JPS6223064Y2 - - Google Patents
Info
- Publication number
- JPS6223064Y2 JPS6223064Y2 JP1981063353U JP6335381U JPS6223064Y2 JP S6223064 Y2 JPS6223064 Y2 JP S6223064Y2 JP 1981063353 U JP1981063353 U JP 1981063353U JP 6335381 U JP6335381 U JP 6335381U JP S6223064 Y2 JPS6223064 Y2 JP S6223064Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal pin
- base
- frequency coil
- coil
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 4
- 239000000057 synthetic resin Substances 0.000 claims description 4
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Coils Or Transformers For Communication (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
【考案の詳細な説明】
本考案は高周波コイルのベース部形状に関する
もので、半田デイツプ時に熱のために植立した端
子ピンの位置の狂い、その傾斜等の変形を防止す
る構造を提供するものである。[Detailed description of the invention] The present invention relates to the shape of the base of a high-frequency coil, and provides a structure that prevents the terminal pins planted from being misaligned due to heat during solder dipping, and from being deformed such as inclination. It is.
従来の高周波コイルは第１図に示すように端子
ピン１が熱可そ性樹脂からなるベース部２の平ら
な底面、即ちコイル本体３が配置されてある面と
は反対の底面に植立されてある。上面のコイル本
体３の端末リード線４はベース部２の側面に設け
られた配線溝５にそつて折れ曲り底面に到り端子
ピン１にからげ配線するようにしてある。この様
に構成されている従来の高周波コイルを半田デイ
ツプによりリード線４を端子ピン１の基部に半田
付、固定しようとする場合、ベース部２の底面が
半田槽の液面に接するために一部が熱のために変
形し、また端子ピン１全体が可熱され、植立され
ている部分の周囲の熱可そ性合成樹脂を溶融して
しまうために端子ピンが成形時に生じた応力に従
う方向即ちベース部の構造、樹脂射出口等によつ
てきまるが通常コイルの外側方向に傾斜し、その
まま固化してしまうのでピン曲りが発生する。従
つて端子ピンの先端位置は図の点線の如く大巾に
ずれてコイルを所定のプリント基板取付穴に挿入
しマウントすることが出来なくなつてしまう。 As shown in Fig. 1, in a conventional high-frequency coil, a terminal pin 1 is installed on the flat bottom surface of a base portion 2 made of thermoplastic resin, that is, on the bottom surface opposite to the surface on which the coil body 3 is arranged. There is. The terminal lead wire 4 of the coil body 3 on the upper surface is bent along a wiring groove 5 provided on the side surface of the base portion 2, reaches the bottom surface, and is wired over the terminal pin 1. When attempting to solder and fix the lead wire 4 to the base of the terminal pin 1 using a solder dip in the conventional high-frequency coil configured in this way, the bottom surface of the base portion 2 comes into contact with the liquid level of the solder bath, so The terminal pin deforms due to the heat, and the entire terminal pin 1 is heated, melting the thermofusible synthetic resin around the planted part, so the terminal pin is subject to the stress generated during molding. Although it depends on the direction, ie, the structure of the base, the resin injection port, etc., the pin usually tilts toward the outside of the coil and solidifies as it is, resulting in pin bending. Therefore, the position of the tip of the terminal pin is greatly shifted as shown by the dotted line in the figure, making it impossible to insert and mount the coil into a predetermined printed circuit board mounting hole.
本考案は熱可そ性樹脂からなるベース部の半田
デイツプ時に生ずるこのような事故を防止するよ
うにした高周波コイルを提供するものである。 The present invention provides a high frequency coil that prevents such accidents that occur when the base portion made of thermoplastic resin is soldered.
本案の１実施例を図面によつて説明する。第２
図はその底面図で第３図はその一部の側断面図で
ある。図において１は端子ピンで２はコイルの合
成樹脂製のベース部であり、３はコイル本体、４
はその端末リード線である。５はベース部２の側
面にもうけた配線溝で６は本案の特徴とする半円
形の突堤である。この突堤６の設ける位置、方向
は端子ピン１が最も傾斜しやすいところにそれに
逆らうように設けるのが最も効果的で、端子ピン
１の受ける傾斜応力に耐える厚みと高さをもたせ
るものである。即ち第４図においてその矢印の長
さでその応力の大きさを表示してあるように端子
ピン１の異なつた部分における樹脂の応力の違い
を総合の応力バランスをとつて周囲の樹脂が加熱
溶融されても原形位置を保つようにしてあるので
端子ピン１の傾斜は全くなくなりベース部底面に
垂直に保持のまま周囲の樹脂が溶融し、そのまま
冷却固化されるわけである。 An embodiment of the present invention will be described with reference to the drawings. Second
The figure is a bottom view, and FIG. 3 is a side sectional view of a portion thereof. In the figure, 1 is the terminal pin, 2 is the synthetic resin base of the coil, 3 is the coil body, and 4
is its terminal lead wire. Reference numeral 5 is a wiring groove formed on the side surface of the base portion 2, and reference numeral 6 is a semicircular jetty which is a feature of the present invention. The most effective position and direction of this jetty 6 is to provide it at a location where the terminal pin 1 is most likely to tilt, so as to oppose it, and to provide a thickness and height that can withstand the tilting stress that the terminal pin 1 receives. In other words, as shown in Figure 4, the length of the arrow indicates the magnitude of the stress, the difference in stress in the resin at different parts of the terminal pin 1 is balanced by the overall stress, and the surrounding resin is heated and melted. Since the terminal pin 1 is designed to maintain its original position even when the terminal pin 1 is bent, there is no inclination at all, and the surrounding resin is melted while being held perpendicular to the bottom surface of the base portion, and the terminal pin 1 is cooled and solidified as it is.
本考案は以上のように新たな部品やピン曲り修
正工程等は全く必要なくなり、その合成樹脂成形
金型を１部改修するのみですむので、その製造コ
ストも高くならずその実用上の効果は大なるもの
がある。 As described above, the present invention does not require any new parts or pin bend correction processes, and only requires modifying a portion of the synthetic resin mold, so the manufacturing cost does not increase and its practical effects are low. There is something big.
第１図は従来の高周波コイルのベース部の側断
面図で、第２図は本考案の１実施例の底面図、第
３図は同じくその１部側断面図で第４図はその要
部側断面図である。
１……端子ピン、２……ベース部、３……リー
ド線、４……コイル本体、５……配線溝、６……
突堤。
Fig. 1 is a side sectional view of the base of a conventional high-frequency coil, Fig. 2 is a bottom view of an embodiment of the present invention, Fig. 3 is a side sectional view of a part thereof, and Fig. 4 is the main part thereof. FIG. 1...Terminal pin, 2...Base part, 3...Lead wire, 4...Coil body, 5...Wiring groove, 6...
Jetty.
Claims (1)
ス部において、その底面に端子ピンを植立し、端
子ピン基部に接して半円形の突堤を設けたことを
特徴とする高周波コイル。 A high-frequency coil characterized in that a terminal pin is planted on the bottom of the base of the high-frequency coil made of thermoplastic synthetic resin, and a semicircular jetty is provided in contact with the base of the terminal pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981063353U JPS6223064Y2 (en) | 1981-04-30 | 1981-04-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981063353U JPS6223064Y2 (en) | 1981-04-30 | 1981-04-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57175414U JPS57175414U (en) | 1982-11-05 |
| JPS6223064Y2 true JPS6223064Y2 (en) | 1987-06-12 |
Family
ID=29859477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981063353U Expired JPS6223064Y2 (en) | 1981-04-30 | 1981-04-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6223064Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5345241U (en) * | 1976-09-20 | 1978-04-18 |
-
1981
- 1981-04-30 JP JP1981063353U patent/JPS6223064Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5345241U (en) * | 1976-09-20 | 1978-04-18 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57175414U (en) | 1982-11-05 |
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