JPS62227051A - Terminal and connector made of cu alloy - Google Patents
Terminal and connector made of cu alloyInfo
- Publication number
- JPS62227051A JPS62227051A JP6843786A JP6843786A JPS62227051A JP S62227051 A JPS62227051 A JP S62227051A JP 6843786 A JP6843786 A JP 6843786A JP 6843786 A JP6843786 A JP 6843786A JP S62227051 A JPS62227051 A JP S62227051A
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- terminal
- terminals
- connectors
- high strength
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 230000010485 coping Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 230000001771 impaired effect Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、高強度を有し、かつ導電性および熱クリー
プ特性のすぐれたＣｕ合合金製端子上びコネクタに関す
るものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a terminal top and connector made of a Cu alloy that has high strength and excellent conductivity and thermal creep properties.
一般に、端子やコネクタの製造に、重量％で（Ｌ／Ｊ、
下％は重量％を示す）。In general, in the manufacture of terminals and connectors, the weight percentage (L/J,
(The lower % indicates weight %).
Ｓｎ：１．５〜９％、
Ｐ：０．０３〜０．３５％、
を含有し、残りがＣｕと不可避不純物からなる組成を有
するＣｕ合金が用いられている。A Cu alloy is used which has a composition containing Sn: 1.5 to 9%, P: 0.03 to 0.35%, and the remainder consisting of Cu and inevitable impurities.
しかし、上記の従来Ｃｕ合金製端子およびコネクタは、
高強度をもつものの、導電性および熱クリープ特性が十
分でないためｔ：、これを小型１ヒあるいは形状複雑１
ヒした場合、十分その機能？発揮し得ないのが現状であ
る。However, the conventional Cu alloy terminals and connectors mentioned above are
Although it has high strength, its conductivity and thermal creep properties are insufficient.
If it does, is it functional enough? The current situation is that it is not possible to do so.
そこで、本発明者等は、上述のような観点から。 Therefore, the inventors of the present invention, from the above-mentioned viewpoint.
すぐれた導電性と熱クリープ特性を具備し之端子および
コネクタを開発すべく研究を行なった結果、端子および
コネクタを、
Ｍｇ：０．３〜２％、
Ｐ：０．０Ｏ１〜０．１％、
を含有し、残りがＣｕと不可避不純物からなる組成を有
するＣｕ合金で構成すると、この結果の端子およびコネ
クタは、高強四を有し、かつすぐれた導電性と熱クリー
プ特性を具備するようになることから、小型化および形
状複雑化に十分対応でき。As a result of research to develop terminals and connectors with excellent conductivity and thermal creep properties, the terminals and connectors were made using Mg: 0.3-2%, P: 0.0O1-0.1%, The resulting terminals and connectors have high strength and excellent conductivity and thermal creep properties. Therefore, it can fully cope with miniaturization and complicated shapes.
すぐれた性能を発揮するようになるという知見を得たの
である。They obtained knowledge that it would exhibit superior performance.
この発明は、上記知見にもとづいてなされｔものであっ
て、以下に成分組成を上記の通りに限定した理由な説明
する。This invention was made based on the above findings, and the reasons for limiting the component composition as described above will be explained below.
（ａｌ Ｍｇ
Ｍｇ［ｌｉＥ分には、Ｃｕの素地に固溶することによっ
て、主要成分であるＣｕ自体の具備する高導電性を損な
うことなく、強度と熱クリープ特性を向上させる作用が
あるが、その含有量が０．３％未満では前記作用に所望
の効果が得られず、一方その含有量が２％？越えると、
導電性が損なわれるようになることから、その含有量を
０．３〜２％と定めた。(Al Mg Mg [liE component has the effect of improving strength and thermal creep properties by being dissolved in the Cu matrix without impairing the high conductivity of Cu itself, which is the main component. If the content is less than 0.3%, the desired effect cannot be obtained, while if the content exceeds 2%,
Since conductivity is impaired, its content is set at 0.3 to 2%.
（ｂ） Ｐ
Ｐ ＧＷ分には、脱酸作用があるほか、Ｍｇ５Ｍ分と共
存した状態で、強度および熱クリープ特性を向上させる
作用があるが、その含有量がｏ、ｏｏｉ％未満では前記
作用（：所望の効果が得られず、一方その含有量が０．
１％を越えると、脆化傾向が現われるようになることか
ら、その含有量に０．００１〜０．１％と定めた。(b) In addition to having a deoxidizing effect, the P P GW component also has the effect of improving strength and thermal creep properties when coexisting with the Mg5M component, but if its content is less than o, ooi%, the above effects will be impaired. (: The desired effect was not obtained, and on the other hand, the content was 0.
If it exceeds 1%, a tendency towards embrittlement appears, so the content was set at 0.001 to 0.1%.
つぎに、この発明の端子およびコネクタを実施例により
具体的に説明する。Next, the terminal and connector of the present invention will be specifically explained using examples.
通常の低周波溝型誘導炉を用い、それぞれ第１表に示さ
れるＣｕ合金溶湯を調製し、半連続鋳造法にて、厚さ：
１５０層Ｘ幅：４００朋×長さ：１５００ｍの寸法をも
つｔ鋳塊に鋳造した後、この鋳塊に、７１０〜８００℃
の範囲内の所定の王延開始温変じて熱間圧延を旋して厚
さ：１１ｍｍの熱延板とし、ついで水冷後、前記熱延板
の上下両面？＜０．５ｗｍづつ面側して厚さ：１０＋ｍ
ｎとした状態で、通常の条件にて冷間圧延と焼鈍とを交
互に繰り返し行ない、最終仕上圧延率＝７５％（二て厚
さ：０．２５膿の冷延板とし、最終的に２５０〜４００
℃の範囲内の所定の温間に３０分間保持の条件で歪取り
焼鈍を施すことによって本発明端子・コネクタ素材１〜
５および従来端子・コネクタ素材１゜２をそれぞれ製潰
した。Molten Cu alloys shown in Table 1 were prepared using an ordinary low-frequency groove induction furnace, and casted by a semi-continuous casting method to a thickness of:
After casting into a T ingot with dimensions of 150 layers x width: 400 m x length: 1500 m, this ingot was heated to 710 to 800°C.
A hot-rolled sheet with a thickness of 11 mm is obtained by hot rolling at a predetermined rolling start temperature within the range of <0.5wm each side side thickness: 10+m
n, cold rolling and annealing were repeated alternately under normal conditions to produce a cold rolled plate with a final finish rolling rate of 75% (thickness: 0.25mm), and finally a cold rolled plate with a thickness of 250%. ~400
The terminal/connector materials 1-
5 and conventional terminal/connector material 1°2 were crushed.
ついで、この結果得られた本発明端子・コネクタ素材１
〜５および従来端子・コネクタ１．２について、強（９
）を評価する目的で、引張強さとばね限界値を測定し、
また導電性を評価する目的で、導電率（ＩＡＣ８％）を
測定し、さらＬ：熱クリープ特性を評価する目的で、応
力付加加熱後の応力緩和率を測定した。Next, the terminal/connector material 1 of the present invention obtained as a result
~5 and conventional terminal/connector 1.2, strong (9
), the tensile strength and spring limit value were measured,
Further, for the purpose of evaluating the conductivity, the conductivity (IAC 8%) was measured, and furthermore, for the purpose of evaluating the thermal creep property, the stress relaxation rate after stress application heating was measured.
なお、ばね限界値は、Ｊ Ｉ Ｓ −Ｈ３１３０のモー
メント式試験により測定し、また応力緩和率は、幅：１
２．７ｍｍＸ長さ：１２０ｍｍ（ｌ］下ＬＯとする）の
寸法をもった試験片を使用し、この試験片を長さ：１１
０ｍｍＸ深さ：３咽の水平縦長溝を有する治具に前記試
験片の中央部が上方に膨出するように彎曲セットしくこ
の時の試験片の両端部間の距離：１１０ｍｍをＬｌとす
る）、この状態で温変：１５０°Ｃに１０００時間保持
し、加熱ｊ玲、前記治具から取りはずした状態における
前記試験片の両端部間の距離（ｌ、Ｊ、下Ｌ２とする）
？測定し、計算式−（Ｌ（、−Ｌ２ ）／（Ｌ□ −Ｌ
、 ）ｘｌＯＯ（％）によって算出することにより求め
た。この結果を第１表１＝示した。In addition, the spring limit value is measured by the moment type test of JIS-H3130, and the stress relaxation rate is determined by width: 1.
Use a test piece with dimensions of 2.7 mm x length: 120 mm (l) (lower LO), and convert this test piece to length: 11 mm.
0 mm x Depth: Set the test piece in a jig having horizontal longitudinal grooves with 3 sides in a curved manner so that the center part bulges upwards. At this time, the distance between both ends of the test piece: 110 mm is set as Ll) , Temperature change in this state: Hold at 150°C for 1000 hours, heat, Distance between both ends of the test piece in the state removed from the jig (l, J, lower L2)
? Measure and calculate using the formula -(L(, -L2)/(L□ -L
, )xlOO(%). The results are shown in Table 1.
第１表に示される結果から、本発明端子・コネクタ素材
１〜５は、いずれも従来端子・コネクタ素材１，２と同
等の高強変を保持した状態で、これより一段とすぐれた
導電性および熱クリープ特性？もつことが明らかである
。From the results shown in Table 1, it can be seen that the terminal/connector materials 1 to 5 of the present invention all maintain the same high strength as the conventional terminal/connector materials 1 and 2, but have much better conductivity and heat resistance. Creep characteristics? It is clear that
上述のように、この発明の端子およびコネクタは、高強
Ｉを有し、かつすぐれｔ導電性と熱クリープ特性を具備
したＣｕ合金で構成されているので、これらの小型化お
よび形状複雑化に十分対応することができ、十分満足す
る性能を発揮するばかりでなく、高価なＳｎ成分を含有
しないＣｕ合位で構成されているので、比較的コストの
安いものとなるなど工業上有用な特性？有するのである
。As mentioned above, the terminals and connectors of the present invention are made of a Cu alloy that has high strength I and excellent conductivity and thermal creep characteristics, so they are suitable for miniaturization and complicated shapes. Not only does it exhibit satisfactory performance, but it also has industrially useful properties such as being relatively inexpensive as it is composed of Cu bonds that do not contain the expensive Sn component. We have it.
Claims (1)
上重量％）を有するＣｕ合金で構成されたことを特徴と
する高強度を有し、かつ導電性および熱クリープ特性の
すぐれたＣｕ合金製端子およびコネクタ。[Claims] Consisting of a Cu alloy containing Mg: 0.3 to 2%, P: 0.001 to 0.1%, and the remainder consisting of Cu and unavoidable impurities (the above weight %) Terminals and connectors made of Cu alloy, which have high strength and excellent conductivity and thermal creep properties.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6843786A JPS62227051A (en) | 1986-03-28 | 1986-03-28 | Terminal and connector made of cu alloy |
| DE19863628783 DE3628783A1 (en) | 1986-03-28 | 1986-08-25 | Electrical connector made of a copper alloy and method of fabricating it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6843786A JPS62227051A (en) | 1986-03-28 | 1986-03-28 | Terminal and connector made of cu alloy |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1085326A Division JPH0690887B2 (en) | 1989-04-04 | 1989-04-04 | Cu alloy terminal for electrical equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62227051A true JPS62227051A (en) | 1987-10-06 |
| JPH0154420B2 JPH0154420B2 (en) | 1989-11-17 |
Family
ID=13373682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6843786A Granted JPS62227051A (en) | 1986-03-28 | 1986-03-28 | Terminal and connector made of cu alloy |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS62227051A (en) |
| DE (1) | DE3628783A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6452034A (en) * | 1987-08-19 | 1989-02-28 | Mitsubishi Electric Corp | Copper alloy for terminal and connector |
| JPH05247564A (en) * | 1991-07-11 | 1993-09-24 | Mitsubishi Shindoh Co Ltd | Switch material made of cu alloy for electric apparatus |
| WO2011104982A1 (en) * | 2010-02-24 | 2011-09-01 | 三菱伸銅株式会社 | Cu-mg-p-based copper alloy bar and method for producing same |
| WO2011142428A1 (en) | 2010-05-14 | 2011-11-17 | 三菱マテリアル株式会社 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT385932B (en) * | 1985-12-13 | 1988-06-10 | Neumayer Karl | BAND OR WIRE SHAPED MATERIAL |
| JPH0776397B2 (en) * | 1989-07-25 | 1995-08-16 | 三菱伸銅株式会社 | Cu alloy electrical equipment connector |
| EP0660444B1 (en) * | 1993-12-22 | 1998-10-21 | CMC Carl Maier + Cie AG | Low voltage distributor |
| US5525070A (en) * | 1994-04-15 | 1996-06-11 | Panduit Corp. | Positive lock insulated disconnect |
| DE10139953A1 (en) | 2001-08-21 | 2003-03-27 | Stolberger Metallwerke Gmbh | Material for a metal band |
| GB0218138D0 (en) * | 2002-08-05 | 2002-09-11 | Strix Ltd | Electrical terminals |
| EP3009523B1 (en) | 2010-05-14 | 2018-08-29 | Mitsubishi Materials Corporation | Copper alloy for electronic device, method for producing it, and rolled material from it |
| JP5903832B2 (en) * | 2011-10-28 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and electronic equipment parts |
| JP5903838B2 (en) | 2011-11-07 | 2016-04-13 | 三菱マテリアル株式会社 | Copper alloy for electronic equipment, copper material for electronic equipment, copper alloy manufacturing method for electronic equipment, copper alloy plastic working material for electronic equipment, and electronic equipment parts |
-
1986
- 1986-03-28 JP JP6843786A patent/JPS62227051A/en active Granted
- 1986-08-25 DE DE19863628783 patent/DE3628783A1/en active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6452034A (en) * | 1987-08-19 | 1989-02-28 | Mitsubishi Electric Corp | Copper alloy for terminal and connector |
| JPH05247564A (en) * | 1991-07-11 | 1993-09-24 | Mitsubishi Shindoh Co Ltd | Switch material made of cu alloy for electric apparatus |
| WO2011104982A1 (en) * | 2010-02-24 | 2011-09-01 | 三菱伸銅株式会社 | Cu-mg-p-based copper alloy bar and method for producing same |
| WO2011142428A1 (en) | 2010-05-14 | 2011-11-17 | 三菱マテリアル株式会社 | Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device |
| US10458003B2 (en) | 2011-11-14 | 2019-10-29 | Mitsubishi Materials Corporation | Copper alloy and copper alloy forming material |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3628783C2 (en) | 1988-04-14 |
| JPH0154420B2 (en) | 1989-11-17 |
| DE3628783A1 (en) | 1987-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |