JPS62226646A - Heat sink - Google Patents
Heat sinkInfo
- Publication number
- JPS62226646A JPS62226646A JP7013586A JP7013586A JPS62226646A JP S62226646 A JPS62226646 A JP S62226646A JP 7013586 A JP7013586 A JP 7013586A JP 7013586 A JP7013586 A JP 7013586A JP S62226646 A JPS62226646 A JP S62226646A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- heat sink
- temperature
- temperature sensor
- transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims description 4
- 238000003780 insertion Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000009529 body temperature measurement Methods 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はヒートシンク、特にトランジスタなどの電子部
品が発生する熱を放散するヒートシンクに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a heat sink, and particularly to a heat sink for dissipating heat generated by electronic components such as transistors.
電源装置、特にＤＣ−ＤＣコンバータなどに使用される
大容量のトランジスタやダイオードは発熱が大きいので
、一般にヒートシンクと共に実装して放熱している。通
常の使用においてはこのような電子部品の温度を測定す
る必要はほとんどないが、新規設計時の実験や輸出製品
の検作時には上記の温度を測定しなければならないこと
がある。特にアメリカ向は輸出製品ではＵＬ規格（民生
用電子機器の安全規格）の認定検査によって発熱体の温
度を実測する必要がある。Since large-capacity transistors and diodes used in power supplies, particularly DC-DC converters, generate a large amount of heat, they are generally mounted with a heat sink to dissipate heat. In normal use, there is almost no need to measure the temperature of such electronic components, but it may be necessary to measure the above-mentioned temperatures during experiments in new designs or inspections of export products. In particular, for products exported to the United States, it is necessary to actually measure the temperature of the heating element through a UL standard (safety standard for consumer electronic equipment) certification inspection.
従来、上記のような温度の測定においては発熱体に温度
センサを粘着テープなどによって取付けたり、発熱体と
ヒートシンクの間に温度センサを挾み込むようにして取
付けている。したがって前者の場合には温度センナの取
付状態を外部から目視できないので、温度センサが離れ
たりズしたすしていてもそれを知ることが難かしい。ま
た後者の場合には温度センサの先端を傷付ける危険がる
り、さらに発熱体とヒートシンクとの接触が不完全とな
るので熱抵抗が増大し通常使用時の温度を４川定できな
い。Conventionally, in the above-mentioned temperature measurement, a temperature sensor is attached to a heating element using an adhesive tape or the like, or the temperature sensor is installed by being sandwiched between the heating element and a heat sink. Therefore, in the former case, the installation state of the temperature sensor cannot be visually observed from the outside, so it is difficult to know if the temperature sensor has been separated or dropped. In the latter case, there is a risk of damaging the tip of the temperature sensor, and furthermore, contact between the heating element and the heat sink becomes incomplete, increasing thermal resistance and making it impossible to determine the temperature during normal use.
さらに上記のような欠点のほかに温度センナを取付ける
ために多大な工数および時間を要すると云う欠点もある
。Furthermore, in addition to the above-mentioned drawbacks, there is also the drawback that a large amount of man-hours and time are required to install the temperature sensor.
本発明が解決しようとする問題点、換言すれば本発明の
目的は温度の測定箇所に温度センナを正しく近接して保
持するようにして上記の欠点を改善したヒートシンクを
提供することにある。The problem to be solved by the present invention, or in other words, the object of the present invention is to provide a heat sink that improves the above-mentioned drawbacks by holding a temperature sensor properly close to a temperature measurement point.
本発明のヒートシンクは、トランジスタなどの発熱体が
発生する熱を放散するヒートシンクにおいて、前記発熱
体を前記ヒートシンクに取付けたとき、前記発熱体の放
熱面に温度センサの感温部を近接させる挿入路を有して
構成される。The heat sink of the present invention is a heat sink that dissipates heat generated by a heat generating element such as a transistor, and an insertion path that brings a temperature sensing part of a temperature sensor close to a heat radiation surface of the heat generating element when the heat generating element is attached to the heat sink. It is composed of
以下、本発明によるヒートシンクについて図面を参照し
ながら説明する。Hereinafter, a heat sink according to the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す側面図である。FIG. 1 is a side view showing an embodiment of the present invention.
同図においてヒートシンク１はトランジスタ２を取付ネ
ジ３によって取付けている。このときトランジスタ２の
放熱面はヒートシンクの取付面１ｂＫ密接している。な
おトランジスタ２は端子２ａを有し、これを介して他の
電子部品に接続される。In the figure, a heat sink 1 has a transistor 2 attached thereto with attachment screws 3. As shown in FIG. At this time, the heat radiation surface of the transistor 2 is in close contact with the mounting surface 1bK of the heat sink. Note that the transistor 2 has a terminal 2a through which it is connected to other electronic components.
ヒートシンクｌはトランジスタ２を取付る取付面１ｂと
放熱フィンのある裏面との間に貫通孔１ａを有している
。貫通孔１ａはトランジスタ２の温度を測定する箇所に
穿孔してめる。The heat sink 1 has a through hole 1a between a mounting surface 1b on which the transistor 2 is mounted and a back surface on which a radiation fin is provided. The through hole 1a is bored at a location where the temperature of the transistor 2 is to be measured.
上記の温度を測定するときには貫通孔１ａにシリコング
リースなどの熱伝導性コンパウンド（図示していない−
を充填して温度センナ（図示していないゆの感温部を挿
入する。したがって温度センサの感温部はトランジスタ
２の測温箇所に近接して保持できる。When measuring the above temperature, apply a thermally conductive compound (not shown) such as silicone grease to the through hole 1a.
The temperature sensing portion of the temperature sensor (not shown) is inserted. Therefore, the temperature sensing portion of the temperature sensor can be held close to the temperature measuring point of the transistor 2.
なお貫通孔１ａの直径は２〜３閣であるので、貫通孔１
ａによるヒートシンク１の熱抵抗の変化はほとんど無視
できる。さらに熱伝導性コンパウンドを充填するので、
貫通孔１ａによってヒートシンク１の放熱効果はほとん
ど悪化しない。Note that the diameter of the through hole 1a is 2 to 3 mm, so the through hole 1a
The change in thermal resistance of the heat sink 1 due to a can be almost ignored. Furthermore, it is filled with a thermally conductive compound, so
The heat dissipation effect of the heat sink 1 is hardly deteriorated by the through hole 1a.
また上記の実施例では取付面１ｂからその裏面に達する
貫通孔を設けることによって温度を測定するが、トラン
ジスタ２を取付けたときに温度センサを挿入できる溝を
取付面１ｂの表面に設けることによっても上記と同様に
安定して温度を測定することができる。このように本発
明はトランジスタなどの発熱体の形状や実？、条件によ
って称々の態様を有している。Further, in the above embodiment, the temperature is measured by providing a through hole reaching from the mounting surface 1b to the back surface thereof, but it is also possible to measure the temperature by providing a groove in the surface of the mounting surface 1b into which a temperature sensor can be inserted when the transistor 2 is mounted. Temperature can be measured stably in the same way as above. In this way, the present invention can be applied to the shape and actuality of heating elements such as transistors. , has various aspects depending on the conditions.
以上、詳細に説明したように本発明のヒートシンクによ
れば温度センサを挿入する挿入路を備えているので、発
熱体の測温箇所に温度センナの感温部を容易に近接させ
て温度を４１１１定できるという効果がある。As described above in detail, the heat sink of the present invention is provided with the insertion path for inserting the temperature sensor, so that the temperature sensing part of the temperature sensor can be easily brought close to the temperature measurement location of the heating element to measure the temperature at 4111. This has the effect of being able to determine
まだ上記のように温度センサを容易に挿入して保持でき
るので、安定１７て温度を測定できると共に、測定の準
備のために従来のように工数および時間を要しないとい
う効果もある。Since the temperature sensor can be easily inserted and held as described above, the temperature can be measured stably, and there is also the advantage that the preparation for measurement does not require the man-hours and time required in the past.
第１図は本発明によるヒートシンクの一実施例を示す（
ｌ！１１面図である。
１・・・・・・ヒートシンク、１ａ・・・・・・貫通孔
、１ｂ・・・・・・取付面、２・・・・・・トランジス
タ。FIG. 1 shows an embodiment of the heat sink according to the present invention (
l! It is an 11th view. 1...Heat sink, 1a...Through hole, 1b...Mounting surface, 2...Transistor.
Claims (1)
トシンクにおいて、 前記発熱体を前記ヒートシンクに取付けたとき、前記発
熱体の放熱面に温度センサの感温部を近接させる挿入路
を有することを特徴とするヒートシンク。[Claims] In a heat sink that dissipates heat generated by a heat generating element such as a transistor, an insertion path that brings a temperature sensing part of a temperature sensor close to a heat radiation surface of the heat generating element when the heat generating element is attached to the heat sink. A heat sink characterized by having.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013586A JPS62226646A (en) | 1986-03-27 | 1986-03-27 | Heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7013586A JPS62226646A (en) | 1986-03-27 | 1986-03-27 | Heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62226646A true JPS62226646A (en) | 1987-10-05 |
Family
ID=13422818
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7013586A Pending JPS62226646A (en) | 1986-03-27 | 1986-03-27 | Heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62226646A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002658A (en) * | 2011-09-09 | 2013-03-27 | 索尼公司 | Circuit board |
-
1986
- 1986-03-27 JP JP7013586A patent/JPS62226646A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103002658A (en) * | 2011-09-09 | 2013-03-27 | 索尼公司 | Circuit board |
| JP2013058663A (en) * | 2011-09-09 | 2013-03-28 | Sony Corp | Circuit board |
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