JPS62208646A - Transfer device for semiconductor wafer - Google Patents

Abstract

PURPOSE:To shorten the transfer time for semiconductor wafer by a method wherein transfer mechanisms; each consisting of a guide rail, a swinging arm and a slider; are provided two groups as one for the transfer of one sheet of a semiconductor wafer and one for the transfer of plural sheets of semiconductor wafers respectively. CONSTITUTION:A transfer mechanism for one sheet of a semiconductor wafer and a transfer mechanism for the total number of sheets of semiconductor wafers being housed in a cassette are arranged in parallel and the wafers are so contrived as to be transferred moving either of the cassette or a boat to the transfer mechanism according to conditions for transferring these wafers. When the semiconductor wafers are transferred one sheet by one sheet, they are transferred by a combination of a swinging arm 5, a slider 8 and a guide rail 4 in the transfer mechanism for one sheet of a semiconductor wafer and when the total number of the semiconductor wafers in the cassette are transferred, they are transferred by a combination of a swinging arm 15, a slider 18 and a guide rail 13 of the transfer mechanism for plural sheets of semiconductor wafers.

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention is applicable to an expanded IB in the manufacturing process of semiconductor wafers.
(l! This relates to a semiconductor wafer sifting device that transfers semiconductor wafers used in a furnace from a cassette to a heat treatment boat or vice versa.

(Prior Art) For example, a front cross section of a conventional semiconductor wafer rediagnosis device, which was filed by the present applicant on April 21, 1980 and disclosed in Japanese Patent Application Laid-open No. 182846/1983, is Figure 4
5, and a side sectional view taken along the line A--A in the direction of the arrow is shown in FIG.

In the figure, (1) is a semiconductor wafer, (2) is a cassette that stores a plurality of semiconductor wafers (1), (3) is a boat that holds each semiconductor wafer (1) upright, and (4) is a cassette that stores a plurality of semiconductor wafers (1). The guide rail is arranged so that the semiconductor wafer (1) can roll between the cassette (2) and ports 1 to (3), and is composed of an upper rail (4a) and a lower rail (4b). (5) is a swinging arm that pushes the semiconductor wafer (1) from the bottom width of the cassette (2) to the guide rail (4), (6) is a drive device for this swinging arm (5), and (7
1) is a V-groove roller provided at the tip of the swing arm (5). (72) is shown in detail in Figure 5,
This is a V-groove roller provided at the tip of the slider (8). Here, the slider (81i; I semiconductor wafer (1) is mounted on the chevron top of the rail (4), ], Ill, f
It is designed to hold a device lever exceeding 121. (9) is the drive of slider (8)! IIJI device, (
The direction is ■ ball bearing installed i-1 on the shaft part (11) of the grooved roller (72),
This is an axis plan that ranks 1 and 1. In addition, the V-groove roller (
The method of taking (=j) is based on [this, l].

Next, the following operations will be explained. Place the semiconductor wafer (1) held in the cassette (2) into the port 1- (3
), first the semiconductor wafer (1) is pushed out from the bottom 121) of the cassette I-(2) toward the rail (4) to the guy I by the urging of the swinging arm (5). On the other hand, the semiconductor wafer (L)
) of ((1 type 10 part @ 11.1112) 8) movement (thus supporting the semiconductor wafer (1) and placing it on the port 1-(3);

Contrary to the above operation, from the boat (3) to the cassette l-(2)
)・＼When transferring a heat-treated semiconductor wafer (1), transfer the semiconductor wafer (1) to port 1 using the CJ and switch (8).
- Push out from (3) to the guide rail (4), and 111 type m section 141), 142) of this guide rail (4)
After passing the guide rail (4), the semiconductor wafer (1)
is rolled and stored in cassette l-(2).

(Problem to be solved by the invention) Since the conventional semiconductor wafer transfer device is configured as described above, it is necessary to transfer the cassette (2) to the boat (3) which has the pitch of the cassette (2) and the pitch of the cassette (3). When transferring semiconductor wafers (1), the cassette l-(
2) All the semiconductor wafers (1) in the cassette 1-
When transferring the semiconductor wafers (1) to the port 1-(3) at the same pitch as the pitch (2), there was a problem that it was not efficient to transfer the semiconductor wafers (1) one by one.

In order to solve the above-mentioned problems, this invention provides 1 (
(4) A conventional transfer machine 4111i (8) for transferring semiconductor wafers (1) one by one.
It is equipped with a transfer mechanism (B) that can transfer all 11 wafers housed in cassette h (2) between cassette h (2) and port 1- (3j), and transfers the wafers. Transfer mechanism (A) or (B) depending on the transfer conditions
The purpose of the present invention is to provide a device that can shorten the transfer time by selecting one of the following methods for transfer.

(Means for Solving the Problems) A semiconductor wafer transfer device according to the present invention includes a transfer/heating mechanism (A) for one semiconductor wafer having the same function as the conventional one, and a semiconductor wafer transfer mechanism (A) for transferring a single semiconductor wafer in a cassette. Arrange the transfer mechanism (R) for all the stored number of sheets in parallel, and transfer them by moving the boat to one of the transfer mechanisms according to the transfer conditions. This is what I did. Note that the transfer mechanism CB) and the rewiring mechanism (A) have almost the same functions, and their structures differ only slightly depending on the number of semiconductor wafers handled.

(Operation) According to the present invention, when the pitch is different between the cassette and the boat (for example, semiconductor wafers are arranged at double pitch from the cassette to the port 1-1-), the single-wafer transfer mechanism ( A), and when transferring between the cassette and the boat at the same pitch, use the transfer mechanism (tl). It becomes possible.

(Embodiment of the invention) An embodiment of the invention will be described below with reference to the drawings.
The figure is an exploded perspective view showing the transfer mechanism according to the present invention, and Figures 2 and 3 are sectional views of main parts of Figure 'f51, (1)
(1) is the same or corresponding part to the same reference numerals in FIGS. 4 and 5 of the conventional example. A is the part of the multiple sheet transfer mechanism (B)] - rail, (13a) is the upper rail, (
+3b) is the lower rail, (14) is the single sheet transfer mechanism (
8) At the tip of the swinging arm (5), (vl girder ■ groove roller case, (Iω is the multiple sheet centering mechanism < B) swinging arm, (direction is at the end of the swinging arm (15) Tori (=1
■Groove roller case of multi-digit transfer mechanism (B), (
17) is a semiconductor wafer support attached to the tip of the slider (8) of the single wafer transfer mechanism (A), (1st) is the slider of the multiple wafer transfer mechanism (8), and α9) is the slider (
This is the semiconductor wafer support of the multiple wafer transfer mechanism (B) attached to the tip of the semiconductor wafer transfer mechanism (B). In addition, omitted from the figure,
Swinging arm (15) of Nsim Q sheet transfer mechanism (B)
The driving device for the slurry (18) is the same as the one-sheet changing mechanism (to) σ).

Wari is V course (]-Race (+4), (16) and wafer support (17) i punishment [Person 1 is sore V7 Tom roller (71), (72) is restrained in the direction of offer It is a washer.

Ill be configured as follows: Also, in one embodiment of this invention-
) The operation will be explained below. First, the semiconductor wafers (1) are transferred one by one (17), and the change is carried out in the same way as in the conventional example (transfer).
), S→Ita (8) and guide rail (4) combination t! ((You can increase the number by 1.1. Also, the cassette l-(2
) When transferring all the semiconductors in Noeva (1), use multiple sheets (more E) of the λ mechanism (B). - Le (Transfer 19 combinations.

In the case of Chair Jl, the operation is the same as that of the conventional example.

(Effect of Illumination) As described below-1, according to the present invention, I] can be transferred to a semiconductor wafer σ). (Because we have a single-wafer and multiple-wafer loading mechanism, we can always transfer semiconductor wafers in the shortest possible time when arranging them on various semiconductor wafers on the boat.) There are some effects that can be done.

4 Simplified drawings jl-f, (Explanation) Fig. 1 is an exploded perspective view showing the configuration of a semiconductor wafer transfer device showing an embodiment of the present invention, Figs. 2 and 3 are sectional views of the main parts thereof, FIG. 4 is a front view showing the configuration of a conventional semiconductor wafer transfer device, and FIG. 5 is a side sectional view taken along line A--A.

In the figure, (1) is a semiconductor wafer, (2) is a cassette I, (
3) is Poe 1-1 (4) ll smell (J Kai[・Rail, (
5), (15) are swing arms, (71), (72
) Green roller, (8), (I [l) is slider, (14), (+6) is V-groove roller case, (+7
+, +19) is a wafer support.

Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

[Claims] (1) A guide rail for semiconductor wafers is disposed between the cassette and the boat, and a swinging arm that rolls the semiconductor wafer from the cassette to the boat via the guide rail; In a semiconductor wafer transfer device equipped with a slider that supports this semiconductor wafer and guides it onto the boat, each transfer mechanism consisting of the guide rail, swing arm, and slider is used to transfer one semiconductor wafer. A semiconductor wafer transfer device comprising two sets: one for changing and one for transferring multiple wafers.