JPS6222819Y2 - - Google Patents
Info
- Publication number
- JPS6222819Y2 JPS6222819Y2 JP1981052830U JP5283081U JPS6222819Y2 JP S6222819 Y2 JPS6222819 Y2 JP S6222819Y2 JP 1981052830 U JP1981052830 U JP 1981052830U JP 5283081 U JP5283081 U JP 5283081U JP S6222819 Y2 JPS6222819 Y2 JP S6222819Y2
- Authority
- JP
- Japan
- Prior art keywords
- temperature sensor
- base film
- connector
- temperature
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 8
- 238000010586 diagram Methods 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Description
【考案の詳細な説明】
本考案は、感温素子（サーミスタ）と固定抵抗
器とから成る温度センサの改良に係り、特に、感
温素子と固定抵抗器との接触信頼性の向上及び温
度センサ交換時の作業性の向上を図つたものであ
る。[Detailed description of the invention] The present invention relates to the improvement of a temperature sensor consisting of a temperature sensing element (thermistor) and a fixed resistor, and in particular, to improving the contact reliability between the temperature sensing element and the fixed resistor, and This is intended to improve work efficiency during replacement.
温度制御装置は、その構成要素を大きく分類し
てみると、温度センサ、制御回路、及び、発熱体
（ヒータ）とから成つているが、例えば、発熱体
の異常等によつて温度センサが故障したり、或い
は、制御回路内の電気部品が故障したような場合
に、温度センサ又は制御回路のいずれか一方を交
換しなければならない。しかし、交換するために
は両者が１対１で対応する必要があり、そのため
に、固定抵抗、可変抵抗等が設けられている。例
えば、温度センサは、恒温槽内で感温素子の抵抗
を測定し、それに必要な抵抗値の固定抵抗を接続
し、一方、制御回路側は、コネクタに温度センサ
と等価な抵抗を接続し、これを可変抵抗によつて
補正するようにしている。このように、温度セン
サ及び制御回路がそれぞれ補正してあれば、いず
れか一方を交換することが可能となる。 Broadly speaking, a temperature control device consists of a temperature sensor, a control circuit, and a heating element (heater). Either the temperature sensor or the control circuit must be replaced if the temperature sensor or the control circuit fails, or if an electrical component in the control circuit fails. However, in order to replace them, it is necessary to have a one-to-one correspondence between the two, and for this purpose fixed resistors, variable resistors, etc. are provided. For example, a temperature sensor measures the resistance of a temperature sensing element in a thermostatic chamber and connects a fixed resistor with the required resistance value to it.On the other hand, on the control circuit side, connect a resistor equivalent to the temperature sensor to the connector, This is corrected using a variable resistor. In this way, if the temperature sensor and the control circuit are each corrected, it becomes possible to replace either one.
第１図は、従来の温度センサの一例を示す全体
構成図で、図中、１は感熱素子、２は被覆ガラ
ス、３はリード線、４は接続子、５は固定抵抗
器、６は半田接続部、７は熱収縮チユーブで、図
示のように、感熱素子（サーミスタ）１のリード
線端部に固定抵抗器５を接続し、該固定抵抗器の
リード線を金属製コネクタ（接続子）４に接続し
ている。しかし、上記従来の温度センサは、リー
ド線３に固定抵抗器５を接続する場合、その接続
を半田付、或いは、圧着によつて行うが、リード
線同志の接続は作業性が非常に悪く、リード線の
捩れ等により接触不良が出やすい。また、接続部
を絶縁するために、熱収縮チユーブ等を必要と
し、コスト高になる等の欠点があつた。 FIG. 1 is an overall configuration diagram showing an example of a conventional temperature sensor. In the figure, 1 is a heat-sensitive element, 2 is a coated glass, 3 is a lead wire, 4 is a connector, 5 is a fixed resistor, and 6 is a solder. The connection part 7 is a heat shrinkable tube, and as shown in the figure, a fixed resistor 5 is connected to the lead wire end of the heat sensitive element (thermistor) 1, and the lead wire of the fixed resistor is connected to a metal connector (connector). Connected to 4. However, in the above conventional temperature sensor, when connecting the fixed resistor 5 to the lead wire 3, the connection is made by soldering or crimping, but the workability of connecting the lead wires to each other is very poor. Poor contact is likely to occur due to twisting of the lead wires, etc. Further, in order to insulate the connecting portion, a heat shrink tube or the like is required, which has the disadvantage of increasing costs.
第２図は、第１図に示した従来の温度センサを
使用した温度制御装置の一例を示す図で、図中、
１０はヒータ、１１はヒートローラ、１２は加圧
ローラ、１３は温度制御部、１４はクランプ、１
５はコネクタで、図示のように、温度センサのリ
ード線３はクランプ１４によつて固定部材に固着
され、接続子４は温度制御部１３のコネクタ１５
と接続されている。従つて、温度センサを交換す
る時は、わざわざクランプ１４をはずし、コネク
タ１５から接続子４を抜き、また、新しい温度セ
ンサを取り付けなければならなかつた。 FIG. 2 is a diagram showing an example of a temperature control device using the conventional temperature sensor shown in FIG.
10 is a heater, 11 is a heat roller, 12 is a pressure roller, 13 is a temperature control section, 14 is a clamp, 1
5 is a connector, and as shown in the figure, the lead wire 3 of the temperature sensor is fixed to a fixed member by a clamp 14, and the connector 4 is connected to a connector 15 of the temperature control unit 13.
is connected to. Therefore, when replacing the temperature sensor, it was necessary to remove the clamp 14, disconnect the connector 4 from the connector 15, and install a new temperature sensor.
本考案は、上述のごとき従来技術の欠点を解消
した温度センサに係り、特に、温度センサの感温
素子（サーミスタ）と固定抵抗器の接触信頼性を
向上させるとともに温度センサ交換時の作業性の
向上を図つたものである。 The present invention relates to a temperature sensor that eliminates the drawbacks of the conventional technology as described above, and in particular improves the contact reliability between the temperature sensing element (thermistor) of the temperature sensor and a fixed resistor, and also improves the workability when replacing the temperature sensor. This is an attempt to improve the results.
第３図は、本考案による温度センサの平面図、
第４図は、第３図のオーバフイルムとベースフイ
ルムの間隔を誇張して示す概念的斜視図で、図
中、２０はベースフイルム、２１は該ベースフイ
ルム２０上に配設された銅箔等の電気回路、２２
はオーバフイルム、２３は該オーバフイルム２２
に設けられた開口部で、第４図の誇張斜視図から
明らかなように、感温素子１及び固定抵抗５はオ
ーバフイルム２２に設けられた開口部２３を通し
てベースフイルム２０上の電気回路２１に接続さ
れ、接続後の開口部はシリコンゴム等によつて閉
塞される。このようにして感温素子及び固定抵抗
器は、ベースフイルム２０、電気回路（パター
ン）２１、及び、オーバフイルム２２等よりなる
フレキシブル基板に接続されるが、その接続は、
フレキシブル基板に半田付け（又は溶接）するこ
とによつて行われるので、接触の信頼性が高く、
また、作業性もはるかに良い。更に、温度センサ
交換時、温度センサの小さなフレキシブル基板だ
けで済み、サービス性が非常に良く、部品コスト
も安価である等の利点がある。 FIG. 3 is a plan view of the temperature sensor according to the present invention;
FIG. 4 is a conceptual perspective view exaggerating the distance between the over film and the base film in FIG. electric circuit, 22
is an overfilm, 23 is the overfilm 22
As is clear from the exaggerated perspective view of FIG. After the connection, the opening is closed with silicone rubber or the like. In this way, the temperature sensing element and the fixed resistor are connected to the flexible substrate consisting of the base film 20, the electric circuit (pattern) 21, the over film 22, etc., but the connection is as follows.
Since this is done by soldering (or welding) to a flexible board, the contact is highly reliable.
Also, the workability is much better. Furthermore, when replacing the temperature sensor, only a small flexible board is required for the temperature sensor, which provides excellent serviceability and low component costs.
第５図は、前述のごとくして構成された温度セ
ンサを温度制御部へ接続するフレキシブル基板の
接続部平面図で、図中、は温度センサに接続さ
れたフレキシブル基板、は温度制御部に接続さ
れたフレキシブル基板、３０はこれらフレキシブ
ル基板とを接続するコネクタで、該コネクタ
３０は金属製のコネクタ端子３１を有し、このコ
ネクタ端子３１によつてフレキシブル基板の電
気回路２１とフレキシブル基板の電気回路２１
を電気的に接続している。 FIG. 5 is a plan view of the connection part of the flexible board that connects the temperature sensor configured as described above to the temperature control section. In the figure, indicates the flexible board connected to the temperature sensor, and indicates connection to the temperature control section. The connector 30 has a metal connector terminal 31, and the connector terminal 31 connects the electric circuit 21 of the flexible substrate to the electric circuit of the flexible substrate. 21
are electrically connected.
第６図は、上述のごときコネクタ３０を用いて
温度センサを配設した時の概略全体構成図で、コ
ネクタ３０は固定部材に固定されており、フレキ
シブル基板の長さは該コネクタ３０の位置と感
温素子１がヒートローラ１１に接触する位置を考
慮して過不足ない長さに予め定められている。従
つて、感温素子１がヒートローラ１１に正しくセ
ツトされていなければ、感温素子と温度制御部と
が接続されないので、トランジスタTrがオンせ
ず、温度制御部１３の出力OUT2がハイレベルと
なり、断線検知としての機能を持たせることがで
きる。なお、感温素子と温度制御部が正常に接続
されている時は、低温時、感温素子１は大抵抗で
あり、従つて、コンパレータOPの“＋”入力が
“−”入力に対してハイレベルで、出力がハイレ
ベルとなつてヒータがオンし、ヒータの温度が高
くなると、感温素子１の抵抗が小さくなり、従つ
て、コンパレータOPの“＋”入力が“−”入力
に対してローレベルで、出力がローレベルとなつ
てヒータがオフする。 FIG. 6 is a schematic overall configuration diagram when a temperature sensor is installed using the connector 30 as described above. The connector 30 is fixed to a fixed member, and the length of the flexible board is determined by the position of the connector 30. The length is predetermined in consideration of the position where the temperature sensing element 1 contacts the heat roller 11, and is set to an appropriate length. Therefore, if the temperature sensing element 1 is not correctly set on the heat roller 11, the temperature sensing element and the temperature control section will not be connected, the transistor Tr will not turn on, and the output OUT 2 of the temperature control section 13 will be at a high level. Therefore, it can have a function as a disconnection detection. Note that when the temperature sensing element and the temperature control section are connected normally, the temperature sensing element 1 has a large resistance at low temperatures, and therefore the "+" input of the comparator OP is less than the "-" input. When the output becomes high level and the heater turns on, and the temperature of the heater increases, the resistance of the temperature sensing element 1 decreases, and therefore the "+" input of the comparator OP becomes smaller than the "-" input. When the output is low level, the output becomes low level and the heater turns off.
以上の説明から明らかなように、本考案による
と、フレキシブル基板上の電気回路に温度セン
サ、固定抵抗等を接続するようにしたので、これ
ら温度センサ、固定抵抗等の接続が容易であり、
また、フレキシブル基板の端部のオーバレイフイ
ルムを開口して該オーバレイフイルム上の電気回
路を露出し、ベースフイルムと該ベースフイルム
上の電気回路を金属製のコネクタ端子で挾んで接
続するようにしたので、温度センサ交換時の作業
が容易である等の利点がある。 As is clear from the above description, according to the present invention, the temperature sensor, fixed resistor, etc. are connected to the electric circuit on the flexible board, so it is easy to connect the temperature sensor, fixed resistor, etc.
In addition, the overlay film at the end of the flexible substrate is opened to expose the electric circuit on the overlay film, and the base film and the electric circuit on the base film are connected by sandwiching them with metal connector terminals. This has advantages such as ease of work when replacing the temperature sensor.
第１図は、従来の温度センサの一例を示す全体
構成図、第２図は、第１図に示した従来の温度セ
ンサを使用した温度制御装置の一例を示す図、第
３図は、本考案による温度センサの一実施例を示
す平面図、第４図は、第３図のオーバフイルムと
ベースフイルムの間隔を誇張して示す概念的斜視
図、第５図は、フレキシブル基板の接続部平面
図、第６図は、本考案による温度センサを配設し
た時の概略全体構成図である。
１……感温素子、５……抵抗器、１０……ヒー
タ、１１……ヒートローラ、１２……加圧ロー
ラ、１３……温度制御部、２０……ベースフイル
ム、２１……電気回路、２２……オーバレイフイ
ルム、２３……開口部、３０……コネクタ。
FIG. 1 is an overall configuration diagram showing an example of a conventional temperature sensor, FIG. 2 is a diagram showing an example of a temperature control device using the conventional temperature sensor shown in FIG. FIG. 4 is a conceptual perspective view showing an exaggerated distance between the over film and the base film in FIG. 3; FIG. 5 is a plan view of the connecting portion of the flexible substrate; FIG. 6 is a schematic overall configuration diagram when the temperature sensor according to the present invention is installed. DESCRIPTION OF SYMBOLS 1... Temperature sensing element, 5... Resistor, 10... Heater, 11... Heat roller, 12... Pressure roller, 13... Temperature control section, 20... Base film, 21... Electric circuit, 22...overlay film, 23...opening, 30...connector.
Claims (1)
路には、感熱素子及び固定抵抗体が接続され、前
記ベースフイルムをオーバレイフイルムで覆つた
オーバレイ付のフレキシブル基板であつて、該フ
レキシブル基板は前記オーバレイフイルムの一部
を開口し、該開口を通して前記ベースフイルム上
の電気回路を露出し、該露出部分において前記フ
レキシブル基板上に設けられた電気回路に温度セ
ンサが接続されるとともに、前記オーバレイフイ
ルムの端面の一部を開口して前記ベースフイルム
上の電気回路を露出し、該露出部分を機体本体に
取り付けられたコネクタに接続するようにしたこ
とを特徴とする温度センサ。 A flexible substrate with an overlay, which has an electric circuit on a base film, a heat sensitive element and a fixed resistor are connected to the electric circuit, and covers the base film with an overlay film. A part of the film is opened, an electrical circuit on the base film is exposed through the opening, and a temperature sensor is connected to the electrical circuit provided on the flexible substrate in the exposed part, and the end surface of the overlay film is connected to the electrical circuit provided on the flexible substrate. A temperature sensor characterized in that a part of the base film is opened to expose an electric circuit on the base film, and the exposed part is connected to a connector attached to a main body of the aircraft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981052830U JPS6222819Y2 (en) | 1981-04-13 | 1981-04-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981052830U JPS6222819Y2 (en) | 1981-04-13 | 1981-04-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57166138U JPS57166138U (en) | 1982-10-20 |
| JPS6222819Y2 true JPS6222819Y2 (en) | 1987-06-10 |
Family
ID=29849495
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981052830U Expired JPS6222819Y2 (en) | 1981-04-13 | 1981-04-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6222819Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0652200B2 (en) * | 1985-05-31 | 1994-07-06 | オムロン株式会社 | Electronic thermometer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5677731A (en) * | 1979-11-30 | 1981-06-26 | Ishizuka Denshi Kk | Production of temperature sensor |
-
1981
- 1981-04-13 JP JP1981052830U patent/JPS6222819Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5677731A (en) * | 1979-11-30 | 1981-06-26 | Ishizuka Denshi Kk | Production of temperature sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57166138U (en) | 1982-10-20 |
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