JPS62234314A - Electronic parts packaging - Google Patents
Electronic parts packagingInfo
- Publication number
- JPS62234314A JPS62234314A JP62029069A JP2906987A JPS62234314A JP S62234314 A JPS62234314 A JP S62234314A JP 62029069 A JP62029069 A JP 62029069A JP 2906987 A JP2906987 A JP 2906987A JP S62234314 A JPS62234314 A JP S62234314A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- thermosetting resin
- powdered
- electronic parts
- film capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 238000003618 dip coating Methods 0.000 description 4
- 238000001879 gelation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は電子部品の外装方法に関するものである。[Detailed description of the invention] The present invention relates to a method for packaging electronic components.
近年、電子部品の分野においては、高性能、高信頼性、
小型化、６寸法の縮小規制などの市場の強い要求に応え
てい（ことはもちろんのこと、人件費や材料費などの急
上昇により製造原価の上昇をいかに押え吸収してい（か
という大きな問題が発生してきていることは周知の通り
である。In recent years, in the field of electronic components, high performance, high reliability,
In addition to meeting the strong demands of the market such as miniaturization and regulations for reduction of 6 dimensions, a major problem has arisen: how to suppress and absorb the rise in manufacturing costs due to the sharp increase in labor and material costs. What has been happening is well known.
そこで、本発明者らはこれらの問題が解決でき、製造コ
ストが安く、０寸法規制が容易に、しかも任意に行なえ
、量産性に優れた電子部品の新しい外装方法を開発する
ことを目的として鋭意研究を重ねた結果、粉末状の熱硬
化性樹脂は材料の取り扱いが容易でしかも自動化量産塗
装性に優れ、その上ゲル化進行の管理がやりやすく、ま
たゲル化途中でも樹脂の軟化温度以下に冷却すれば固化
し、この段階での皮膜は機械的強度が非常に弱く、しか
も再加熱すれば再び外装皮膜は溶融するという液状樹脂
や粉末状でも熱可塑性樹脂にはみられない特異な非常に
有用な性質を具備しているということを見出した。Therefore, the present inventors have worked hard to develop a new packaging method for electronic components that can solve these problems, has low manufacturing costs, allows easy and arbitrary zero-dimensional regulation, and is highly suitable for mass production. As a result of repeated research, we have found that powdered thermosetting resins are easy to handle, have excellent coating properties for automated mass production, and are easy to control as they progress through gelation, and can be kept below the softening temperature of the resin even during gelation. It solidifies when cooled, and the mechanical strength of the film at this stage is very weak.Furthermore, if it is reheated, the exterior film will melt again, which is a very unique property not found in thermoplastic resins even in liquid or powder form. It was discovered that it has useful properties.
すなわち、流動浸漬塗装法、静電流動浸漬塗装法、静電
吹付塗装法、その他の方法（電子部品に粉末状の熱硬化
性樹脂を付着させる方法はいかなる方法でもよい）によ
り粉末状の熱硬化性樹脂を電子部品素子の外周部に付着
させ、その後付着させたこの粉末状の熱硬化性樹脂を加
熱し、溶融、−次硬化（半ゲル化）させた後、粉末状の
熱硬化性樹脂の軟化温度以下に冷却し、しかる後その樹
脂表面に熱硬化型の表示インキを用いて常法にて表示を
行ない、その後規制６ヰ法に従い、リード線の余分な部
分に付着している樹脂をプレス方式らしくは回転ブラシ
方式などにて除去（以下Ｇ寸処理という）し、再び必要
な時間加熱することにより外装樹脂、表示インキを完全
硬化させることにより、防湿性、絶縁性に優れ、その上
任意の６寸法規制にも合格し、美麗なる外装皮膜を具備
した電子部品が得られることを見出したものである。That is, powder thermosetting resin can be applied by fluidized dip coating, electrostatic dynamic dip coating, electrostatic spray coating, or any other method (any method may be used to attach powdered thermosetting resin to electronic components). The thermosetting resin is attached to the outer periphery of the electronic component element, and then the attached powdered thermosetting resin is heated, melted, and then hardened (semi-gelled). The resin is cooled to the softening temperature of The material is removed using a rotating brush method (hereinafter referred to as G-dimension processing) similar to the press method, and then heated again for the required time to completely cure the exterior resin and display ink, resulting in excellent moisture resistance and insulation properties. It has been discovered that an electronic component can be obtained which passes the above six arbitrary dimension regulations and has a beautiful exterior film.
このような新しい本発明の電子部品の外装方法は、量産
性に優れていることはもちろんのこと、機械的に皮膜破
壊型でＧ寸処理を行なった部分も再溶融するため、破壊
部分も完全に修正され、商品価値の優れたより完全な防
湿皮膜となるとともに、表示部も外装皮膜を機械的に削
らなければ消えない植め込みタイプの完全表示となる。The new packaging method for electronic components of the present invention is not only superior in mass production, but also mechanically destroys the G dimension and remelts the part, so the destroyed part is completely removed. This has been revised to create a more complete moisture-proof coating with excellent commercial value, and the display is now an embedded type that cannot be erased without mechanically scraping the exterior coating.
このように本発明の外装方法は、市場の要求を完全にく
み入れた、理想的な外装方法である。以下、本発明の内
容を具体的な実施例に従って詳細に説明する。As described above, the packaging method of the present invention is an ideal packaging method that fully incorporates market demands. Hereinafter, the content of the present invention will be explained in detail according to specific examples.
実施例１
エポキシ樹脂ワニスにてピンホール発生防止処理を施し
た電子部品、例えばフィルムコンデンサの素子を１３０
℃に加熱しておき、その素子上に軟化温度が７０〜８０
℃の粉末状エポキシ樹脂を流動浸漬塗装する。しかる後
、これを１２０〜１３０℃で０．５〜３分間加熱し、フ
ィルムコンデンサの表面に付着している粉末状のエポキ
シ樹脂を溶融、−次硬化させる。その後、加熱炉より取
り出しフィルムコンデンサを４０℃以下に冷却した。そ
の後、そのフィルムコンデンサの樹脂表面に熱硬化型の
表示インキで表示した。その後、Ｇ寸法親制御ｎａに従
い、リード線に付着した余分な樹脂をプレス方式にて潰
し、しかる後回転金属ワイヤーブラシにて除去した。そ
して、再び１３０℃に設定した加熱炉中に９０〜１２０
分間放、置するこ装によりエポキシ樹脂を完全硬化させ
、美麗なる絶縁防湿皮膜を具備し、その上６寸法規制御
ｍ＋ａに１００％合格するフィルムコンデンサを得た。Example 1 130 electronic components, such as film capacitor elements, were treated with epoxy resin varnish to prevent pinhole formation.
℃, and the softening temperature is 70~80℃ on the element.
Fluid dip coating with powdered epoxy resin at °C. Thereafter, this is heated at 120 to 130 DEG C. for 0.5 to 3 minutes to melt and further cure the powdered epoxy resin adhering to the surface of the film capacitor. Thereafter, the film capacitor was taken out of the heating furnace and cooled to 40° C. or lower. Thereafter, the resin surface of the film capacitor was marked with thermosetting display ink. Thereafter, in accordance with the G dimension parent control na, excess resin adhering to the lead wires was crushed using a press method, and then removed using a rotating metal wire brush. Then, place it in a heating furnace set at 130℃ again.
The epoxy resin was completely cured by allowing it to stand for a minute, and a film capacitor was obtained which had a beautiful insulating and moisture-proof film and also passed the 6 dimensional control (m+a) with 100%.
図に上記外装工程を示しており、図において１はフィル
ムコンデンサ素子、２は保持具、３は１次加熱部、４は
外装設偏、５は粉末状のエポキシ樹脂、６は冷却部、７
は表示部、８はプレス部、９は回転ブラシ部、１０は２
次加熱部である。The above-mentioned exterior packaging process is shown in the figure, where 1 is the film capacitor element, 2 is the holder, 3 is the primary heating section, 4 is the exterior installation part, 5 is the powdered epoxy resin, 6 is the cooling section, and 7
1 is a display part, 8 is a press part, 9 is a rotating brush part, 10 is 2
This is the next heating section.
実施例２
エポキシ樹脂ワニスにてピンホール発生防止処理を施し
た電子部品、例えばフィルムコンデンサの素子に軟化温
度が６０〜７０℃の粉末状エポキシ樹脂を静電流動浸漬
塗装法にて塗装した後、１３０〜１５０℃で３０秒間加
熱し、フィルムコンデンサの素子表面に付着させた粉末
状エポキシ樹脂を溶融させ、−次硬化させた後取り出し
、フィルムコンデンサを４０℃に冷却した。しかる後、
実施例１と同様に表示、Ｇ寸処理を行ない、９０℃に設
定した加熱炉中に９０〜１２０分間放置して完全硬化さ
せることにより、美麗なる絶縁防湿皮膜を具備し、Ｇ寸
法親制御ｎａに１００％合格するフィルムコンデンサを
得た。Example 2 After applying a powdered epoxy resin with a softening temperature of 60 to 70°C to an electronic component, such as a film capacitor element, which has been subjected to pinhole prevention treatment with epoxy resin varnish, using an electrostatic dynamic dip coating method, The powdered epoxy resin adhered to the element surface of the film capacitor was heated for 30 seconds at 130 to 150°C, and after being cured, it was taken out and the film capacitor was cooled to 40°C. After that,
The display and G dimension treatment were carried out in the same manner as in Example 1, and the coating was left in a heating oven set at 90°C for 90 to 120 minutes to completely cure, thereby providing a beautiful insulation and moisture-proof film, with G dimension parent control na A film capacitor that passed the test 100% was obtained.
以上のように本発明の電子部品の外装方法は、量産性に
優れていることはもちろんのこと、本発明により得られ
た電子部品は美麗なる絶縁防湿皮膜を異面し、高性能、
高信頼性を有し、また表示部も容易に消えないものとす
ることができる等、最近の要求に充分応えることができ
る非常に優れた方法である。As described above, the electronic component packaging method of the present invention is not only excellent in mass production, but also has a beautiful insulating and moisture-proof coating, high performance, and high performance.
This is an extremely excellent method that can fully meet recent demands, such as having high reliability and making the display part not easily erased.
図は本発明による電子部品の外装方法における工程を示
す工程図である。The figure is a process diagram showing the steps in the packaging method for electronic components according to the present invention.
Claims (1)
の後その付着させた熱硬化性樹脂を加熱溶融させた後、
粉末状の熱硬化性樹脂の軟化温度以下に冷却し、その後
樹脂表面に熱硬化型の表示インキにより表示を行なった
後、再度加熱して熱硬化性樹脂および表示インキを完全
硬化させることを特徴とする電子部品の外装方法。After attaching a powdered thermosetting resin to an electronic component element and then heating and melting the attached thermosetting resin,
It is characterized by cooling the powdered thermosetting resin to below the softening temperature, then marking the resin surface with thermosetting display ink, and then heating again to completely harden the thermosetting resin and display ink. Exterior packaging method for electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62029069A JPS62234314A (en) | 1987-02-10 | 1987-02-10 | Electronic parts packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62029069A JPS62234314A (en) | 1987-02-10 | 1987-02-10 | Electronic parts packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62234314A true JPS62234314A (en) | 1987-10-14 |
Family
ID=12266069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62029069A Pending JPS62234314A (en) | 1987-02-10 | 1987-02-10 | Electronic parts packaging |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62234314A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289102A (en) * | 1990-04-06 | 1991-12-19 | Nissei Denki Kk | Electronic parts and manufacture thereof |
-
1987
- 1987-02-10 JP JP62029069A patent/JPS62234314A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03289102A (en) * | 1990-04-06 | 1991-12-19 | Nissei Denki Kk | Electronic parts and manufacture thereof |
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