy with copper as a base metal added.
然して上記実施例１乃至４及び従来例１乃至３
の各電気接点材料にて作つた電気接点を下記の試
験条件にて開閉試験を行い、接触抵抗を測定した
ところ、第１図のグラフに示すような結果を得
た。 However, the above-mentioned Examples 1 to 4 and Conventional Examples 1 to 3
Electrical contacts made from each of the electrical contact materials were subjected to opening/closing tests under the following test conditions, and the contact resistance was measured, with the results shown in the graph of FIG. 1.
開閉試験条件
電圧 AC100V
電流 0.3A
負荷 抵抗負荷
接触力 10ｇ
開閉頻度 10回／sec
開閉回数 106回
また前記各電気接点材料にて作つた電気接点の
粘着係数（開離力を接触力で除した値）を求めた
ところ、第２図のグラフに示すような結果を得
た。Switching test conditions Voltage AC 100V Current 0.3A Load Resistive load Contact force 10g Switching frequency 10 times/sec Number of switches 10 to 6 As a result, the results shown in the graph of FIG. 2 were obtained.
第１図及び第２図のグラフで明らかなように本
発明による実施例１乃至４の電気接点材料から成
る電気接点は、従来例１、２の電気接点材料、即
ち貴金属合金の電気接点材料にて作つた電気接点
と同等に接触抵抗が低く安定していて、従来例３
の電気接点材料、即ち貴金属合金に卑金属を添加
した電気接点材料にて作つた電気接点の如く開閉
動作が多くなると急激に接触抵抗が増大するよう
なことはない。また本発明による実施例１乃至４
の電気接点材料から成る電気接点は、開閉初期に
於いて従来例３の貴金属合金に卑金属を添加した
電気接点材料にて作つた電気接点と略同等の低い
粘着力を有し、耐粘着性に優れているので、従来
例１、２の貴金属合金の電気接点材料にて作つた
電気接点の如く粘着力が極めて高い為に開離不能
障害が生じるというようなことがない。 As is clear from the graphs in FIGS. 1 and 2, the electrical contacts made of the electrical contact materials of Examples 1 to 4 according to the present invention are different from the electrical contact materials of conventional examples 1 and 2, that is, the noble metal alloy electrical contact materials. The contact resistance is as low and stable as the electrical contacts made using conventional example 3.
When the number of opening and closing operations increases, the contact resistance does not suddenly increase as in the case of an electrical contact made of an electrical contact material made of a noble metal alloy with a base metal added thereto. Further, Examples 1 to 4 according to the present invention
The electrical contact made of the electrical contact material has approximately the same low adhesive strength as the electrical contact made from the electrical contact material of Conventional Example 3, which is a noble metal alloy with a base metal added, during the initial stage of opening and closing, and has excellent adhesion resistance. Since the adhesive strength is extremely high, unlike the electrical contacts made of the noble metal alloy electrical contact materials of Conventional Examples 1 and 2, there is no possibility that failure to separate will occur due to the extremely high adhesive strength.
以上詳記した通り本発明による電気接点材料
は、接触抵抗が低く安定し且つ開閉初期に於ける
粘着力が低く耐粘着性に優れているので、特に小
型電子部品等の低電流用としては従来の電気接点
材料にとつて代わることのできる画期的な電気接
点材料と云える。 As detailed above, the electrical contact material of the present invention has low and stable contact resistance, low adhesive strength at the initial stage of opening/closing, and excellent adhesive resistance. It can be said that it is an epoch-making electrical contact material that can replace conventional electrical contact materials.
第１図は本発明による電気接点材料の実施例か
ら成る電気接点と従来の電気接点材料から成る電
気接点の開閉回数と接触抵抗の関係を示すグラフ
であり、第２図は本発明による電気接点材料の実
施例から成る電気接点と従来の電気接点材料から
成る電気接点の粘着係数を示すグラフである。
FIG. 1 is a graph showing the relationship between the number of openings and closings and the contact resistance of an electrical contact made of an embodiment of the electrical contact material according to the present invention and an electrical contact made of a conventional electrical contact material. 1 is a graph illustrating the coefficient of adhesion of electrical contacts made from an example material and a conventional electrical contact material;
Claims (1)
から成る電気接点材料の少なくとも接点表面に於
いて、厚さ0.1〜８μｍの表面層に、亜鉛、カド
ミウム、酸化亜鉛、酸化カドミウムのいずれかを
３〜35w／ｏ合金化又は分散されていることを特
徴とする電気接点材料。1 At least on the contact surface of an electrical contact material made of gold, silver, palladium, platinum, or an alloy thereof, a surface layer of 0.1 to 8 μm in thickness is coated with 3 to 3 to 10% of zinc, cadmium, zinc oxide, or cadmium oxide. 35W/O electrical contact material characterized in that it is alloyed or dispersed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9437778A JPS5521841A (en) | 1978-08-02 | 1978-08-02 | Electric contact material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9437778A JPS5521841A (en) | 1978-08-02 | 1978-08-02 | Electric contact material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5521841A JPS5521841A (en) | 1980-02-16 |
| JPS622411B2 true JPS622411B2 (en) | 1987-01-20 |
Family
ID=14108619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9437778A Granted JPS5521841A (en) | 1978-08-02 | 1978-08-02 | Electric contact material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5521841A (en) |
-
1978
- 1978-08-02 JP JP9437778A patent/JPS5521841A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5521841A (en) | 1980-02-16 |
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