JPS6223790Y2 - - Google Patents
Info
- Publication number
- JPS6223790Y2 JPS6223790Y2 JP1983022398U JP2239883U JPS6223790Y2 JP S6223790 Y2 JPS6223790 Y2 JP S6223790Y2 JP 1983022398 U JP1983022398 U JP 1983022398U JP 2239883 U JP2239883 U JP 2239883U JP S6223790 Y2 JPS6223790 Y2 JP S6223790Y2
- Authority
- JP
- Japan
- Prior art keywords
- density polyethylene
- paper
- resin layer
- dsc
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 26
- 229920001684 low density polyethylene Polymers 0.000 claims description 19
- 239000004702 low-density polyethylene Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 14
- 229920001903 high density polyethylene Polymers 0.000 claims description 12
- 239000004700 high-density polyethylene Substances 0.000 claims description 12
- 229920000092 linear low density polyethylene Polymers 0.000 claims description 12
- 239000004707 linear low-density polyethylene Substances 0.000 claims description 12
- 229920001179 medium density polyethylene Polymers 0.000 claims description 12
- 239000004701 medium-density polyethylene Substances 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000000123 paper Substances 0.000 description 44
- 238000007789 sealing Methods 0.000 description 8
- 239000004698 Polyethylene Substances 0.000 description 7
- -1 polyethylene Polymers 0.000 description 7
- 229920000573 polyethylene Polymers 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- BXKDSDJJOVIHMX-UHFFFAOYSA-N edrophonium chloride Chemical compound [Cl-].CC[N+](C)(C)C1=CC=CC(O)=C1 BXKDSDJJOVIHMX-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000003851 corona treatment Methods 0.000 description 2
- 238000007765 extrusion coating Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003623 enhancer Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 239000002655 kraft paper Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
Description
【考案の詳細な説明】
本考案は剥離紙の製造の際に用いる剥離紙用基
材に関するもので、従来に存在しなかつた新規な
剥離紙用基材を提供するものである。[Detailed Description of the Invention] The present invention relates to a release paper base material used in the production of release paper, and provides a novel release paper base material that has not existed in the past.
従来、剥離紙用基材としては紙に剥離剤の塗工
性を向上せしめる目的で目止め層として高圧法低
密度ポリエチレンが片面若しくは両面に設けられ
たものがよく知られている。なお剥離紙は、この
剥離紙用基材の高圧法低密度ポリエチレン上に、
シリコーン、アルキド樹脂、シリコーン・アルキ
ド共重合体、ポリビニルアルコール／シリコーン
混合物その他の剥離剤が塗工され加熱処理されて
製造されている。 Conventionally, as a base material for a release paper, one in which a high-pressure low-density polyethylene is provided as a sealing layer on one or both sides of the paper for the purpose of improving the coatability of a release agent on the paper is well known. The release paper is made of high-pressure low-density polyethylene, which is the base material for the release paper.
It is manufactured by applying a release agent such as silicone, alkyd resin, silicone/alkyd copolymer, polyvinyl alcohol/silicone mixture, or the like, and then heat-treating it.
処で、従来の高圧法低密度ポリエチレンが紙の
片面若しくは両面に設けられた剥離紙用基材で
は、
(1) 耐熱性が不充分で、剥離剤を塗工し、加熱し
た時または剥離紙となつたものに接着剤或いは
粘着剤を塗工し加熱した時に、紙とポリエチレ
ンとの間で発泡が起こつて了い、均一且つ平滑
で良好な剥離性能を有する剥離紙が得られ難い
と云う欠点があつた。 However, conventional release paper substrates in which high-pressure low-density polyethylene is provided on one or both sides of the paper have (1) insufficient heat resistance, and when coated with a release agent and heated, the release paper When an adhesive or pressure-sensitive adhesive is applied to the paper and heated, foaming occurs between the paper and the polyethylene, making it difficult to obtain a release paper that is uniform, smooth, and has good release performance. There were flaws.
(2) 更に、紙の両面に高圧法低密度ポリエチレン
が設けられた巻取状物においては、基材の表裏
のポリエチレン同士が非常に接着し易くブロツ
キングして了い、剥離紙製造の際の巻取の繰出
し作業が困難となると云う大きな欠点があつ
た。(2) Furthermore, in rolls of paper with high-pressure low-density polyethylene on both sides, the polyethylene on the front and back sides of the base material adheres very easily to each other, resulting in blocking. A major drawback was that it made the work of unwinding the winding difficult.
本考案者等は、上述した高圧法低密度ポリエチ
レンを目止め層とする従来の剥離紙用基材の欠点
を改良すべく種々検討した。 The inventors of the present invention have conducted various studies in order to improve the drawbacks of the conventional base material for release paper, which uses the above-mentioned high-pressure low-density polyethylene as a sealing layer.
その結果、目止め層に高圧法低密度ポリエチレ
ン単独に変えて、新たにDSCによる融点120℃以
上の中密度ポリエチレン若しくは高密度ポリエチ
レンと、DSCによる融点100℃以上のリニアー低
密度ポリエチレン若しくは高圧法低密度ポリエチ
レンとから成る平均密度0.930〜0.950ｇ／cm3の混
合樹脂層を用い、且つ紙と該混合樹脂層との接着
強度を80ｇ／20mm以上とすることにより、上述し
た従来の剥離紙用基材が有する欠点を改良し得る
ことを見出した。 As a result, instead of using only high-pressure low-density polyethylene for the sealing layer, we newly added medium-density polyethylene or high-density polyethylene with a melting point of 120℃ or higher by DSC, and linear low-density polyethylene or high-pressure low-density polyethylene with a melting point of 100℃ or higher by DSC. By using a mixed resin layer consisting of density polyethylene and having an average density of 0.930 to 0.950 g/cm 3 and by setting the adhesive strength between the paper and the mixed resin layer to 80 g/20 mm or more, the above-mentioned conventional release paper base can be improved. It has been found that the defects of the material can be improved.
即ち本考案は紙の片面若しくは両面に、DSC
による融点120℃以上の中密度ポリエチレン若し
くは高密度ポリエチレンと、DSCによる融点100
℃以上の高圧法低密度ポリエチレン若しくはリニ
アー低密度ポリエチレン（Linear Low Density
Polyethylene）とから成る平均密度0.930〜0.950
ｇ／cm3の混合樹脂層が設けられ、且つ紙と該混合
樹脂層との接着強度が80ｇ／20mm以上である剥離
紙用基材であり、従来にない耐熱性、耐ブロツキ
ング性及び耐吸湿カール性を具備させたものであ
る。 That is, the present invention applies DSC to one or both sides of paper.
Medium-density polyethylene or high-density polyethylene with a melting point of 120℃ or higher by DSC and a melting point of 100℃ by DSC
High-pressure low-density polyethylene or linear low-density polyethylene (Linear Low Density Polyethylene)
Polyethylene) with an average density of 0.930 to 0.950
A base material for release paper that is provided with a mixed resin layer of g/cm 3 and has an adhesive strength of 80 g/20 mm or more between the paper and the mixed resin layer, and has unprecedented heat resistance, blocking resistance, and moisture absorption resistance. It has curling properties.
以下に本考案を更に詳しく説明する。 The present invention will be explained in more detail below.
本考案では、中密度ポリエチレン若しくは高密
度ポリエチレンと、高圧法低密度ポリエチレン若
しくはリニアー低密度ポリエチレンとの混合樹脂
が目止め層として用いられなければならない。混
合樹脂でなければならない理由は以下の如くであ
る。 In the present invention, a mixed resin of medium-density polyethylene or high-density polyethylene and high-pressure low-density polyethylene or linear low-density polyethylene must be used as the sealing layer. The reason why it is necessary to use a mixed resin is as follows.
(イ) 中密度ポリエチレン若しくは高密度ポリエチ
レンのみでは、紙との充分な接着が得られ難
く、充分良好な耐熱性を得ることが出来なかつ
た。(a) When medium density polyethylene or high density polyethylene is used alone, it is difficult to obtain sufficient adhesion to paper, and it is not possible to obtain sufficiently good heat resistance.
一方、中密度ポリエチレン若しくは高密度ポ
リエチレンと、高圧法低密度ポリエチレン若し
くはリニアー低密度ポリエチレンとを混合した
ものでは充分良好な紙との接着性および耐熱性
が得られた。 On the other hand, a mixture of medium-density polyethylene or high-density polyethylene and high-pressure low-density polyethylene or linear low-density polyethylene had sufficiently good adhesion to paper and heat resistance.
(ロ) 高圧法低密度ポリエチレン若しくはリニアー
低密度ポリエチレンみでは、ポリエチレン同士
がブロツキングして了つたが、高圧法低密度ポ
リエチレン若しくはリニアー低密度ポリエチレ
ンと、中密度ポリエチレン若しくは高密度ポリ
エチレンとを混合したのではブロツキングは起
こらなかつた。(b) When high-pressure low-density polyethylene or linear low-density polyethylene was used alone, the polyethylenes blocked each other, but when high-pressure low-density polyethylene or linear low-density polyethylene was mixed with medium-density polyethylene or high-density polyethylene, In this case, no blotting occurred.
(ハ) 片面に目止め層を設けた剥離紙用基材を高湿
度雰囲気下に放置した場合目止め層が中密度ポ
リエチレン若しくは高密度ポリエチレンのみで
は、第１図の様な大きな吸湿カールが起こり取
扱いが極めて困難であつた。(c) When a release paper base material with a sealing layer on one side is left in a high-humidity atmosphere, if the sealing layer is only medium-density polyethylene or high-density polyethylene, large moisture-absorbing curls as shown in Figure 1 will occur. It was extremely difficult to handle.
図中Ａは紙面、Ｂは高圧法低密度ポリエチレ
ン面、MDは縦方向を示す。 In the figure, A indicates the paper surface, B indicates the high-pressure low-density polyethylene surface, and MD indicates the vertical direction.
一方、中密度ポリエチレン若しくは高密度ポリ
エチレンに、高圧法低密度ポリエチレン若しくは
リニアー低密度ポリエチレンを混合したもので
は、吸湿カールは僅かで、取扱いも極めて容易で
あつた。 On the other hand, when high-pressure low-density polyethylene or linear low-density polyethylene was mixed with medium-density polyethylene or high-density polyethylene, moisture absorption curl was slight and handling was extremely easy.
次に本考案では平均密度が0.930〜0.950ｇ／cm3
の上述混合樹脂を用いなければならない。密度が
この限定された範囲内のものでなければ充分良好
な耐熱性が得られない。 Next, in this invention, the average density is 0.930 to 0.950 g/cm 3
The above-mentioned mixed resin must be used. Unless the density is within this limited range, sufficiently good heat resistance cannot be obtained.
更に本考案では紙と該混合樹脂層との接着強度
を80ｇ／20mm以上と限定している。接着強度が80
ｇ／20mm未満だと充分良好な耐熱性が得られな
い。 Furthermore, in the present invention, the adhesive strength between the paper and the mixed resin layer is limited to 80 g/20 mm or more. Adhesive strength is 80
If it is less than g/20mm, sufficiently good heat resistance cannot be obtained.
本考案における中密度ポリエチレン若しくは高
密度ポリエチレンはDSCによる融点が120℃以上
でなければならない。120℃未満であると良好な
耐熱性が得られない。なお、密度としては0.927
〜0.965ｇ／cm3、メルトフローレートとしては１
〜30ｇ／10分のものが使用される。 The medium-density polyethylene or high-density polyethylene used in the present invention must have a melting point of 120°C or higher by DSC. If the temperature is less than 120°C, good heat resistance cannot be obtained. In addition, the density is 0.927
~0.965g/cm 3 , melt flow rate is 1
~30g/10min is used.
また、本考案における高圧法低密度ポリエチレ
ン若しくはリニアー低密度ポリエチレンはDSC
による融点が100℃以上でなければならない。100
℃未満であると良好な耐熱性が得られない。な
お、密度としては0.910〜0.925ｇ／cm3、メルトフ
ローレートとしては２〜25ｇ／10分のものが使用
される。また、リニアー低密度ポリエチレンの組
成としては、エチレンとブチレン、ヘキセン或い
はオクテンとの共重合体が使用される。 In addition, the high-pressure low-density polyethylene or linear low-density polyethylene in this invention is DSC
The melting point must be 100℃ or higher. 100
If it is less than °C, good heat resistance cannot be obtained. The density used is 0.910 to 0.925 g/cm 3 and the melt flow rate is 2 to 25 g/10 min. Moreover, as a composition of linear low density polyethylene, a copolymer of ethylene and butylene, hexene or octene is used.
本考案における紙としては従来一般的に使用さ
れているもの、例えば上質紙、クラフト紙、グラ
シン紙および予め紙の片面（目止め層が設けられ
る面の反対面）にポリ塩化ビニリデン、ポリスチ
レン、スチレン・ブタジエン共重合体、ポリエチ
レンその他の樹脂が塗工されたものが挙げられ
る。 The paper used in this invention includes those commonly used in the past, such as high-quality paper, kraft paper, glassine paper, and polyvinylidene chloride, polystyrene, and styrene on one side of the paper (the opposite side to the side on which the sealing layer is provided). - Examples include those coated with butadiene copolymer, polyethylene, and other resins.
本考案における混合樹脂層の厚さは10〜50μ、
望ましくは15〜30μが良い。なお、混合樹脂層を
紙に設ける方法としては溶融押出塗工方式が望ま
しい。溶融押出塗工に当つての押出温度は、Ｔダ
イ出口樹脂温度で300〜350℃とすることが望まし
い。300℃未満であると樹脂と紙との良好な接着
が得難い。なお、樹脂と紙との接着を充分にする
には、この他予め紙にコロナ放電処理、接着増強
剤を塗工するなどの接着増強処理を施すか、押出
樹脂塗工厚を大とすることなどが有効である。 The thickness of the mixed resin layer in this invention is 10~50μ,
Desirably 15 to 30μ is good. Note that as a method for providing the mixed resin layer on paper, a melt extrusion coating method is preferable. The extrusion temperature during melt extrusion coating is preferably 300 to 350°C in terms of T-die exit resin temperature. If the temperature is less than 300°C, it is difficult to obtain good adhesion between the resin and paper. In addition, to ensure sufficient adhesion between the resin and paper, the paper must be subjected to adhesion enhancement treatments such as corona discharge treatment or coating with an adhesion enhancer, or the thickness of the extruded resin coating must be increased. etc. are valid.
本考案の剥離紙用基材のポリエチレン表面には
剥離剤との密着性を更に向上させる目的で、コロ
ナ放電処理を行なうことも可能である。 The polyethylene surface of the release paper base material of the present invention may be subjected to corona discharge treatment for the purpose of further improving the adhesion with the release agent.
更に本考案の片面に目止め層が設けられたタイ
プの剥離紙用基材の断面構成略図は第２図の通り
で剥離剤が塗工された後、その反対の紙面にポリ
塩化ビニリデン、ポリスチレン、スチレン・ブタ
ジエン共重合体、セルロース誘導体、低密度ポリ
エチレン、低密度ポリエチレンと中密度ポリエチ
レン若しくは高密度ポリエチレンとの混合樹脂そ
の他の樹脂などを塗工してもよい。その場合の断
面図は第３図の通りである。 Furthermore, a schematic cross-sectional diagram of the base material for release paper of the type in which a sealing layer is provided on one side of the present invention is shown in Figure 2. After the release agent is coated, polyvinylidene chloride and polystyrene are coated on the opposite side of the paper. , a styrene-butadiene copolymer, a cellulose derivative, low density polyethylene, a mixed resin of low density polyethylene and medium density polyethylene or high density polyethylene, or other resins may be coated. A cross-sectional view in that case is shown in FIG.
本考案に関する測定方法を次に説明する。 The measurement method related to the present invention will be explained below.
DSCによる融点測定：
化学同人発行第１版第２刷〓機器分析のてび
き(3)〓第６〜12頁の方法に準じた。但し、樹脂
試料量は10±0.5mgとし、まず温度を160℃まで
上昇させ５分間放置しその後67℃まで下げ１分
放置後、５℃／分の速度で160℃まで昇温、吸
熱ピーク温度を融点とした。 Melting point measurement by DSC: According to the method described in Kagaku Doujin Publishing, 1st edition, 2nd printing, Instructions for Instrumental Analysis (3), pages 6 to 12. However, the amount of resin sample was 10 ± 0.5 mg, and the temperature was first raised to 160°C, left for 5 minutes, then lowered to 67°C, left for 1 minute, and then raised to 160°C at a rate of 5°C/min until the endothermic peak temperature was reached. was taken as the melting point.
密度：
JIS K6760，JIS K7112
紙と樹脂層との接着強度：
テンシロンを用いて20℃、65％RH下で変形
速度300mm／分で樹脂層を第４図の如くＴ型剥
離し接着強度を測定した。 Density: JIS K6760, JIS K7112 Adhesive strength between paper and resin layer: Measure the adhesive strength by peeling the resin layer in a T-shape as shown in Figure 4 using Tensilon at 20℃ and 65%RH at a deformation rate of 300mm/min. did.
なお、接着が極めて良く紙と樹脂層間で剥離
せず、紙層間で剥離したものについては全て接
着強度80ｇ／20mm以上と見做した。図中３は
紙、４は樹脂層、５はテンシロンロードセル側
チヤツクを示す。 In addition, all cases where the adhesion was extremely good and did not peel between the paper and resin layer, but did peel between the paper layers, were considered to have an adhesive strength of 80 g/20 mm or more. In the figure, 3 is paper, 4 is a resin layer, and 5 is a chuck on the Tensilon load cell side.
第１図は従来の剥離紙用基材の代表的なカール
状態を示し、第２図および第３図は本考案の剥離
紙用基材の断面構成略図、第４図は接着強度測定
のためのＴ型剥離の測定概略図である。
図中、１……紙、２……DSCによる融点120℃
以上の中密度ポリエチレン若しくは高密度ポリエ
チレンと、DSCによる融点100℃以上のリニアー
低密度ポリエチレン若しくは高圧法低密度ポリエ
チレンとから成る平均密度0.930〜0.950ｇ／cm3の
混合樹脂層、３……紙、４……樹脂層、５……テ
ンシロンロードセル側チヤツク。
Figure 1 shows a typical curled state of a conventional base material for release paper, Figures 2 and 3 are schematic cross-sectional diagrams of the base material for release paper of the present invention, and Figure 4 is a diagram for measuring adhesive strength. FIG. 2 is a schematic diagram of measurement of T-shaped peeling. In the figure, 1...Paper, 2...Melting point 120℃ by DSC
A mixed resin layer with an average density of 0.930 to 0.950 g/cm 3 consisting of the above medium-density polyethylene or high-density polyethylene and linear low-density polyethylene or high-pressure low-density polyethylene with a melting point of 100 ° C. or higher by DSC, 3...paper, 4...Resin layer, 5...Tensilon load cell side chuck.
Claims (1)
差走査熱量計）による融点120℃以上の中密度
ポリエチレン若しくは高密度ポリエチレンと、 (B) DSCによる融点100℃以上のリニアー低密度
ポリエチレン若しくは高圧法低密度ポリエチレ
ンと からなる平均密度0.930〜0.950ｇ／cm3の(A)(B)混合
樹脂層が設けられ、且つ紙と該混合樹脂層との接
着強度が80ｇ／20mm以上である剥離紙用基材。[Scope of Claim for Utility Model Registration] One or both sides of the paper contains (A) medium density polyethylene or high density polyethylene with a melting point of 120°C or higher as measured by DSC (differential scanning calorimeter), and (B) a melting point of 100°C as measured by DSC. A mixed resin layer (A) and (B) having an average density of 0.930 to 0.950 g/cm 3 made of the above linear low density polyethylene or high pressure processed low density polyethylene is provided, and the adhesive strength between the paper and the mixed resin layer is Base material for release paper that is 80g/20mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2239883U JPS59149944U (en) | 1983-02-18 | 1983-02-18 | Base material for release paper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2239883U JPS59149944U (en) | 1983-02-18 | 1983-02-18 | Base material for release paper |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59149944U JPS59149944U (en) | 1984-10-06 |
| JPS6223790Y2 true JPS6223790Y2 (en) | 1987-06-17 |
Family
ID=30153493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2239883U Granted JPS59149944U (en) | 1983-02-18 | 1983-02-18 | Base material for release paper |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59149944U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007169466A (en) * | 2005-12-22 | 2007-07-05 | Tosoh Corp | Release liner |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2712127B2 (en) * | 1988-10-03 | 1998-02-10 | 王子製紙株式会社 | Production method of adhesive sheet |
| SE542945C2 (en) * | 2018-10-03 | 2020-09-22 | Stora Enso Oyj | Polymer coated paper and paperboard |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259708A (en) * | 1975-11-12 | 1977-05-17 | Tomoegawa Paper Co Ltd | Production of release paper |
| JPS53120791A (en) * | 1977-03-31 | 1978-10-21 | Fuji Photo Film Co Ltd | Melt extrusion-coated material |
| JPS5452A (en) * | 1977-06-03 | 1979-01-05 | Idemitsu Petrochemical Co | Polyethylene composition for extremely thin film forming |
| JPS553986A (en) * | 1978-06-26 | 1980-01-12 | Tokyo Serofuanshi Kk | Polyolefin packing film |
| JPS5539386A (en) * | 1978-09-14 | 1980-03-19 | Oishi Sangyo Kk | Film cylinder of synthetic resin that improves blocking property |
| JPS5582140A (en) * | 1978-12-18 | 1980-06-20 | Mitsubishi Chem Ind Ltd | Polyolefin composition |
| JPS57109845A (en) * | 1980-11-13 | 1982-07-08 | Bp Chimie Sa | Polyethylene composition and manufacture |
| JPS57117547A (en) * | 1980-11-26 | 1982-07-22 | Union Carbide Corp | Extrusion coating composition containing linear low density ethylene hydrocarbon copolymer |
-
1983
- 1983-02-18 JP JP2239883U patent/JPS59149944U/en active Granted
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5259708A (en) * | 1975-11-12 | 1977-05-17 | Tomoegawa Paper Co Ltd | Production of release paper |
| JPS53120791A (en) * | 1977-03-31 | 1978-10-21 | Fuji Photo Film Co Ltd | Melt extrusion-coated material |
| JPS5452A (en) * | 1977-06-03 | 1979-01-05 | Idemitsu Petrochemical Co | Polyethylene composition for extremely thin film forming |
| JPS553986A (en) * | 1978-06-26 | 1980-01-12 | Tokyo Serofuanshi Kk | Polyolefin packing film |
| JPS5539386A (en) * | 1978-09-14 | 1980-03-19 | Oishi Sangyo Kk | Film cylinder of synthetic resin that improves blocking property |
| JPS5582140A (en) * | 1978-12-18 | 1980-06-20 | Mitsubishi Chem Ind Ltd | Polyolefin composition |
| JPS57109845A (en) * | 1980-11-13 | 1982-07-08 | Bp Chimie Sa | Polyethylene composition and manufacture |
| JPS57117547A (en) * | 1980-11-26 | 1982-07-22 | Union Carbide Corp | Extrusion coating composition containing linear low density ethylene hydrocarbon copolymer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007169466A (en) * | 2005-12-22 | 2007-07-05 | Tosoh Corp | Release liner |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59149944U (en) | 1984-10-06 |
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